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Double-source metal codeposition method capable of suppressing silver agglomeration

A co-deposition and metal technology, applied in the field of dual-source metal co-deposition, can solve the problem of not involving the thermal stability of silver thin films, and achieve the effect of good optoelectronic properties

Inactive Publication Date: 2015-05-06
LONGYAN UNIV
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Problems solved by technology

However, none of their studies addressed the improvement of the thermal stability of silver thin films grown on high temperature substrates

Method used

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  • Double-source metal codeposition method capable of suppressing silver agglomeration
  • Double-source metal codeposition method capable of suppressing silver agglomeration
  • Double-source metal codeposition method capable of suppressing silver agglomeration

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Embodiment Construction

[0045] The present inventor has studied in detail the coagulation of silver thin films under various preparation conditions and heat treatment conditions, and found that "holes" will appear in the film when silver coagulates, especially for films deposited on high-temperature substrates. Figure 8 and Figure 9 It is the surface topography of the pure silver film grown on the quartz substrate at 60 and 90°C after annealing at 300°C for one hour in the atmosphere. These "holes" are mainly due to the fact that some silver atoms gather nearby atoms into larger particles during heat treatment, causing voids around them. This is an inherent property of silver itself, and the addition of other metals is mainly to fill in these gaps.

[0046] Alford’s and Lai’s group’s alloy films or double (multi-layer) films both have a large number of pure silver film intervals (for example, the top layer of Alford’s double-layer film is a thicker silver film, and Lai’s group’s conductive layer i...

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Abstract

The invention discloses a double-source metal codeposition method capable of suppressing silver agglomeration. The double-source metal codeposition method capable of suppressing silver agglomeration comprises the following steps: choosing added metal materials from aluminium, gold, copper, magnesium, titanium and indium; choosing a substrate: choosing a transparent material if both front surface reflection and back surface reflection are applied or back surface reflection is applied; choosing a film preparation temperature and a use temperature, and choosing a high-temperature material for high-temperature condition preparation and use; cleaning the substrate; and during deposition film formation, considering a film coating mode, a substrate temperature, a deposition mode, a deposition vacuum degree, the ratio and the control of the two metal materials, a film thickness and the like, wherein the film coating mode can choose resistance evaporation, electron beam evaporation, magnetron sputtering and the like, the substrate temperature is from a room temperature to 300 DEG C, the deposition mode is double-source metal codeposition, and two containers are respectively filled with silver and the added metals for codeposition, the deposition vacuum degree is at least 5*10<-3>Pa. According to the double-source metal codeposition method capable of suppressing silver agglomeration disclosed by the invention, a film is prepared in the common film coating condition, and the exertion of good photoelectrical properties of the silver film in the common high-temperature condition is realized.

Description

Technical field [0001] The present invention involves a dual -source metal sedimentary method that suppress silver condensation. Background technique [0002] Due to its good conductivity (the minimum resistance in all metal materials), high optical reflectivity (except for the plasma resonance absorption near 320nm, more than 95%of optical reflectivity of the full band)Optical conversion technology is favored.However, its thermal stability is extremely poor. When applying, it is necessary to have complex processing technology or even give up it to choose copper and aluminum with the secondary optoelectronic properties.And people have not given up research on the improvement of silver thermal stability. [0003] After decades of hard work, people have achieved certain results in the heat stability of silver and their improvement.It is found that the poor thermal stability of the poor silver is mainly related to it easily condensed in the heat treatment. Adding other metals can im...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/14
Inventor 吕晶梁雄赖发春林丽梅刘美梅王颖赖国忠
Owner LONGYAN UNIV
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