158results about How to "Solve alignment problems" patented technology

A printed circuit board with an embedded component includes a double-sided wiring board, an electronic component, and many conductive pastes. The wiring board includes a first wiring layer, a base layer, a first insulating layer, and a second wiring layer. The base layer has an opening exposing a portion of the second surface of the first insulating layer to the outside. The second wiring layer includes electrical contact pads. The conductive blind vias are formed in the first insulating layer. Each electrical contact pad is electrically connected to an end of the corresponding conductive blind via. The other ends of the conductive blind vias are adjacent to the first surface. A filling through hole is formed in the double-sided wiring board. The conductive pastes are respectively electrically connected to the conductive blind vias. The electronic component is adhered to and electrically connected to the conductive paste.

The invention discloses a connecting structure for vertical reinforcement bars of prefabricated wall parts. The connecting structure comprises a steel box body with an opening on one side, upper-side prefabricated part reinforcement bars fixedly connected on a top plate of the steel box body, lower-side prefabricated part reinforcement bars penetrating through the inside of the steel box body through an opening formed on the bottom side of the steel box body, base plates and nuts arranged inside the steel box body and sequentially sleeved on the lower-side prefabricated part reinforcement bars, and two wedge plates symmetrically disposed on both sides of the lower-side prefabricated part reinforcement bars. Reinforcement bar mounting holes and two parallelly arranged base plate guide grooves are formed in the base plates, wherein the base plate guide grooves are located on both sides of the reinforcement bar mounting holes. Two wedge-shaped guide grooves are parallelly formed on the lower side of the top plate of the steel box body. The base plate guide grooves and the wedge-shaped guide grooves are formed along the direction of the opening of the steel box body. The depths of the wedge-shaped grooves are gradually decreased from the opening to the inside, the upper ends of the wedge plates and the lower ends of the wedge plates are respectively embedded into the wedge-shaped guide grooves and the base plate guide grooves. By the aid of the connecting structure for vertical reinforcement bars of prefabricated wall parts, reinforcement bars of prefabricated parts are connected quickly and efficiently in real time.

The invention discloses transfer printing equipment and a coater. The transfer printing equipment comprises an Asai Kasai photosensitive resin plate (APR plate) and a printing roller, wherein a bump of the APR plate is mutually matched with a groove of the printing roller for fixing the APR plate and the printing roller, so that the aligning problem of the APR plate and the printing roller can be solved, the capacity of accommodating polyimide of the APR plate can be regulated, and the orientation and the uniformity of an orientation film are optimized, and therefore, the order of liquid crystal molecular arrangement is strengthened, and the contrast ratio of a display panel is finally improved. Besides, according to the technical scheme provided by the invention, a vacuum adsorption mode is adopted to replace a mechanical fixing mode for firmly adsorbing the APR plate onto the printing roller, so that the APR plate does not generate extension deformation and sliding under the action of printing external force. The technical scheme provided by the invention can prevent the APR plate from generating extension deformation and sliding, and production printing is guaranteed to not deviate, so that the product quality is guaranteed to the greatest extent.

A coreless package substrate is provided, including: a circuit buildup structure including at least a dielectric layer, at least a circuit layer and conductive elements; first electrical contact pads embedded in the lowermost dielectric layer of the circuit buildup structure; a plurality of metal bumps formed on the uppermost circuit layer of the circuit buildup structure; a dielectric passivation layer disposed on a top surface of the circuit buildup structure and the metal bumps; and second electrical contact pads embedded in the dielectric passivation layer and electrically connected to the metal bumps. With the second electrical contact pads being engaged with the metal bumps and having top surfaces thereof completely exposed, the bonding strength between the second electrical contact pads and a chip to be mounted thereon and between the second electrical contact pads and the metal bumps can be enhanced.

The invention discloses an application icon alignment device and method and a terminal. The device comprises a detection module, a judgment module and an alignment module. The detection module is used for detecting the motion state of the terminal and pressure values of the positions where application icons on a desktop of the terminal are located. The judgment module is used for judging whether the detected motion state and the pressure value of the position where any application icon is located meet preset alignment conditions or not. The alignment module is used for adopting the position where the application icon meeting the preset alignment conditions is located as a target position when it is determined that the preset alignment conditions are met and aligning the other application icons at the target position according to a preset alignment strategy. The application icons are aligned at the target position, the problem that in the prior art, batched application icons are tediously aligned at the target position is effectively solved, therefore, the problem that in the prior art, alignment of the application icons at the target position cannot be carried out based on user intentions can be effectively solved, and the user experience is improved.