A kind of electroforming preparation method of silver solder with high indium content

A silver brazing material and content technology, applied in the field of welding materials, can solve the problems of large wetted area, low melting point of brazing material, low indium content, etc., and achieve the effects of fast thermal diffusion, firm bonding and smooth surface

Inactive Publication Date: 2018-08-28
NORTH CHINA UNIV OF WATER RESOURCES & ELECTRIC POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of this, the purpose of the present invention is to address the deficiencies in the prior art and provide a method for preparing a silver solder with high indium content by electroforming. This invention solves the problems of low indium content and poor plasticity in the current AgCuZnIn solder. By improving the diffusion process, the prepared solder has low melting point, large wet area, high tensile strength and elongation, and excellent comprehensive performance

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  • A kind of electroforming preparation method of silver solder with high indium content

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Experimental program
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Effect test

Embodiment 1

[0021] A preparation method for electroforming of silver solder with high indium content, the specific steps are as follows:

[0022] (1) Electroplating is carried out with silver solder as the cathode and indium plate as the anode. The composition of the electroplating solution is: In 2+ Metal salt 20-130g / L, strong acid 40-120ml / L or medium strong acid 35-65 g / L, additive 2-80 g / L, current density: 2-5A / dm 2 , temperature 30-60°C, pole spacing 15-20mm, stirring speed 350-500r / min, pH=0.6-0.8, electroplating time: 4-15min;

[0023] (2) Diffusion treatment is carried out on the silver solder containing the indium electroplating layer on the surface after electroplating. The diffusion treatment method is as follows: firstly, the solder containing the indium electroplating layer is placed in a high-temperature pipeline at 350-450°C under an argon protective atmosphere, The time is 30-50min; then placed in a tube furnace at 160-180°C, diffused for 6-10h; finally annealed at 450-...

Embodiment 2

[0030] A preparation method for electroforming of silver solder with high indium content, the specific steps are as follows:

[0031] (1) Electroplating is carried out with silver solder as the cathode and indium plate as the anode. The composition of the electroplating solution is: In 2+ Metal salt 20g / L, strong acid 40ml / L, additive 2g / L, current density: 2A / dm 2 , temperature 30°C, pole spacing 15mm, stirring speed 350r / min, pH=0.6, electroplating time: 4min;

[0032] (2) Diffusion treatment is carried out on the silver solder containing indium electroplating layer on the surface after electroplating. The diffusion treatment method is as follows: firstly, the solder containing indium electroplating layer is placed in a high-temperature pipeline at 350°C under an argon protective atmosphere for a time of 30min; then placed in a tube furnace at 160°C, diffused for 6h; finally annealed at 450°C, and then rolled or drawn.

[0033] In step (1), the thickness of the indium plat...

Embodiment 3

[0036] A preparation method for electroforming of silver solder with high indium content, the specific steps are as follows:

[0037] (1) Electroplating is carried out with silver solder as the cathode and indium plate as the anode. The composition of the electroplating solution is: In 2+ Metal salt 30g / L, strong acid 45ml / L, additive 5g / L, current density: 2.2A / dm 2, temperature 32°C, pole spacing 15.5mm, stirring speed 360r / min, pH=0.62, electroplating time: 5min;

[0038] (2) Diffusion treatment is carried out on the silver solder containing indium electroplating layer on the surface after electroplating. The diffusion treatment method is as follows: firstly, the solder containing indium electroplating layer is placed in a high-temperature pipeline at 360°C in an argon protective atmosphere for a time of 32min; then placed in a tube furnace at 162°C, diffused for 6.2h; finally annealed at 455°C, and then rolled or drawn.

[0039] In step (1), the thickness of the indium p...

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Abstract

The invention discloses an electroforming preparation method of high-indium-content silver solder. The specific steps are as follows: (1) Electroplating is performed with the silver solder as the cathode and the indium plate as the anode. The composition of the electroplating solution is: In2+metal salt 20‑ 130g / L, 40‑120ml / L strong acid or 35‑65 g / L medium strong acid, 2‑80 g / L additive; 450°C high-temperature pipe for 30-50min; then placed in a tube furnace at 160-180°C for 6-10h; finally annealed at 450-500°C, and then rolled or drawn. The electroforming preparation method of the present invention has fast deposition rate, short plating time, high preparation efficiency, simple and convenient operation, and low cost, and solves the problems of low indium content and poor plasticity in the current AgCuZnIn solder, and the prepared solder The content of indium is high, which can reach 2.5-15%, and the solder has a low melting point, good plasticity, easy processing and preparation, and good wettability.

Description

technical field [0001] The invention belongs to the technical field of welding materials, and in particular relates to an electroforming preparation method of silver solder with high indium content. Background technique [0002] Silver solder has a moderate melting point, good workmanship, good strength, toughness, thermal conductivity, electrical conductivity and corrosion resistance, and can be used to join low-carbon steel, structural steel, high-temperature alloys, copper and its alloys, etc. Adding Cd and In elements to the AgCuZn ternary alloy can significantly reduce the liquidus of the ternary alloy and improve its brazing process, but the silver solder containing Cd element is extremely harmful to human beings, and its application is subject to certain restrictions. limit. At the same time, in the AgCuZn solder containing In, the In element should not be too high (less than 3.5%), otherwise the plasticity of the solder will be reduced and it will easily become brit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/54C25D5/50B23K35/30B23K35/40
CPCB23K35/3006B23K35/404C25D3/54C25D5/50
Inventor 吴金妹王星星韦乐余
Owner NORTH CHINA UNIV OF WATER RESOURCES & ELECTRIC POWER
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