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70 results about "Breakdown point" patented technology

Definition: Breakdown Point. The breakdown point is a measure of testing the robustness of a statistical procedure. There are two breakdown points: finite sample breakdown point, asymptotic breakdown point. A finite sample breakdown point is that fraction of the data that can be given arbitrary values without making the estimator go bad.

PMOS device with drain junction breakdown point located for reduced drain breakdown voltage walk-in and method for designing and manufacturing such device

A PMOS device can be designed and manufactured in accordance with the invention to locate its drain junction breakdown point and maximum impact ionization point to reduce or eliminate drain breakdown voltage walk-in. In some embodiments, the drain junction breakdown point and maximum impact ionization point are located sufficiently far from the gate that the device exhibits no significant drain breakdown voltage walk-in. The device can be a high voltage power transistor having an extended drain region including a P-type lightly doped drain (P-LDD) implant, with drain junction breakdown and maximum impact ionization points appropriately located by controlling the implant dose employed to produce the P-LDD implant. Other aspects of the invention are methods for designing a PMOS device including by determining relative locations of the gate and at least one of the drain junction breakdown and maximum impact ionization points to reduce drain breakdown voltage walk-in, and methods for manufacturing integrated circuits including any embodiment of the PMOS device of the invention.
Owner:NAT SEMICON CORP

Experiment method for monitoring cathode lithium precipitation via use of reference electrode

The invention discloses an experiment method for monitoring cathode lithium precipitation via use of a reference electrode. The method comprises the following steps: a brass wire of a certain dimension is used as a substrate and is pre-embedded in an electrical core during electrical core making processes, the electrical core is adjusted to a certain charging state after the electrical core makingprocesses are finished, the brass wire is subjected to electrochemical deposition of lithium, a uniform lithium layer of a certain thickness is obtained, and therefore the reference electrode is obtained; a three electrode battery is connected with charge-discharge equipment, a current is applied to an anode and a cathode, electric potential change of a whole battery is monitored via user of thereference electrode during battery charging and discharging processes, and accuracy is confirmed; at last whether lithium precipitation occurs in the cathode of the battery is analyzed. The beneficialeffects of the method are that the electric potential change of all electrodes in the battery can be monitored via use of the reference electrodes through an electrochemical method, and breakdown points of cathode lithium precipitation can be determined; compared with a conventional disassembling observation method, the method disclosed in the invention is advantaged by simplicity, convenience, high credibility and high practicality.
Owner:SHANXI CHANGZHENG POWER TECH CO LTD

Gate oxide failure point positioning method

The invention discloses a gate oxide failure point positioning method. after removal of a metal layer, a semiconductor structure to be measured obtained after removal of the metal layer is scanned by the use of an electron beam formed by medium and high accelerating voltage so as to obtain an electron microscope with a failure point pattern; and according to the electron microscope, the position of the failure point in a gate oxide is determined so as to more precisely position a breakdown point of the gate oxide. Furthermore, success rate of gate oxide breakdown voltage test failure analysis is raised effectively; preparation time of a follow-up transmission electron microscope sample is further shortened; efficiency of gate oxide breakdown voltage test failure analysis is raised; and necessary conditions are provided for the preparation of the transmission electron microscope sample which requires precise positioning. In addition, the breakdown point of the gate oxide and failure analysis of the gate oxide can still be positioned precisely when an optical positioning machine cannot be used.
Owner:WUHAN XINXIN SEMICON MFG CO LTD

Method for driving an asynchronous motor and pump arrangement with asynchronous motor

A method for driving an asynchronous motor operated at an adjustable three-phase frequency to a predetermined target rotational speed is disclosed. For controlling the asynchronous motor in an operating range around its breakdown point a current rotational speed of the asynchronous motor is determined at predetermined intervals and the three-phase frequency is adjusted stepwise such that the current rotational speed lies within a predetermined maximum rotational speed deviation of an updated three-phase frequency.
Owner:LINDE AG

