93results about How to "Low halogen content" patented technology

A polymer compound for an organic electroluminescence device, which has a halogen element content of 50 ppm by mass or less.

The invention discloses an underwater coating anti-pollution and anti-corrosion epoxy coating and a preparation method thereof. The underwater anti-pollution and anti-corrosion epoxy coating provided by the invention can solve the difficult problem that an amine type curing agent which is matched with the epoxy coating used at normal temperature for underwater coating reacts with water and carbon dioxide in the water or air to generate carbonates, so that a bonded layer is isolated by the carbonates, the adhesion is greatly reduced, the bonding force is reduced by above 50% in comparison with a dry environment, a coat is easy to shed, and the anti-corrosion capability is poor. The anti-pollution and anti-corrosion coating disclosed by the invention has the advantages of good underwater coating anti-corrosion performance, strong adhesion, great impact resistance and good flexibility, and can effectively prevent the problems that a paint film is damaged, and the damages and corrosion of a steel plate and concrete are accelerated due to the parasitic attachment of marine organisms.

A flame retardant epoxy resin composition comprises a phosphorus atom-containing flame retardant polyester resin in addition to essential components of an epoxy resin and a curing agent. The phosphorus atom-containing flame retardant polyester resin is obtained by a condensation reaction or a polycondensation reaction of a reactive phosphorus-containing compound represented by the structural formula (I). By use of the phosphorus atom-containing flame retardant polyester resin as a halogen-free flame retardant, it is possible to achieve flame retardancy, reduce an amount of poisonous gas emitted when ignited, and improve moldability. In addition, a cured product of this epoxy resin composition is excellent in heat resistance, water resistance, chemical resistance, solder resistance, moisture resistance and tracking resistance as well as the flame retardancy.

The invention relates to a method for separating holocellulose in wood fibers by using a choline deep-eutectic solvent. The method comprises the following steps: pretreatment of raw materials, benzene-alcohol extraction, preparation of the deep-eutectic solvent, treatment of the deep-eutectic solvent, separation of the holocellulose and recovery of the solvent. The method is characterized in thatchloride ions in the choline deep-eutectic solvent are replaced under a mild condition, a non-toxic hydrogen bond donor is matched, and the deep-eutectic solvent with low halogen content is prepared and is used for separating holocellulose in the wood fibers. The method is high in holocellulose extraction rate, high in purity, simple to operate, obvious in effect, high in practicability, small inpollution and easy to popularize.

The invention belongs to the field of chemical and high molecular material auxiliaries, and discloses a novel expansion-type fire retardant. The fire retardant is formed by compounding polyamino cyclotriphosphazene and triglycicy (2-hydroxyethyl) cyanuric acid (seik for short), wherein the polyamino cyclotriphosphazene serves as an acid source and an air source and the seik serves as a carbon source and has the function of an air source at the same time. The mass ratio of the polyamino cyclotriphosphazene to the seik is 20:80-80:20, and preferably the mass ratio is 50:50. The expansion-type fire retardant has good inflaming retarding effects on polypropylene and polyethylene. When the use amount of the fire retardant is 20% of the total mass of the fire retardant material, the vertical burning level of the polyethylene and the polypropylene reaches FV-0(3.2mm). In addition, the chlorinity of the fire retardant is low (lower than 2%), and therefore gas generated by burning only contains little chlorine and environmental friendliness is achieved.

This invention provides a selfsupporting substrate which consists of a n-type conductive aluminum nitride semiconductor crystal and is useful for manufacturing the vertical conductive type AlN semiconductor device.The n-type conductive aluminum nitride semiconductor crystal, by which the selfsupporting substrate is made up, contains Si atom at a concentration of 1×1018 to 5×1020 cm−3, is substantially free from halogen atoms, and substantially does not absorb the light having the energy of not more than 5.9 eV. The selfsupporting substrate can be obtained by a method comprising the steps of forming an AlN crystal layer on a single crystal substrate such as a sapphire by the HVPE method, preheating the obtained substrate having the AlN crystal layer to a temperature of 1,200° C. or more, forming a second layer consisting of the n-type conductive aluminum nitride semiconductor crystal is formed on the AlN crystal layer in high rate by the HVPE method and separating the second layer from the obtained laminate.

