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Graphene/metal composite material and preparation method thereof

A technology of metal composite materials and metal materials, which is applied in the field of graphene/metal composite materials and its preparation, can solve the problems of complex preparation process, time-consuming and labor-consuming, and inferior quality

Inactive Publication Date: 2016-11-09
SHENZHEN MICRO & NANO INTEGRATED CIRCUITS & SYST RES INST
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AI Technical Summary

Problems solved by technology

The current manufacturing method of graphite heat sink is mainly to heat the polymer film to 1000 ℃ high-temperature carbonization, and then add the calendering process to make it. The preparation process is complicated, time-consuming and labor-intensive, a lot of energy is wasted, and the cost is high; , the thermal conductivity of graphite material can reach 150-1500W / m K in the plane, which is much inferior to the thermal conductivity of graphene 5300W / m K

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  • Graphene/metal composite material and preparation method thereof
  • Graphene/metal composite material and preparation method thereof
  • Graphene/metal composite material and preparation method thereof

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Embodiment Construction

[0011] The technical solutions of the present invention will be further described in more detail below in conjunction with specific embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0012] Graphene is carbon atoms with sp 2 Novel two-dimensional (2D) atomic crystals composed of hybrid-connected monoatomic layers possess a series of rich and novel physical properties. The unique physical, chemical and mechanical properties of graphene provide the impetus for the development of composite materials. Graphene is an ideal reinforcement for various composite materials, and it is expected to develop polymer-based, metal-based and other composite materials with various and excellent properties. G...

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Abstract

The invention discloses a preparation method of a graphene / metal composite material. The preparation method comprises the steps that graphite oxide is obtained, and a graphene oxide dispersion system is prepared through the graphite oxide; a metal material is obtained and cleaned; an electro-deposition solution used for preparing the graphene / metal composite material is prepared through the graphene oxide dispersion system; and electro-deposition equipment parameters are set, the electro-deposition solution and the metal material are placed in the electro-deposition equipment, and the graphene / metal composite material is obtained after the equipment is powered on. By the adoption of the preparation method, the graphene / metal composite material which is high in heat dissipation performance and oxidization resistance and good in hydrophobicity can be obtained through a simple and convenient experimental facility easy to set up in an efficient and environmentally friendly mode.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a graphene / metal composite material and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of electronic technology, the volume of electronic components has been continuously reduced, and the integration of circuit chips has been continuously increased. High-power electronic components will generate a lot of heat. If effective heat dissipation measures are not taken, the heat will not be dissipated in time, which will reduce the life of the device and affect the stability of the equipment. Heat sinks are usually used to dissipate heat from power devices to the surrounding space. However, the heat sink takes up a lot of volume. In some special applications, electronic devices are required to have high power while occupying a small volume. This requires reducing the size of the heat sink while ensuring reliable heat dissipat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D9/04
CPCC25D9/04
Inventor 曹恒振马乾力王丹
Owner SHENZHEN MICRO & NANO INTEGRATED CIRCUITS & SYST RES INST
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