High voltage device embedded non-volatile memory cell and fabrication method

A high voltage PMOS device having an improved breakdown voltage is achieved. An asymmetrical high voltage integrated circuit structure comprises a gate electrode on a substrate and source and drain regions within the substrate on either side and adjacent to the gate electrode wherein the source region is encompassed by an n-well. A symmetrical high voltage integrated circuit structure comprises a gate electrode on a substrate, source and drain regions within the substrate on either side and adjacent to the gate electrode, and an n-well in the substrate underlying the gate electrode. The n-well in both structures shifts the breakdown point from the silicon surface to the bottom of the source or drain regions.
Owner:TAIWAN SEMICON MFG CO LTD

Apparatus and method for short circuit defect testing

The invention provides an apparatus for short circuit testing. The apparatus comprises a first comb structure body and a second comb structure body. The first comb structure body is formed by a plurality of first short conductor wire chains that are parallel to each other. The second comb structure body is formed by a second conductor wire and a plurality of short conductor wire chains that are vertical to the second conductor wire and are parallel to each other. One ends of all the second conductor wire chains are directly connected with the second conductor wire, wherein the one ends of all the second conductor wire chains are far away from the first short conductor wire chains. And the first short conductor wire chains and the second short conductor wire chains are arranged at intervals. In addition, the invention also provides a method for short circuit defect testing. According to a technical scheme of the invention, a short circuit defect breakdown point position can be accurately localized based on a comparative analysis of passive voltages.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

High-voltage power device terminal structure

The invention belongs to semiconductor technology, and specifically relates to a high-voltage power device terminal structure. The high-voltage power device terminal structure comprises a groove in a silicon chip body and P-type protective rings, combination of the internal groove and the protective rings allows the peak value of an electric field to be transferred from the surface of the silicon chip into the body, and the breakdown points of a terminal area are transferred from the surface of the silicon chip to the two sides of a dielectric layer in the groove. Since the critical breakdown electric field (about 1e7V / cm) of the dielectric layer is far higher than a critical breakdown electric field (about 1e5V / cm) of silicone, P-type floating islands in staggered arrangement with the P-type protective rings reduce the peak values of the electric fields on the two sides of the P-type protective rings without reducing the reverse blockout voltage of a terminal area, thereby preventing premature breakdown of PN junctions in the silicon chip body.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

High voltage device embedded non-volatile memory cell and fabrication method

A high voltage PMOS device having an improved breakdown voltage is achieved. An asymmetrical high voltage integrated circuit structure comprises a gate electrode on a substrate and source and drain regions within the substrate on either side and adjacent to the gate electrode wherein the source region is encompassed by an n-well. A symmetrical high voltage integrated circuit structure comprises a gate electrode on a substrate, source and drain regions within the substrate on either side and adjacent to the gate electrode, and an n-well in the substrate underlying the gate electrode. The n-well in both structures shifts the breakdown point from the silicon surface to the bottom of the source or drain regions.
Owner:TAIWAN SEMICON MFG CO LTD

Device and method for increasing breakdown point distance of laser-induced air breakdown

The invention relates to a device and method for increasing breakdown point distance of laser-induced air breakdown. The method includes: using a beam combiner to combine a femtosecond laser pulse and a nanosecond laser pulse, regulating the time delay between the femtosecond laser pulse and the nanosecond laser pulse to allow the femtosecond laser pulse to be a certain time ahead of the nanosecond laser pulse, and using a concave reflecting mirror to focus the femtosecond laser pulse and the nanosecond laser pulse in the air to generate induced breakdown. Compared with common laser-induced breakdown, the method has the advantages that the femtosecond laser pulse is focused in advance to form preionization in the air, generated electrons lower the breakdown threshold of the nanosecond laser pulse in the air to allow the breakdown point of the induced breakdown generated by the nanosecond laser pulse to be farther than breakdown point of a traditional method, and the farther breakdown point lays a foundation for the development of remote atmospheric sounding technology, and the method is significant to the remote detection of the gas components and content in an atmospheric environment.
Owner:SHANGHAI INST OF OPTICS & FINE MECHANICS CHINESE ACAD OF SCI

Non-contact type touch screen and method for realizing mobile communication terminal by same

