The invention relates to a method for increasing the interlayer
binding force of a superconducting narrow headed wire. The method comprises the following steps: S1, stacking a superconducting strip and other
metal strips which are equal in width, and then
tinning and packaging the stacked superconducting strip and other
metal strips into a high-temperature superconducting narrow headed wire through a
tinning furnace; S2,
punching holes in the surface of the narrow-headed wire obtained in the step S1, wherein the holes are through holes; S3, re-packaging the through holes of the narrow
pile lines obtained in the step S2. According to the invention, a
tin-plated packaging mode is adopted after the narrow headed wire is punched, and a'
soldering tin column 'is formed by penetrating through all upper and lower
layers of the narrow headed wire, so the weight and the size of the narrow headed wire are not influenced, the manufacturing cost is not greatly increased, and the feasibility is provided for practical
engineering application; in mechanical operations of twisting, bending and the like, compared with a
metal sheath, the
soldering tin column is smaller in size, higher in
toughness and capable of better meeting application requirements under working conditions.