The invention discloses a double-source metal codeposition method capable of suppressing silver agglomeration. The double-source metal codeposition method capable of suppressing silver agglomeration comprises the following steps: choosing added metal materials from aluminium, gold, copper, magnesium, titanium and indium; choosing a substrate: choosing a transparent material if both front surface reflection and back surface reflection are applied or back surface reflection is applied; choosing a film preparation temperature and a use temperature, and choosing a high-temperature material for high-temperature condition preparation and use; cleaning the substrate; and during deposition film formation, considering a film coating mode, a substrate temperature, a deposition mode, a deposition vacuum degree, the ratio and the control of the two metal materials, a film thickness and the like, wherein the film coating mode can choose resistance evaporation, electron beam evaporation, magnetron sputtering and the like, the substrate temperature is from a room temperature to 300 DEG C, the deposition mode is double-source metal codeposition, and two containers are respectively filled with silver and the added metals for codeposition, the deposition vacuum degree is at least 5*10<-3>Pa. According to the double-source metal codeposition method capable of suppressing silver agglomeration disclosed by the invention, a film is prepared in the common film coating condition, and the exertion of good photoelectrical properties of the silver film in the common high-temperature condition is realized.