ActiveCN1979403AMeet the need for interactivityChange the way of touch operationInput/output for user-computer interactionGranularityContact type
The invention discloses a noncontact touch screen and a method for implementing mobile communication terminal using this screen. And the screen comprises: glass substrate, conducting layer, isolating points and photoelectric inductive layer, where the glass substrate is a transparent support layer, the conducting layer is coated on the glass substrate, and able to obtain 0-5V voltage by power supply system, the isolating points with very small granularity are regularly arranged on the conducting layer, and the photoelectric inductive layer is arranged on these isolating points. When a laser irradiates the screen, the photoelectric inductive layer on the screen is broken down to be short-circuited with the conducting layer, and here, a supporting processing software can calculate position of the current breakdown point according to the breakdown place and transmits the position to a microprocessor to make other judgments and corresponding event actions. And it changes the existing touch mode operation, makes up for interactive defect and solves the problems that mobile communication terminals with touch screens have large losses and short life.
Owner:BEIJING ZHIGU TECH SERVICE

Aluminium electrolysis bus system resistance to ground detection device and detection method thereof

The invention discloses an aluminium electrolysis bus system resistance to ground detection device and a detection method thereof. The device comprises a keyboard input device, a partial pressure filter, an amplifier, an MCU controller and an LED display; wherein all the parts are mutually electrically connected. The detection method includes 'auxiliary short circuit line method' and 'auxiliary grounding method'. The 'auxiliary short circuit line method' includes that the aluminium electrolysis cell bus system resistance to ground detection device is connected with a thick copper wire, short time short circuit to ground of the copper wire at electrolysis cell buses at different voltage classes is utilized to measure leakage current, a short circuit point is disconnected to measure the voltage to ground of the point, and equivalent resistance to ground of system is calculated according to ohm's law; and the 'auxiliary grounding method' includes that the whole series electrolysis cell support and bus piers are measured one by one, and disqualified point is found and cleaned, so as to judge and process an insulation breakdown point. The detection device and method thereof also can be applied to other occasions with strong direct current magnetic field and high distributed capacitance.
Owner:GUIZHOU BRANCH CHINA ALUMINUM IND

Method for quickly testing recommended standard 485 (RS485) bus breakdown

A method for quickly testing a recommended standard 485 (RS485) bus breakdown is characterized by comprising detectors and detection equipment of the detectors for use. The method includes the steps: firstly, enabling the detectors to be installed on each node of the RS485 bus which needs to be detected in a series connection mode, wherein each detector has different addresses and a controller can control multiple detectors; and then enabling the sum of the nodes on the bus to be arranged into N; and next, adopting dichotomy, first using the controller to send a control signal to the detectors at the positions of N / 2 bus nodes and cutting the bus at the position of the N / 2 bus nodes; and then checking whether the breakdown still exists, if judging that the breakdown occurs at the position of N / 2 nodes which are close to a host machine, reusing the dichotomy in the N / 2 nodes at present, and by parity of reasoning, until determining a breakdown point.
Owner:贵州英特利智能控制工程研究有限责任公司

Comprehensive transmission line monitoring device with intelligent video damage-by-external-force prevention function

The invention provides a comprehensive transmission line monitoring device with an intelligent video damage-by-external-force prevention function and belongs to the field of power transmission line state monitoring equipment. A power supply unit is respectively connected to one end of a numerical control switch, a power supply end of a management module and a power supply end of an intelligent video server; the other end of the numerical control switch is respectively connected to power supply ends of a 3G video DVS and a camera; a video signal output end of the camera is connected to a video signal receiving end of the 3G video DVS; signal transmitting ends of an anti-theft alarm detection sensing unit and the intelligent video server are connected to a signal receiving terminal of the management module; and a signal transmitting end of the management module is connected to a control end of the numerical control switch. By the adoption of the comprehensive transmission line monitoring device with an intelligent video damage-by-external-force prevention function, real-time power line equipment monitoring can be realized, a newly-added breakdown point can be found in the first place, and high-definition video signals can be transmitted.
Owner:SHANDONG SENTER ELECTRONICS

Vertical Zener diode structure and preparation method thereof

The invention discloses a vertical Zener diode structure. The vertical Zener diode structure is characterized in that N-type injection areas and P-type injection areas of a Zener diode are positioned in an N trap of an epitaxial layer; and the P-type injection areas and the N-type injection areas are arranged downwards in sequence from the silicon surface in a staggered manner. The Zener breakdown point of the vertical Zener diode structure is far away from the silicon surface, so that the drift problem of the Zener breakdown value is improved. The invention also discloses a preparation method of the vertical Zener diode structure.
Owner:SHANGHAI HUA HONG NEC ELECTRONICS