A process for production a high purity epoxy compound with total chlorine content of 500 ppm or less is characterized in that alkali metal hydroxide is added to a bifunctional epoxy compound represented by the general formula (I), in which content of the component with n=0 is not less than 70% and less than 100%, and that reaction is caused to take place at a temperature of 95-150° C. to produce a multi-functional epoxy compound represented by the general formula (II).

The invention belongs to the technical field of adhesives, and particularly relates to an underfill adhesive, as well as a preparation method and application thereof. The underfill adhesive comprises 100 parts of an epoxy resin mixture, 20 to 100 parts of epoxy modified acrylate resin, 5 to 50 parts of a latent curing agent, 5 to 30 parts of an epoxy active diluting agent, 5 to 60 parts of acrylic ester, 0.1 to 5 parts of a thermal initiator and 0.1 to 10 parts of an additive. According to the underfill adhesive, as well as the preparation method and application thereof, epoxy modified acrylate resin is used as a bridging agent to bind an epoxy resin curing system and an acrylic ester curing system, so that high performance of epoxy resin can be achieved, and the viscosity can be greatly reduced by acrylic ester without changes in performance.

The invention provides a coloring photo-curing resin composition and condensate thereof, dry film and printing circuit board, which can form a solder resist layer with excellent concealment of color change caused by oxidation of copper circuit. The photo-curing resin composition can develop through alkali water solution and contains carboxylic acid resin (A), photopolymerization initiator (B), compound (C) with more than two olefinic unsaturated radicals and red colorant (D).

The invention relates to a cyclic quaternary ammonium salt electrolyte, a preparation method and an application therefor. The preparation method comprises the steps of enabling an inorganic aqueous alkali, organic secondary amine and alkyl dihalide to react to obtain halogenated cyclic quaternary ammonium salt reacting liquid; dehydrating the halogenated cyclic quaternary ammonium salt reacting liquid to obtain a solid powder mixture; dissolving the solid powder mixture into anhydrous organic solvent, and filtering to obtain an organic solution of the halogenated cyclic quaternary ammonium salt; adding ammonium salt of high purity acid into the organic solution of the halogenated cyclic quaternary ammonium salt, performing a backflow reaction, and then performing filtering, recrystallization, filtering, and vacuum drying to obtain the cyclic quaternary ammonium salt electrolyte. The preparation method is low in cost of the raw materials, and high in cyclization selectivity; the purifying method is simple and easy to implement, high in efficiency and low in cost; in addition, the preparation method has low requirement on equipment, and the industrial production of the cyclic quaternary ammonium salt electrolyte can be achieved easily; and in addition, the prepared cyclic quaternary ammonium salt electrolyte is low in content of halogen, the purity can reach more than 99%, and the yield can reach more than 90%.

The invention relates-an environmentally-friendly underfill adhesive having a low dielectric constant, and a preparation method thereof, and belongs to a one-component epoxy resin adhesive. The underfill adhesive comprises, by weight, 30-38 parts of epoxy resin, 8-20 parts of a curing agent, 33-46 parts of a filler, 2-5 parts of a diluent, 6-9 parts of a toughener, 0.3-0.5 part of a silane coupling agent, 0.3-0.5 part of an antifoaming agent and 0.2-0.8 part of a pigment. The underfill adhesive prepared in the invention has the advantages of low halogen content, low dielectric constant, high arc resistance, high weather resistance and the like, so packaging components have a high environmental protection property, a high electrical insulation property and a high reliability.

To eliminate a halogen group of a halogen group-terminated vinyl polymer, the present invention provides a method to treat said polymer with an oxy anion compound to thereby eliminate a terminal halogen group easily. Thus, it is possible to improve the storage stability of the polymer or a curable composition comprising said polymer and to prevent various materials coming into contact with the reaction apparatus or the polymer from being corroded. In particular, it is possible to improve the storage stability of a crosslinkable silyl group-containing polymer.

