The invention discloses a method for growing an epitaxial
wafer of a GaN-based
light emitting diode, and belongs to the field of a
light emitting diode. The method comprises successively growing a buffer layer, an N-type layer, a multi-
quantum well layer and a P-type layer on a substrate, wherein the P-type layer is grown by use of a high-pressure low-speed growth mode, the
growth pressure of the P-type layer is 400
torr to 760
torr, the flow of TMGa is lower than 90sccm, the flow of TEGa is lower than 2000sccm, and the thickness of the P-type layer is 10nm to 60nm. According to the invention, through adoption of high-pressure low-speed growth, the
crystal quality is quite good, the defect density caused by
crystal lattice mismatch is substantially reduced, electric leakage channels between the NP
layers are reduced, the current expansion capability of the NP
layers is better, breakdown points are reduced, the antistatic capability of the epitaxial
wafer is enhanced, requirements are met simply by growing a quite thin P-type layer, the light absorption amount of the P-type layer with a quite small thickness is smaller, and the light emitting amount of the front surface of a
chip and the light emitting efficiency of a device are guaranteed.