Testing method for yield and breakdown voltage of novel silicon carbide avalanche diode array

The invention discloses a testing method for yield and a breakdown voltage of an novel silicon carbide avalanche diode array, which comprises the following steps of: randomly selecting two or more devices in the novel silicon carbide avalanche diode array to test an I-V characteristic to obtain a breakdown voltage average value Vb; applying a bias voltage to a single device in the novel silicon carbide avalanche diode array with 1.1Vb as a testing highest voltage, and gradually increasing the bias voltage to the testing highest voltage; preliminarily judging whether the device is available ornot by taking the currents as 10-7A and 10-6A as the breakdown point and the current limiting point respectively; and applying the bias voltage to the single device to determine if the device is damaged due to a high voltage testing. The testing method for the yield and the breakdown voltage of the novel silicon carbide avalanche diode array reduces a testing period of a SiC-based APD array, improves the breakdown voltage testing accuracy of the SiC-based APD, improves the consistency of device operation in the array, reduces the damage caused by the testing on the device, and improves the safety of test personnel.
Owner:NANJING UNIV +2

Electric refrigerating light assembly and manufacturing method thereof

The invention discloses an electric refrigerating light assembly and a manufacturing method thereof, wherein the electric refrigerating light assembly comprises a back electrode conducting layer, a dielectric layer, a refracting layer, an inorganic electroluminescence body layer, a transparent insulating layer, an ITO (indium tin oxide) film and a transparent insulator, wherein the ITO film is provided with a net-shaped busbar wire used for a public electrode. The electric refrigerating light assembly and the manufacturing method thereof provided by the invention can be used for overcoming the defects that a dark spot and a breakdown point are easy to appear, the glowing brightness is poor, the photoelectric property is bad and the like in the prior art, and achieving the advantages that the dark spot and the breakdown point are not easy to appear, the glowing brightness is good, and the photoelectric property is good.
Owner:哈密市共创科技发展有限责任公司

Nondestructive marking device for cable insulation spark breakdown point

The invention discloses a nondestructive marking device for a cable insulation spark breakdown point. The nondestructive marking device comprises a base, wherein the top center of the base is fixedlyconnected with a lifting mechanism; the top of the lifting mechanism is fixedly connected with a mounting case; the inner bottom of the mounting case is fixedly connected with a servo motor; the tailend of an output shaft of the servo motor is fixedly connected with a first bevel gear; the inner bottom of the mounting case is rotationally connected with a first rotating rod which is arranged in the vertical direction; a side wall of the first rotating rod is fixedly sleeved with a second bevel gear; the second bevel gear is meshed with the first bevel gear; the top of the first rotating rod is fixedly connected with a reciprocating screw; the top of the reciprocating screw is fixedly connected with a second rotating rod; and one end, far away from the reciprocating screw, of the second rotating rod is rotationally connected with the inner top of the mounting case. The nondestructive marking device is convenient to operate; and bristles are driven to mark a cable by using the servo motor to achieve the targets of reducing noise of the nondestructive marking device for the cable insulation spark breakdown point and reducing air pollution of a spray paint.
Owner:ANHUI CHUNHUI INSTR CABLE GROUP

Cable insulation spark breakdown point lossless labeling device

The invention discloses a cable insulation spark breakdown point lossless labeling device. The cable insulation spark breakdown point lossless labeling device comprises a working platform rack, wherein a color labeling device capable of forming a color coating on the outer surface of a cable insulation layer, an executor capable of converting a spark breakdown alarm electric signal into a drive color labeling device turning-on / off power output, and a transmission mechanism capable of transmitting the power output by the executor to a color labeling device control switch, the color labeling device is in an automatic paint spraying manner, an automatic paint spraying tank accommodating and fixing groove adapting to the automatic paint spraying tank in shape and size is formed in the working platform rack, and the executor is a pneumatic executor composed of a control valve and a pneumatic executing mechanism. According to the cable insulation spark breakdown point lossless labeling device, a color label can be automatically and rapidly sprayed on the outer surface of a spark breakdown point insulation layer, the labeling operation can not damage the insulation layer, and the requirement of the labeling operation of a high-speed cable production line can be met.
Owner:LIAONING JINDA CABLE