The invention discloses an ionic liquid-type phosphate fire retardant and a preparation method thereof. The formula of the ionic liquid-type phosphate fire retardant is shown in the description. The R in the formula is equal to CnH2n+1, wherein n may be 1, 3 or any even number between 2 and 18; and X may be Cl, Br, BF4, PF6 or N(CF3SO2)2. As the module of the fire retardant disclosed by the invention contains a 1-oxo-4-hydroxymethyl-2,6,7-trioxa-1-phabicyclo[2.2.2]octane(PEPA) framework, the fire retardant combines the acid source and the carbon source of an intumescent flame retardant (IFR). The fire retardant has the characteristics of high thermostability and high charring performance. The fire retardant can combine external gas sources such as ammonium polyphosphate to form a new IFR, which has high fire retarding efficiency and high compatibility with polymeric substrates.

To provide a colored photocurable resin composition capable of forming a solder resist layer excellent in property of hiding defective appearance of a copper circuit attributed to tarnish by oxidation. The photocurable resin composition can be developed with a dilute alkali solution and comprises: (A) a carboxylic acid-containing resin; (B) a photopolymerization initiator; c a compound having two or more ethylenically unsaturated groups per molecule; and (D) a red colorant.

The invention discloses a preparation method of a dibasic ester aromatic ring saturation catalyst containing a benzene ring. According to the preparation method, a carrier with a specific macroporous structure and a halogen-free noble metal precursor are adopted, a Ru-containing catalyst is prepared through a special impregnation method, and the catalyst with the total pore volume ranging from 0.7 mg / g to 2.5 ml / g is prepared after low-temperature drying and calcination are conducted, wherein the proportion of pores with the pore volume larger than 15 nm is not lower than 55%, and the specific surface area ranges from 90 cm<2> / g to 240 cm<2> / g; the active component is the noble metal Ru, and the content of the simple substance Ru ranges from 0.02 wt% to 1.3 wt%; the chlorine content of the catalyst is smaller than or equal to 0.05 wt% of the total weight of the catalyst, the active component is distributed on the catalyst in an eggshell or egg white mode, and the content of the active component in the carrier is not larger than 0.01 wt%. According to the preparation method, the use ratio of the noble metal and the activity of the catalyst can be increased; meanwhile, the intoxicating phenomenon of the active component is restrained, the catalyst can be applied to the hydrogenation process of terephthalic acid dibasic ester or isophthalic acid dibasic ester and the hydrogenation process of o-benzene dibasic ester or p-benzene dibasic ester or m-benzene dibasic ester, and the conversion rate of reactants and the selectivity both reach 99 percent or above.

Disclosed is a branched polyarylene sulfide resin including an —S— substituent group with a cleaved disulfide compound which has a melt viscosity as measured at a halogen content of 4,000 ppm or less, a temperature of 330° C. and a shear rate of 2 sec−1 of 1.0×104 to 50.0×104 Pa·s and a melt viscoelasticity tan δ as measured at a temperature of 310° C. and an angular velocity of 1 rad / sec of 0.1 to 0.6.

The present invention generally relates to a resin composition, a cured resin, a sheet-like cured resin, a laminated body, a prepreg, electronic parts, single and multilayer circuit boards comprising a cyanate ester polymer and condensed phosphate ester, for use in single and multilayer circuit boards that are especially useful in the high-frequency range of above 100 MHz.

The invention relates to a room-temperature-storage type acrylate underfill adhesive and a preparation method thereof. The underfill adhesive comprises, by weight, 50-70 parts of modified acrylate resin, 20-30 parts of acrylate monomer, 1.0-5.0 parts of initiator, 0.1-1.0 part of inhibitor, 0.1-5.0 parts of auxiliaries and 0-5.0 parts of pigment. The room-temperature-storage type acrylate underfill adhesive is low in system halogen content, safer and more environment friendly, low in guarant viscosity, good in wettability and high in reliability, fully meets requirements on production process and reliability of SMT (surface mount technology), has excellent stability at room temperature and can be stored and transported at room temperature without cold preservation, and transportation and use costs are greatly reduced.

A multi-stage process and system for formation of a polyarylene sulfide is described. A first polymerization stage of the formation process can include reaction of a sulfide monomer with a dihaloaromatic monomer to form a prepolymer. A second polymerization stage can include further polymerization of the prepolymer with a sulfur-containing monomer and a dihaloaromatic monomer to form a low halogen content polyarylene sulfide. The amount of sulfur utilized in the second polymerization stage is a low fraction of the total amount of sulfur utilized in the multi-stage process.

