504results about How to "Produce efficiently" patented technology

An apparatus generates femtosecond pulses from laser amplifiers by nonlinear frequency conversion. The implementation of nonlinear frequency-conversion allows the design of highly nonlinear amplifiers at a signal wavelength (SW), while still preserving a high-quality pulse at an approximately frequency-doubled wavelength (FDW). Nonlinear frequency-conversion also allows for limited wavelength tuning of the FDW. As an example, the output from a nonlinear fiber amplifier is frequency-converted. By controlling the polarization state in the nonlinear fiber amplifier and by operating in the soliton-supporting dispersion regime of the host glass, an efficient nonlinear pulse compression for the SW is obtained. The generated pulse width is optimized by utilizing soliton compression in the presence of the Raman-self-frequency shift in the nonlinear fiber amplifier at the SW. High-power pulses are obtained by employing fiber amplifiers with large core-diameters. The efficiency of the nonlinear fiber amplifier is optimized by using a double clad fiber (i.e., a fiber with a double-step refractive index profile) and by pumping light directly into the inner core of this fiber. Periodically poled LiNbO3 (PPLN) is used for efficient conversion of the SW to a FDW. The quality of the pulses at the FDW can further be improved by nonlinear frequency conversion of the compressed and Raman-shifted signal pulses at the SW. The use of Raman-shifting further increases the tuning range at the FDW. For applications in confocal microscopy, a special linear fiber amplifier is used.

A thermally enhanced semiconductor package and a fabrication method thereof are provided. A plurality of conductive bumps are formed on bond pads on an active surface of a chip. A heat sink is attached to an inactive surface of the chip and has a surface area larger than that of the chip. An encapsulation body encapsulates the heat sink, chip and conductive bumps, while exposing a bottom or surfaces, not for attaching the chip, of the heat sink and ends of the conductive bumps outside. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with a plurality of openings for exposing predetermined portions of the conductive traces. A solder ball is implanted on each exposed portion of the conductive traces.

A switchable stereoscopic display system, wherein the switchable stereoscopic display system can display two-dimensional and three-dimensional images, includes: an organic light emitting diode (OLED) display device; Electronics that rapidly updates individual OLEDs; and a linearly polarizer for the OLED display device. Additionally, a circular polarizing layer changes light from linearly polarized light to circular polarized light. A polarization layer, on top of the circular polarization layer, switches a polarization direction of emitted light within the OLED display device. Other electronics switches the polarization direction within independent segments of the polarization layer. Refreshed OLEDs are synched with the independent segments of the polarization layer.

A structure having a parameter storing unit which stores a parameter to be used when a numeric control apparatus drives and controls the numeric control machine tool, a program interpretation unit which reads a part program to generate machining data for each block, an interpolation unit which interpolates a movement path instructed in an axis moving instruction referring to a parameter stored in the parameter storing unit and using an interpolation algorithm which is identical to a driving and controlling interpolation algorithm of the numeric control apparatus, an interpolation count counting unit which counts an interpolation count in the movement path, and an axis moving time calculating unit which multiplies an interpolation cycle when the numeric control apparatus drives and controls the numeric control machine tool and the counted interpolation count to calculate an axis moving time.

A heat sink package structure and a method for fabricating the same are disclosed. The method includes mounting and electrically connecting a semiconductor chip to a chip carrier, forming an interface layer or a second heat dissipating element having the interface layer on the semiconductor chip and installing a first heat dissipating element having a heat dissipating portion and a supporting portion onto the chip carrier. The method further includes forming openings corresponding to the semiconductor chip in the heat dissipating portion, and forming an encapsulant for covering the semiconductor chip, the interface layer or the second heat dissipating element, and the first heat dissipating element. A height is reserved on top of the interface layer for the formation of the encapsulant for covering the interface layer. The method further includes cutting the encapsulant along edges of the interface layer, and removing the redundant encapsulant on the interface layer. Therefore, the drawbacks of the prior art of the burrs caused by a cutting tool for cutting the heat dissipating element and wearing of the cutting tool are overcome.

The invention discloses a parallel computing method capable of expanding a precision Logistic chaotic sequence, comprising the following steps: (1) saving initial parameters x0 and mu integer quantization to an one-dimensional array, and arranging the precision required to be achieved or designating iterative times; (2) the first part of the parallel computational algorithm x=x*(1-x): utilizing amatrix to save and compute the intermediate result, modifying the length of a dynamic array and saving the computation result to the dynamic array; (3) the second part of the parallel computational algorithm x=mu*x: saving the computation result to the dynamic array; (4) and if the precision or the iterative times achieves the required value, acquiring the chaotic sequence in the dynamic array, thus the computation is finished, and otherwise, transferring to step (2). The method of the invention fully utilizes the properties of a chaotic system, provides the chaotic sequence of a more expansive mapping space, can be used in the fields of secret communication, information safety and so on, and is especially suitable for encryption, storage and network transmission of graph, image and multimedia and other information.

A method for producing a chondroitin sugar chain comprises at least the following step: a step of allowing “a glucuronic acid donor”, “an N-acetyl galactosamine donor”, “a sugar receptor” and “a bacterial cell enzyme which synthesizes chondroitin” to coexist in a reaction system in the presence of a surfactant. Here, the surfactant is preferably selected from n-nonyl-β-D-thiomaltopyranoside, sucrose monocaproate and sucrose monolaurate. The chondroitin sugar chain has all the following properties 1) to 3): 1) a weight average molecular weight: 50,000 or more when it is measured by gel filtration chromatography, 2) it is completely degraded to disaccharides with chondroitinase ABC, 3) when the sugar chain is decomposed with chondroitinase ABC and the decomposed products are subjected to a disaccharide analysis, substantially all of them correspond to an unsaturated disaccharide unit of chondroitin.

A method for producing a gear assembly 108 which allows for the relatively efficient transfer of energy. Assembly 108 is created by forming a first member 10 and a second member 40, by placing pinion support members 80 within the second member 40, by placing gear assemblies or pinions 63 upon each of the pinion support members 80, and by coupling the pinion support members 80 to the first member 10, thereby forming gear assembly 108.