The invention discloses a pressure-sensitive
adhesive for
wafer grinding and a preparation method thereof. The
adhesive comprises a plastic base material, an
adhesive layer coated on the base plastic material, and a release film which covers the adhesive layer. The preparation method of the pressure-sensitive adhesive comprises the following steps of: A) preparing a
prepolymer; B) preparing an adhesive; C) preparing an adhesive tape. Compared with the prior art, the preparation method has the advantages that the
dose and addition way of an initiating agent as well as the polymerizing temperature are controlled to realize the maximum molecular weight as well as high
cohesive strength, and the problems of relatively high peeling strength and small shearing strength of the traditional pressure-sensitive adhesive are solved. In addition, a hard
monomer added brings the pressure-sensitive adhesive with high shearing strength, and the demand on
wafer grinding is met. The pressure-sensitive adhesive for
wafer grinding is different from other adhesive tapes for wafer grinding in that a
silane coupling agent bringing
water resistance is directly polymerized onto a
polymer molecular chain, instead of being directly added. Therefore, the migration of micromolecule in storage process is avoided, and the resulting influence to the effect or the resulting residue on a wafer is removed.