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Underfill adhesive, as well as preparation method and application thereof

An underfill and epoxy resin technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of the decline of adhesive performance, affecting the storage period, and adding a large amount of reactive diluents, etc. The effect of reducing viscosity, excellent performance

Inactive Publication Date: 2015-04-29
东莞市腾威电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Adding too much active diluent will lead to a sharp decline in the performance of the adhesive and will also affect the storage period
In addition, the halogen content of reactive diluents is generally high, and a small amount of addition may not meet the requirements of Halogen Free

Method used

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  • Underfill adhesive, as well as preparation method and application thereof
  • Underfill adhesive, as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The preparation of embodiment 1:

[0029] Add DER332 into the stirring tank first, heat to 80 degrees, and stir until the epoxy resin is completely free of crystals and forms a uniform liquid. Cool to room temperature, add EBECRYL 3701, glycidyl methacrylate, glycidyl o-cresyl ether, SR506, carbon black, and stir for 120 minutes; add Fujicure 1090, and stir for 30 minutes. Use a three-roller to grind to a fineness of less than 5um. Add tert-butyl peroxide-2-ethylhexanoate into the planetary mixer, while vacuuming, keep the vacuum at -0.1MPa, and mix for 45 minutes.

Embodiment 2

[0030] The preparation of embodiment 2:

[0031] Add EPILCON 830LVP, EP-4100HF, PB3600 to the stirred tank and heat to 90 degrees, stir until the epoxy resin is completely free of crystals and forms a uniform liquid. Cool to room temperature, add CYLOMERM100, glycidyl methacrylate, SR506, R833, carbon black, and stir for 90 minutes; add HX-3721, and stir for 30 minutes. Use a three-roller to grind to a fineness of less than 5um. Add tert-butyl peroxide-2-ethylhexanoate into the planetary mixer, and at the same time vacuumize, keep the vacuum at -0.1MPa, and mix for 30 minutes.

Embodiment 3

[0032] The preparation of embodiment 3:

[0033] Add EPILCON 830LVP, EP-4100HF, PB3600 into the stirred tank first, heat to 70 degrees, and stir until the epoxy resin is completely free of crystals and forms a uniform liquid. Cool to room temperature, add EBECRYL3701, glycidyl methacrylate, CN981, SR506, carbon black, and stir for 60 minutes; add PN40, HX3721, and stir for 45 minutes. Use a three-roller to grind to a fineness of less than 5um. Add tert-butyl peroxide-2-ethylhexanoate, ester azobisisobutyronitrile into the planetary mixer, and vacuumize at the same time, keep the vacuum at -0.1MPa, and mix for 45 minutes.

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Abstract

The invention belongs to the technical field of adhesives, and particularly relates to an underfill adhesive, as well as a preparation method and application thereof. The underfill adhesive comprises 100 parts of an epoxy resin mixture, 20 to 100 parts of epoxy modified acrylate resin, 5 to 50 parts of a latent curing agent, 5 to 30 parts of an epoxy active diluting agent, 5 to 60 parts of acrylic ester, 0.1 to 5 parts of a thermal initiator and 0.1 to 10 parts of an additive. According to the underfill adhesive, as well as the preparation method and application thereof, epoxy modified acrylate resin is used as a bridging agent to bind an epoxy resin curing system and an acrylic ester curing system, so that high performance of epoxy resin can be achieved, and the viscosity can be greatly reduced by acrylic ester without changes in performance.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a bottom filling adhesive and a preparation method and application thereof. Background technique [0002] With the development trend of miniaturization, portability and functional diversification of electronic products, underfill has become a necessary process to improve the reliability of electronic products. The solder joints on the chip are miniaturized, the gap between the flip chip and the circuit board is as small as 10um, the viscosity of the general underfill glue is above 1000cps, it is difficult to completely fill the bottom of the chip in a short time, and there may be voids in the glue hole and affect the service life. [0003] The underfill of microelectronics is generally made of epoxy resin, solid latent curing agent and reactive diluent. The reactive diluent is used to reduce the viscosity, and the viscosity is generally above 1000cps. If it is use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J4/06C09J11/08C09J11/06
Inventor 邬全生刘龙华
Owner 东莞市腾威电子材料技术有限公司
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