GIS on-site voltage withstand test breakdown point locating method and GIS on-site voltage withstand test breakdown point locating system

The invention relates to a GIS on-site voltage withstand test breakdown point locating method and a GIS on-site voltage withstand test breakdown point locating system. The GIS on-site voltage withstand test breakdown point locating method is characterized in that four audio sensors are disposed on one side of a tested device, and three audio sensors share one line, and the other audio sensor does not share the line with the above mentioned three audio sensors; the signals generated by the four audio sensors are acquired, and the signal generating time delays of the three groups of audio sensors are acquired; the signal generating time delays of the three groups of audio sensors satisfy linear independence; the signal generating time delays of the three groups of audio sensors are substituted into three locating equations, and a position of a breakdown point is acquired by solving a locating equation group constituted by three locating equations. The four audio sensors are used for the locating of the breakdown point, and therefore the locating is accurate, and the efficiency is high. The system is realized based on the method, and therefore the application of the method is facilitated.
Owner:XI AN JIAOTONG UNIV

Power supply line arc light earth fault range finding method

ActiveCN104931849AFundamental improvementEnsure safetyFault locationHigh resistanceCapacitance
The invention belongs to the power system field, and especially relates to a power supply line arc light earth fault range finding method; most power supply line earth faults belong to arc light earthing; after a fault line is in power failure, a DC current generator charges the line so as to boost a line voltage to earth; a fault point can be broken again when reaching a fault breakdown voltage, and the fault point fast turns to a low resistance state from a high resistance state; line distribution capacitance discharges through the breakdown point, and the voltage on the line suddenly drops. The line is considered to be a dynamic system; a line dynamic model is set up; a dynamic system parameter identification method can identify line dynamic model parameters according to a current and voltage sampling series on the line, thus calculating a fault range according to the model parameters.
Owner:广西电网有限责任公司河池供电局 +1

Method for preparing vinegar from kiwi fruit wine

The invention relates to a method for preparing vinegar from kiwi fruit wine. The method comprises the following steps: preparing kiwi fruit wine with the alcohol content of 10-12%, carrying out negative-pressure low-temperature distillation to remove part of alcohol in the kiwi fruit wine; and carrying out acetic fermentation to produce the 4-5 %vol fruit vinegar. After part of alcohol is distilled out of the kiwi fruit wine, the alcohol content of the wine is lowered to 5 %vol, and 100% fruit juice is preserved, thereby preserving various vitamins and other nutrients in the fruit juice; particularly, vitamin C in the kiwi fruit wine is well preserved since the temperature for distilling out alcohol does not exceed 70 DEG C and the breakdown point temperature of the vitamin C is 80 DEG C; and the acetic fermentation is carried out to produce the 4.5 %vol fruit vinegar with the fruit juice content of 100%, so that the fruit vinegar has higher nutritive value and conforms to the food requirements of people. The method enhances the production efficiency and raw material utilization ratio, and reduces the product flavor substance loss. Part of alcohol is removed by distillation while part of water is removed, thereby removing 10% of the volume on the whole. The raw juice is concentrated, so that the obtained kiwi fruit vinegar has thicker fruit aroma and more abundant nutrients.
Owner:张新义

Memory preanalysis method and system adopted after kernel breakdown

The invention discloses a memory preanalysis method adopted after kernel breakdown.The method comprises the steps that when kernel breakdown is detected, an original kernel file is unloaded; whether the kernel starts CONFIG_DEBUG_INFO or not is judged; if the kernel starts CONFIG_DEBUG_INFO, breakdown point information is obtained from the original kernel file, wherein the breakdown point information comprises the virtual address and offset of a breakdown point; source code information of the breakdown point is obtained from the breakdown point information.According to the memory preanalysis method adopted after kernel breakdown, complete memory data does not need to be stored any more, and only necessary data needs to be stored, so that storage of debugging information is accelerated, time and spaced needed by storing the debugging information can be effectively reduced, and time needed by system kernel error recovery can be shortened.The invention further discloses a memory preanalysis method adopted after kernel breakdown.
Owner:BEIJING FORTUNET INFORMATION TECH