The invention provides an environment-friendly high and low temperature resistant and oil resistant flame-retardant nano-composite thermoplastic elastomer and a preparation process thereof. The nano-composite thermoplastic elastomer is prepared from the following components in parts by weight: 60 to 75 parts of NBR (Nitrile-Butadiene Rubber) nano-composite particles, 25 to 40 parts of PVC (polyvinyl chloride) premolding powder, 10 to 15 parts of modifier ABS (Acrylonitrile Butadiene Styrene), 10 to 15 parts of first flame retardant, 5.0 to 10 parts of second flame retardant, 0.8 to 1.2 parts of activating agent, 0.2 to 0.4 part of vulcanizing agent, 0.8 to 1.2 parts of anti-aging agent, 0.5 to 1.0 part of accelerator, 0.3 to 0.5 part of ultraviolet light absorber and 1.0 to 2.0 parts of processing aid. The thermoplastic elastomer provided by the invention is green and environment-friendly, resistant to ozone and excellent in mechanical property, high and low temperature resistance, oil immersion resistance and flame retardance and can be used for sheaths and shoes of flame-resistant, oil-resistant and heat-resistant flexible wires, elastomer cables, oil-resistant heavy flexible wires, movable cables and the like, as well as oil pipes and the like.

The invention relates to an anti-pre-crosslinking rapid-solidification low-smoke zero-halogen flame-retardant silane crosslinking nano-modified polyolefin composition. The composition is prepared from, by weight, 100 parts of zero-halogen flame-retardant silane grafted nano-modified polyolefin matrixes A and 4-6 parts of catalyst master batches B. By the adoption of a fractional step method, a preparation method includes the steps that the zero-halogen flame-retardant silane grafted nano-modified polyolefin matrixes A and the catalyst master batches B are prepared and then mixed evenly, wherein the zero-halogen flame-retardant silane grafted nano-modified polyolefin matrixes A are formed by mixing nano-modified polyolefin, zero-halogen flame-retardant master batches, a silane grafted system and anti-pre-crosslinking agents, and the catalyst master batches B are formed by mixing carrier resin polyolefin and a rapid catalyst system. By the application of the method, the anti-pre-crosslinking low-smoke zero-halogen flame-retardant silane crosslinking nano-modified polyolefin composition capable of achieving rapid crosslinking under natural conditions can be prepared, the performance of the composition meets using requirements, and particularly, the composition can also be used for producing heat-resistant flame-retardant pipes when serving as a low-smoke zero-halogen flame-retardant silane crosslinking polyolefin cable material.

The invention provides a low-halogen underfill adhesive, components of the underfill adhesive comprise a silica-modified epoxy resin, or comprise a silica-modified epoxy resin and an acrylic monomer.The halogen content of the underfill adhesive is not more than 100 ppm; preferably, the halogen content of the underfill adhesive is not more than 80 ppm; more preferably, the halogen content of the underfill adhesive is not more than 40 ppm. The low-halogen underfill adhesive provided by the invention has the advantages of low viscosity, low halogen content, good mechanical property, good heat resistance, low thermal expansion coefficient, and the like; and the application prospects are wider.

The invention discloses halogen-free flame-retardant epoxy resin composition for LED encapsulation. The halogen-free flame-retardant epoxy resin composition comprises the following raw materials by mass percent: 30-50% of epoxy resin, 10-20% of DOPO, 0.1-1% of an addition accelerator, 30-50% of methylhexahydrophthalic anhydride, 0.5-2% of a curing accelerator and 0.1-0.5% of a defoaming agent. The invention further discloses a preparation method for the composition. The preparation method is simple in process step and easy to realize, and can be used for quickly preparing a halogen-free flame-retardant epoxy resin composition product for LED encapsulation. The halogen-free flame-retardant epoxy resin composition for LED encapsulation provided by the invention is reasonable in formula, very low in halogen content (not more than 900 ppm) and excellent in flame resistance, and adopts a phosphorus flame retardant technology. An encapsulated LED lamp is good in light transmittance and high in hardness, has small influence on TG (glass transition temperature) and is particularly suitable for LED encapsulation protection.

