40 results about "Nanosecond laser pulse" patented technology

The present invention relates to an ophthalmic surgical apparatus which comprises a laser source (1) suitable for emitting a beam of laser pulses (8) with a duration of one picosecond to one nanosecond; an optical focussing system (10) for focussing said beam of laser pulses on a focal point (6); and a system for moving the beam of laser pulses, configured to move said focal point (6) along a predetermined path. According to the invention, the laser source (1) generates a beam of picosecond to nanosecond laser pulses (8), focussed next to a surface (25) of the anterior segment of the eye (4),the focal point (6) being located at a distance d other than zero from an optical axis (21) of symmetry of the anterior segment of the eye (4), the system (30) for moving the beam of laser pulses includes a single degree of freedom of rotation about an axis of rotation (36) so as to move said focal point (6) along a curved path (16) located in an annular area about the optical axis (21) of symmetry of the anterior segment of the eye (4); and the ophthalmic surgical apparatus is configured with a numerical aperture so as to limit the geometric optical aberrations at the focal point (6) and on the entire curved path (16) in said annular area about the optical axis (21) of symmetry of the anterior segment of the eye (4).

Systems and methods for processing an electrically conductive link in an integrated circuit use a series of laser pulses having different pulse widths to remove different portions of a target structure without substantially damaging a material underlying the electrically conductive link. In one embodiment, an ultrafast laser pulse or bundle of ultrafast laser pulses removes an overlying passivation layer in a target area and a first portion of link material. Then, a nanosecond laser pulse removes a second portion of the link material to sever an electrical connection between two nodes in the integrated circuit. The nanosecond laser pulse is configured to reduce or eliminate damage to the underlying material.

The invention provides a time domain phase recovery all-fiber laser pulse weak phase measuring device and method. The device comprises a fiber splitter arranged long the laser pulse input direction. The fiber splitter divides laser pulses to be measured into a high beam of light and a weak beam of light. An adjustable optical fiber delayer, a high speed optical fiber phase modulator, a dispersion optical fiber and an oscilloscope are successively arranged long the direction of the high light beam. A high speed PIN photoelectric tube, an arbitrary waveform generator and an electric signal amplifier are successively arranged long the direction of the weak light beam. An output end of the electric signal amplifier is connected with a modulation input end of the high speed optical fiber phase modulator. According to the invention, the all-fiber structure is utilized to carry out phase modulation and dispersion transmission on the laser pulses, the structure is compact, simple and flexible, and the measuring method is different from other laser pulse phase measuring modes; in addition, by adopting the measuring device and method, the weak phase picoseconds or nanosecond laser pulses can be measured, and the measuring device and method are applicable to the conditions of a high repetition frequency and a low repetition frequency.

The invention provides a two-dimensional material nanosheet with large area and controllable thickness and a general preparation method thereof. The general preparation method is realized by heating sublimation with high-energy nanosecond laser pulses. Among them, since the thermal conductivity coefficient in the two-dimensional material layer is much higher than that between layers, by controlling the energy of the laser pulse, the two-dimensional material is uniformly heated and sublimated layer by layer, and controlled by adjusting the laser pulse action (heating) time The thickness is reduced, and finally a two-dimensional material film with controllable thickness is obtained. At the same time, the sample stage that moves freely in the two-dimensional plane space can realize the preparation of two-dimensional material films with a large area (≥10 cm). Compared with traditional methods such as mechanical peeling and liquid phase peeling, the present invention can regulate two-dimensional material films The sample thickness is high, and it is suitable for all two-dimensional materials.