Semiconductor device having a groove and a junction termination extension layer surrounding a guard ring layer

In a termination structure in which a JTE layer is provided, a level or defect existing at an interface between a semiconductor layer and an insulating film, or a minute amount of adventitious impurities that infiltrate into the semiconductor interface from the insulating film or from an outside through the insulating film becomes a source or a breakdown point of a leakage current, which deteriorates a breakdown voltage. A semiconductor device includes: an n− type semiconductor layer formed on an n+ type semiconductor substrate; a first electrode that is formed on the n− type semiconductor layer and functions as a Schottky electrode; a GR layer that is a first p type semiconductor layer formed on a surface of the n− type semiconductor layer below an end of the first electrode and a perimeter thereof; a JTE layer that is formed of a second p type semiconductor layer formed on a bottom and a lateral surface of a groove arranged in a ring shape around the GR layer apart from the GR layer, in a surface of the n− type semiconductor layer; an insulating film provided so as to cover the GR layer and the JTE layer; and a second electrode that is an Ohmic electrode formed below a rear surface of the n+ type semiconductor substrate.
Owner:MITSUBISHI ELECTRIC CORP

Method for growing epitaxial wafer of GaN-based light emitting diode

The invention discloses a method for growing an epitaxial wafer of a GaN-based light emitting diode, and belongs to the field of a light emitting diode. The method comprises successively growing a buffer layer, an N-type layer, a multi-quantum well layer and a P-type layer on a substrate, wherein the P-type layer is grown by use of a high-pressure low-speed growth mode, the growth pressure of the P-type layer is 400torr to 760torr, the flow of TMGa is lower than 90sccm, the flow of TEGa is lower than 2000sccm, and the thickness of the P-type layer is 10nm to 60nm. According to the invention, through adoption of high-pressure low-speed growth, the crystal quality is quite good, the defect density caused by crystal lattice mismatch is substantially reduced, electric leakage channels between the NP layers are reduced, the current expansion capability of the NP layers is better, breakdown points are reduced, the antistatic capability of the epitaxial wafer is enhanced, requirements are met simply by growing a quite thin P-type layer, the light absorption amount of the P-type layer with a quite small thickness is smaller, and the light emitting amount of the front surface of a chip and the light emitting efficiency of a device are guaranteed.
Owner:HC SEMITEK SUZHOU

Fault diagnosis method, fault diagnosis system, computer equipment and storage medium

The fault diagnosis method comprises the following steps: acquiring a parameter signal of operation of target equipment; obtaining a parameter vector according to the parameter signal; establishing a mapping relationship between the fault type and the parameter vector; establishing a fault diagnosis model by taking the parameter vector as an input training sample and the fault type as an output training sample; and applying the fault diagnosis model to fault diagnosis of the target equipment. According to the fault diagnosis method, by establishing the corresponding relation between the fault type and the parameter vector, all possible fault points can be diagnosed according to the change of the parameter signal, the comprehensiveness of fault diagnosis is optimized, the fault type can be quickly determined, and the accuracy of fault diagnosis is improved.
Owner:CHINA INSTITUTE OF ATOMIC ENERGY

Screening testing method for diode reverse characteristic and application thereof

InactiveCN106814298AImprove reliabilitySolving Poor Test Screening ProblemsIndividual semiconductor device testingEngineeringSemiconductor
The invention provides a screening testing method for a diode reverse characteristic and an application thereof, wherein the method relates to the field of semiconductor device testing technology. The screening testing method for the diode reverse characteristic comprises the following steps of 1), testing a breakdown voltage; 2), selecting two voltages in a range of 95%-99.5% of the breakdown voltage, testing leakage currents on the condition of the two voltages, respectively recording the two leakage currents as IR1 and IR2; and 3), calculating a ratio between the IR1 and the IR2, and determining whether the diode reverse characteristic is qualified according to the ratio. The testing method is used for screening the diode with a problem of small segmenting line at a breakdown point, thereby settling a problem of inapplicability of an existing testing method to the defective diode, improving quality of the diode after leaving a factory, and improving diode reliability.
Owner:JILIN MAGIC SEMICON

