39results about How to "Short plating time" patented technology

The invention relates to a nickel-free black tin cobalt alloy plating solution and an electroplating technology by using same. The parameters and contents of all components of the plating solution are as follows: the content of tin ions in a tin salt is 0.05-6g/L; the content of cobalt ions in a cobalt salt is 0.05-0.8g/L; the content of third metallic ions is 0.02-50g/L; the content of a complexing agent is 0.1-180g/L; the content of a blacking agent is 0.1-50g/L; the content of a PH buffer is 5-300g/L; the baume degree of the plating solution is 6-250; the temperature is 20-55 DEG C; and PH is 9-13. According to the technology provided by the invention, tin is taken as a main alloy layer and few cobalt and third and fourth metal ions are added in tin to form a ternary or quaternary alloy system; the cobalt content in the common black tin cobalt alloy plating solution excesses 8g/L, but the cobalt content is reduced to 0.05g/L according to the new electroplating technology provided by the invention; the special biodegradable or non-biodegradable stabilizing complexing agent and PH buffer are used, so that the production cost is lowered; and the nickel-free black tin cobalt alloy plating solution meets the limitation requirement on CO in the European Union Rosh standard, Germany LMBG standard, Mattel children toy standard, European Oeko-Tex Standard 100 standard and the like.

A technology for plating the nano-Ni working layer on the surface of roller of the dual-roller thin-band conticaster includes such steps as cleaning the surface of roller, and electrochemical cleaning, activating, plating of binding layer and plating of Ni layer by moving the plating pen along the roller surface at the rotation speeds of 10-14, 12-16, 12-16 and 14-20 rpm under the voltages of 14-16, 18-20, 22-24 and 16-24 V.

The invention relates to a method for chemically plating the surface of diamond with Ni and P in a microwave-ultrasound combined mode and belongs to the technical field of diamond composites. The method includes the steps that firstly, grease and dirt of diamond particles are removed after the diamond particles are boiled in a NaOH solution, and then the surfaces of the diamond particles are roughened after the diamond particles are boiled in a dilute HNO3 solution; the diamond particles obtained after surface roughening are placed in a base colloid palladium solution for sensitization-activation; the diamond particles obtained after sensitization-activation are added into a sodium hypophosphite-water(1/2) solution with the concentration of 30 g/L for surface Pd2+ reduction of the diamond particles; and the diamond particles obtained after surface Pd2+ reduction are added into a chemical plating solution, are plated for 1-1.5 h under the microwave irradiation and ultrasound stirring conditions and stand still after being plated, and the diamond particles plated with Ni-P on the lower layer are washed with distilled water for vacuum drying. According to the method, the microwave irradiation heating technology and the ultrasound technology are combined to be applied to the Ni-P chemical plating process of the surface of the diamond, the quality of a coating is improved, and the coating is flat, smooth, dense, uniform and high in binding capacity and corrosion resistance.

The invention relates to the technical field of metal surface treatment, and particularly relates to a die-casting aluminum alloy electroplating pretreatment process. According to the die-casting aluminum alloy electroplating pretreatment process, activation treatment is adopted to replace traditional procedures such as primary zinc precipitation, zinc removal, secondary zinc precipitation and alkaline chemical nickel precipitation, the technological process is simplified, the production efficiency is improved, wastewater discharge is greatly reduced, the raw material cost is saved, the equipment investment is reduced, and the labor cost is reduced; and in addition, phosphorus discharge is reduced through the descaling process, and the process is more environmentally friendly. Due to the fact that the plating time of an activating solution is short, the raw material consumption is low, the change of a bath solution is slow, the cost is low, a die-casting aluminum alloy piece subjectedto activation treatment has good adhesive force, and a good foundation is laid for the electroplating procedure; and in addition, the surface activity of a product plated with the activating solutionis high, and plating is started in a chemical nickel bath for 1-2 seconds after activation.

The invention provides a multi-stage nickel plating process, and relates to the technical field of electroplating. An electroplating solution of the nickel plating process comprises nickel sulfamate,nickel bromide and boric acid. The electroplating process comprises the following stages of a pre-plating stage, a the first stage, a second stage, a third stage and a fourth stage; in the pre-platingstage, the current density is 0.1 ASD-0.2 ASD, the pre-plating time is 240 seconds-360 seconds; in the first stage, the current density is 0.4 ASD-0.7 ASD, the electroplating time is 840 seconds-960seconds; in the second stage, the current density is 0.5 ASD-0.8 ASD, the electroplating time is 4000 seconds-4600 seconds; in the third stage, the current density is 0.4 ASD-0.6 ASD, the electroplating time is 3200 seconds-3800 seconds; and in the fourth stage, the current density is 0.2ASD-0.4 ASD; and the electroplating time is 1200 seconds-2200 seconds. According to the multi-stage nickel plating process, a staged electroplating mode is set, so that a plating layer is prevented from being damaged by instantaneous current; and in the last two electroplating stages, correcting is carried outon crystals on the surface of the plating layer, so that burns on the surface of the plating layer are eradicated, and the welding performance is remarkably improved.