The invention discloses a low-smoke-zero-halogen high-flame-retardance power cable which structurally comprises a guiding wire. A flame retardant insulation layer is arranged on the outer side of the guiding wire. A carbon fiber flame retardant layer is arranged on the outer side of the flame retardant insulation layer. A foam flame retardant layer is arranged on the outer side of the carbon fiber flame retardant layer. The carbon fiber flame retardant layer is connected with the flame retardant insulation layer through a cross-linking layer, and the carbon fiber flame retardant layer is connected with the foam flame retardant layer through a cross-linking layer. According to the low-smoke-zero-halogen high-flame-retardance power cable, power cable flame retardant capacity is improved, and meanwhile release of toxic smoke is lowered during burning.

An object of the present invention is to provide an environmentally safe golf ball having excellent resilience. The present invention provides a golf ball having constituting members, wherein at least a part of the constituting members is formed from a rubber composition containing (a) a base rubber, (b) a co-crosslinking agent, (c) a crosslinking initiator, and (d) an organic sulfur compound, wherein the organic sulfur compound includes a disubstituted compound of thiophenol, disulfide and / or thiophenol metal salt with Br, F or CF3 only at ortho positions.

Provided is a 5,6-diaryl-2-pyrazyl triflate, its synthetic method, and a method for synthesizing an organometallic complex having a triarylpyrazine ligand from the 5,6-diaryl-2-pyrazyl triflate. The triflate is readily obtained from the corresponding 5,6-diarylpyrazin-2-ol, and the palladium-catalyzed coupling of the 5,6-diaryl-2-pyrazyl triflate with an arylboronic acid derivative leads to a high yield of a triarylpyrazine derivative having high purity. The use of the triarylpyrazine derivative in the reaction with a metal compound such as a metal chloride results in an ortho-metallated organometallic complex with high purity. The high purity of the organometallic complex contributes to the extremely high durability of a light-emitting element.

The invention belongs to the field of chemical and high molecular material auxiliaries, and discloses a novel expansion-type fire retardant. The fire retardant is formed by compounding polyamino cyclotriphosphazene and triglycicy (2-hydroxyethyl) cyanuric acid (seik for short), wherein the polyamino cyclotriphosphazene serves as an acid source and an air source and the seik serves as a carbon source and has the function of an air source at the same time. The mass ratio of the polyamino cyclotriphosphazene to the seik is 20:80-80:20, and preferably the mass ratio is 50:50. The expansion-type fire retardant has good inflaming retarding effects on polypropylene and polyethylene. When the use amount of the fire retardant is 20% of the total mass of the fire retardant material, the vertical burning level of the polyethylene and the polypropylene reaches FV-0(3.2mm). In addition, the chlorinity of the fire retardant is low (lower than 2%), and therefore gas generated by burning only contains little chlorine and environmental friendliness is achieved.

This invention provides a self supporting substrate which consists of a n-type conductive aluminum nitride semiconductor crystal and is useful for manufacturing the vertical conductive type AlN semiconductor device. The n-type conductive aluminum nitride semiconductor crystal, by which the self supporting substrate is made up, contains Si atom at a concentration of 1×1018 to 5×1020 cm−3 is substantially free of halogen atoms and substantially does not absorb the light having the energy of not more than 5.9 eV. The self supporting substrate can be obtained by a method comprising the steps of forming an AlN crystal layer on a single crystal substrate such as a sapphire by the HVPE method, preheating the obtained substrate having the AlN crystal layer to a temperature of 1,200° C. or more, forming a second layer consisting of the n-type conductive aluminum nitride semiconductor crystal is formed on the AlN crystal layer in high rate by the HVPE method and separating the second layer from the obtained laminate.

A granular polyarylene sulfide; (i) the granular polyarylene sulfide containing an —S— substituent at the terminal, the substituent being formed by cleavage of a disulfide compound; (ii) the granular polyarylene sulfide being an oversize fraction after sifting with a sieve having a mesh size of at least 38 μm; (iii) the granular polyarylene sulfide having a halogen content of at most 1,500 ppm; and (iv) the granular polyarylene sulfide being a granular polyarylene sulfide having a melt viscosity of 3 to 100 Pa·s when measured under conditions at a temperature of 310° C. and a shear rate of 1,200 sec−1. The granular polyarylene sulfide is well balanced in melt viscosity, halogen content, nitrogen content, thermal stability, and yield.