Voltage oscillation frequency-based grounding electrode line overvoltage breakdown point positioning method

A voltage oscillation frequency-based grounding electrode line overvoltage breakdown point positioning method disclosed by the present invention orderly comprises the following steps of 1 selecting the fault grounding electrode lines, according to the prony signal analysis, obtaining an oscillation frequency fz of a fault voltage waveform after the overvoltage breakdown; 2 according to a transfer function of the head-end voltages of the grounding electrode lines, obtaining a relation curve between the voltage oscillation frequencies fz and the grounding electrode line inductances L; 3 according to the relation curve between the voltage oscillation frequencies fz and the grounding electrode line inductances L in the step 2, obtaining the grounding electrode line inductance L corresponding to the oscillation frequency fz; 4 traversing the grounding electrode line equivalent impedances corresponding to different fault distances, and obtaining a relation curve between the grounding electrode line inductances and the fault distances; 5 according to the relation curve between the grounding electrode line inductances and the fault distances in the step 4, obtaining the fault distance d corresponding to the grounding electrode line inductance L3, thereby realizing the overvoltage breakdown point positioning.
Owner:STATE GRID SICHUAN ELECTRIC POWER CORP ELECTRIC POWER RES INST +1

Comprehensive power transmission line video monitoring device based on LTE technology

The invention provides a comprehensive power transmission line video monitoring device based on the LTE technology and belongs to the field of power transmission line state monitoring equipment. A GSM short message processing unit and a power supply monitoring unit are respectively connected to a signal input end of a main control chip; a power supply end of the main control chip and a power supply end of the power supply monitoring unit are connected to a power supply unit through the power supply end of the power supply monitoring unit; one end of a numerical control switch, a power supply end of the power supply monitoring unit and a power supply end of an intelligent video server are connected to the power supply unit; the other end of the numerical control switch is connected to power supply ends of an LTE module and a camera respectively; and a video signal output end of the camera is connected to a video signal receiving end of the LTE module. By the adoption of the comprehensive power transmission line video monitoring device based on the LTE technology, real-time power line equipment monitoring can be realized, a newly-added breakdown point can be found in the first place, and high-definition video signals can be transmitted.
Owner:SHANDONG SENTER ELECTRONICS

Point sound source sounding device and sounding method

InactiveCN108495246AEnough sound pressureOmnidirectional in spaceOptical signal transducersShock waveSound sources
The invention discloses a point sound source sounding device and sounding method. The device comprises a laser generator, a pulse laser head arranged at a laser outgoing port of the laser generator, and a laser focusing lens located on an optical path of the pulse laser emitted from the pulse laser head; a light spot that can break through air is formed by focusing the pulse laser, the light intensity of the light spot is greater than a threshold of the light intensity generated by a plasma, when the air is broken down, a small plasma explosion with rapid expansion characteristics is generated, the expanded plasma produces a pressure pulse with a short and high peak, the frequency of the pressure pulse can exceed 100kHz, the pressure pulse propagates as a nonlinear supersonic shock wave near a breakdown point, and the propagation speed of the shock wave is determined by the energy released when the air is broken down; and for the laser pulse energy in an mJ energy range, the shock waveis rapidly attenuated into a sound wave, and thus a point sound source with sufficient sound pressure and spatial omnidirectionality can be obtained, and the point sound source is repeatable.
Owner:SUZHOU SOUND TECH TECH CO LTD

Process monitoring method and device for channel MOS devices

The invention relates to a process monitoring method and device for channel MOS devices. The method comprises the following steps of: determining the grid voltage and / or the grid leakage current of the soft breakdown point and the hard breakdown point of the batch of MOS devices; and applying detection voltage to the grid electrodes of the batch of channel MOS devices to be monitored, detecting the grid leakage current of the grid electrodes of the batch of channel MOS devices, and causing the voltage value of the detection voltage to range between the grid voltage of the soft breakdown point and that of the hard breakdown point, or applying detection current to the grid electrode of each channel MOS device, detecting the grid voltage of the grid electrode of each channel MOS device, and causing the value of the detection current to range between the grid leakage current of the soft breakdown point and that of the hard breakdown point. The invention can improve the process monitoring effect, and accurately detect the problem of process drift of the devices.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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