The invention discloses a cyanide-free gold-imitating copper-zinc-tin alloy electroplating process for the surface of carbon steel. The process comprises the following steps of: immersing pretreated carbon steel to be electroplated into an electroplating bath filled with a pre-plating solution, and electroplating at room temperature to obtain carbon steel with a pre-plated copper layer, wherein the pre-plating solution is prepared by dissolving copper sulfate, potassium hydroxide, carboxylate, a sulfur-containing grain refiner and an amine-containing brightener in deionized water; and immersing the carbon steel with a pre-plated copper layer into an electroplating bath filled with an electroplating solution, and electroplating at room temperature to obtain the carbon steel of which the surface contains a gold-imitating plating layer containing three elements of copper, tin and zinc, wherein the electroplating solution is prepared by dissolving potassium pyrophosphate, copper pyrophosphate, zinc sulfate, stannous pyrophosphate, hydroxyethylidene-1, 1-diphosphonic acid, an additive and a brightener in deionized water. The obtained plating layer is high in quality, golden and uniform in color and good in discoloration resistance.

The invention discloses a nickel plating solution applied to a printed circuit board and a nickel electroplating method thereof. The nickel plating solution comprises the following components including, by mass concentration, 35-50 g/L of nickel salt, 20-40 g/L of conductive salt, 10-15 g/L of an anti-aging agent, 5-15 g/L of a composite complexing agent, 50-80 mg/L of a reaction accelerator, 50-80 mg/L of a stress relieving agent, 5-10 mg/L of a surfactant, and 0.2-5 mg/L of a compound stabilizer. The composite complexing agent comprises a component A and a component B, wherein the mass concentration ratio of the component A to the component B is 3: (1-2). The component A comprises, by mass concentration, 1-5 g/L of citric acid, 1-2 g/L of ammonium acetate, and 1-5 g/L of malic acid. According to the solution, the binding force strength between a plating layer and a base body is guaranteed, so that a nickel plating layer has good adhesiveness, and the plating layer is uniform. According to the process, the electroplating uniformity is guaranteed, and the electroplating time is shorter.

The invention belongs to the technical field of metal surface electroplating, and relates to a cyanogen-free imitation gold electroplating liquid and a magnesium alloy electroplating technology thereof. The electroplating liquid comprises 200-300 g/L of potassium pyrophosphate, 18-24 g/L of cupric pyrophosphate, 1.5-2.6 g/L of stannous pyrophosphate, 40-50 g/L of zinc sulfate, 15-20 g/L of HEDP, 2-3 mL/L of AESS and 1-3 mol/L of imidazolium ionic liquid, and pH is 8-9. The electroplating technology comprises the steps that firstly, a magnesium alloy sample is sequentially subjected to oil removal, acid pickling and activation treatment; secondly, then, primary zinc immersion, zinc return and secondary zinc immersion treatment are conducted; and thirdly, the magnesium alloy sample obtainedafter zinc immersion treatment is electroplated for 10-180 s at the room temperature under the current density of 0.1-2A/dm<2>, and cleaning and dry blowing are conducted. The imitation gold electroplating liquid is friendly to the environment and good in stability; and an imitation gold electroplated layer obtained on the surface of a magnesium alloy through electroplating is high in quality, andthe color changing resisting performance is good.

The invention discloses a preparation method of a copper element modified carbon fiber reinforced copper-based contact material. The preparation method comprises the following steps: (1) pretreating carbon fibers; (2) placing the pretreated carbon fibers in a plating solution for chemical plating of a copper metal layer on the surfaces of the carbon fibers, cleaning and drying after copper plating is completed, and obtaining copper element modified carbon fibers; (3) mixing the copper element modified carbon fibers and electrolytic copper powder in an argon atmosphere according to a mass ratio of 2: (8-9); and (4) loading mixed copper element modified carbon fiber-copper powder into a high-strength graphite mold to be subjected to vacuum hot pressing sintering, and obtaining the copper element modified carbon fiber reinforced copper-based contact material after demolding. The invention further discloses the copper element modified carbon fiber reinforced copper-based contact material prepared by the method. According to the invention, the interface bonding between the carbon fibers and copper is improved, and the copper-based contact material with excellent performance is obtained.