A cyanide-free chemical gold plating solution and its gold plating process applied in the field of wafer advanced packaging
A technology in the field of chemical gold plating, which is applied in the field of cyanide-free chemical gold plating solution and its gold plating process, and can solve problems such as voids, inability to achieve the effect of uniform plating, cracks, etc.
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Embodiment 1
[0060] A kind of cyanide-free chemical gold-plating solution, every 1 liter of described cyanide-free chemical gold-plating solution comprises following composition:
[0061]
[0062] Adjust the pH to 7.2 with sulfuric acid or potassium hydroxide;
[0063] The balance is water.
[0064] Operating temperature: 50°C.
[0065] Using the gold-plating solution prepared by this component, after using the gold-plating method to carry out cyanide-free gold-plating on wafer packaging products, the thickness of the gold finally obtained is 0.3 microns; using the solution and gold-plating process of the present invention, the whole process only needs 20 minutes to complete ; And the crystal size of the obtained gold-plated layer is consistent, without voids and cracks; the surface is smooth.
Embodiment 2
[0067] A kind of cyanide-free chemical gold immersion solution, every 1 liter of described cyanide-free chemical gold immersion solution comprises following composition:
[0068]
[0069] Adjust the pH to 8 with sulfuric acid or potassium hydroxide;
[0070] The balance is water.
[0071] Operating temperature: 60°C.
[0072] Using the gold plating solution prepared by this component, after using the gold plating method to carry out cyanide-free gold plating on wafer packaging products, the gold thickness is 0.2 microns; using the solution and gold plating process of the present invention, the whole process only needs 12 minutes to complete; and obtained The crystallization of the gold-plated layer is consistent in size, without voids or cracks; the surface is smooth.
Embodiment 3
[0074]
[0075]
[0076] Adjust the pH to 9 with sulfuric acid or potassium hydroxide;
[0077] The balance is water.
[0078] Operating temperature: 80°C.
[0079] Using the gold plating solution prepared by this component, after using the gold plating method to carry out cyanide-free gold plating on wafer packaging products, the gold thickness is 0.05 microns; using the solution and gold plating process of the present invention, the whole process only needs 2 minutes to complete; and obtained The crystallization of the gold-plated layer is consistent in size, without voids or cracks; the surface is smooth.
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