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Presetting gold-tin cover plate and manufacturing method thereof

A cover and preset technology, which is applied in manufacturing tools, metal processing equipment, resistance welding equipment, etc., can solve poor air tightness, difficult automatic production, inaccurate alignment of airtight cover and preformed soldering piece, etc. problems, to achieve the effect of improving the production process, increasing the pass rate, and ensuring airtightness

Inactive Publication Date: 2015-09-30
GUANGZHOU XIANYI ELECTRONICS TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a preset gold-tin cover plate and its manufacturing method. The preset gold-tin cover plate prepared by this method can solve the problem of misalignment between the air-tight cover plate and the solder preform. Accurate, poor airtightness, difficult to automate production and other issues

Method used

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  • Presetting gold-tin cover plate and manufacturing method thereof

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Embodiment Construction

[0022] The preferred embodiment of the present invention will be described in detail on the lower surface in conjunction with the accompanying drawings. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art may make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.

[0023] Such as figure 1 Shown is the preset gold-tin cover plate of the present invention, comprising:

[0024] Kovar alloy cover plate 1 made of Fe54Co17Ni29, namely 4J29 Kovar alloy, or Fe58Ni42, namely 4J42 Kovar alloy;

[0025] A welding frame 2 made of Au80Sn20 eutectic alloy solder is connected to the periphery of the surface of the Kovar cover plate 1; in ot...

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Abstract

The invention discloses a presetting gold-tin cover plate which comprises a kovar alloy cover plate and a welding frame, wherein the kovar alloy cover plate sequentially comprises a kovar alloy sheet plate, a nickel plating layer and a gold plating layer from inside to outside; the welding frame is a frame made of Au80Sn20 eutectic alloy solder and the size of the frame is matched with the kovar alloy cover plate; the metallurgical bonding of the kovar alloy cover plate and the welding frame is realized through melting corresponding points which are located at four corners of the welding frame and are in contact with the kovar alloy cover plate. The invention also discloses a manufacturing method of the presetting gold-tin cover plate. According to the presetting gold-tin cover plate and the manufacturing method thereof, the firm combination of the gold-nickel-plating kovar alloy cover plate and an Au80Sn20 pre-molding alloy soldering lug is realized, on one hand, the counterpoint problem of the two is solved, and on the other hand, the firm combination of the two is realized, so that a traditional production process is improved, the production efficiency is improved, the gas tightness is guaranteed and the product percent of pass is improved.

Description

technical field [0001] The invention relates to the technical field of microelectronic welding, in particular to a pre-prepared gold-tin cover plate and a manufacturing method of the cover plate. Background technique [0002] Hermetic packaging refers to the packaging that can completely prevent the intrusion and corrosion of pollutants (liquid and solid). In the field of electronic technology, hermetic packaging can effectively protect the chip; especially to prevent external environmental damage; mainly refers to the electrolytic reaction between metals caused by water vapor will lead to metal corrosion, causing short circuit, open circuit and destruction of the chip; thus improving the circuit, especially is the reliability of the active device. [0003] Metal materials have the best ability to block the penetration of water molecules. Therefore, metal hermetic packaging is mainly used in the field of electronic packaging that requires high reliability. Metal packages...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/10B23K11/11
Inventor 陈卫民
Owner GUANGZHOU XIANYI ELECTRONICS TECH
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