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Environmentally-friendly underfill adhesive having low dielectric constant, and preparation method thereof

A technology of underfill glue and low dielectric constant, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of non-compliance with environmental protection requirements, poor arc resistance, poor weather resistance, etc., and achieve superior weather resistance, Low halogen environmental protection, effect of low dielectric constant

Active Publication Date: 2018-03-23
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, ordinary underfills have problems such as poor electrical properties, poor arc resistance, poor weather resistance, and do not meet environmental protection requirements.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1) Weigh 310 g of hydrogenated bisphenol A epoxy resin YS-GF015 (Nanjing Yuanshu Pharmaceutical), 120 g of hollow glass microspheres 8054 (Potters, USA), 240 g of spherical silica powder FE920A-SQ (Admatechs, Japan), methyl four Hydrogen phthalate diglycidyl ester XY-813 (Anhui Xinyuan) 50g, core-shell rubber epoxy resin BPF-307 (Japan NIPPON SHOKUBAI) 90g, silane coupling agent KH-560 (Tianjin Reagent Factory) 3g, Defoamer AFCONA-2038 (Malaysia Efcona) 3g, black color paste (US PENNCOLOR) 4g, put into the reaction kettle at a speed of 800 rpm, stir for 3 hours, and mix well;

[0028] 2) Add the mixture obtained in step 1) to the colloid mill JM-L50 (Wenzhou Longxin Machinery), adjust the equipment gap to 0.03mm, shear and grind for 2 hours, and grind fully;

[0029] 3) Cool down the mixture obtained in step 2) to 20-30°C and weigh 180g of curing agent-modified spirocyclic diamine MY-HK-1 (Ajinomoto) into the reaction kettle at a speed of 300 rpm. The temperature in th...

Embodiment 2

[0031] 1) Weigh 200g of hydrogenated bisphenol A epoxy resin EP-4080E (ADEKA, Japan), 160g of polycyclic aromatic epoxy resin HP-4032D (DIC of Japan), 60g of hollow glass microspheres G400 (3M in the United States), spherical Silica powder SO-E2 / 24C (Japan Admatechs) 340g, pentaerythritol tetraglycidyl ether XY-634 (Anhui Xinyuan) 30g, core-shell rubber epoxy resin BPF-307 (Japan NIPPON SHOKUBAI) 80g, silane coupling agent KH -560 (Tianjin Reagent Factory) 3g, defoamer AFCONA-2270 (Malaysia Efcona) 3g, black color paste (US PENNCOLOR) 4g, put into the reaction kettle, rotate at 800 rpm, stir for 3h, mix well;

[0032] 2) Add the mixture obtained in step 1) to the colloid mill JM-L50 (Wenzhou Longxin Machinery), adjust the equipment gap to 0.03mm, shear and grind for 2 hours, and grind fully;

[0033] 3) Cool down the mixture obtained in step 2) to 20-30°C and weigh 180g of curing agent-modified spirocyclic diamine MY-HK-1 (Ajinomoto) into the reaction kettle at a speed of 300 ...

Embodiment 3

[0035] 1) Weigh 180g of hydrogenated bisphenol A type epoxy resin YS-GF015 (Nanjing Yuanshu Pharmaceutical), 120g of biphenyl type epoxy resin NC-3000 (Nippon Kayaku), 90g of hollow glass microspheres 8054 (US Potters), Spherical silica powder FE920A-SQ (Japan Admatechs) 320 g, methyl tetrahydrophthalate diglycidyl ester XY-813 (Anhui Xinyuan) 20 g, thermoplastic resin modified epoxy resin RA840 (US CVC) 60 g, Silane coupling agent KH-560 (Tianjin Reagent Factory) 3g, defoamer AFCONA-2038 (Malaysia Efcona) 3g, black color paste (US PENNCOLOR) 4g, put into the reaction kettle, rotate at 800 rpm, stir 3h, mix well;

[0036] 2) Add the mixture obtained in step 1) to the colloid mill JM-L50 (Wenzhou Longxin Machinery), adjust the equipment gap to 0.03mm, shear and grind for 2 hours, and grind fully;

[0037] 3) Cool down the mixture obtained in step 2) to 20-30°C and weigh 200g of the curing agent phenol aralkyl and its derivative MEH-8000H (Meiwa Kasei, Japan) into the reaction ...

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PUM

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Abstract

The invention relates-an environmentally-friendly underfill adhesive having a low dielectric constant, and a preparation method thereof, and belongs to a one-component epoxy resin adhesive. The underfill adhesive comprises, by weight, 30-38 parts of epoxy resin, 8-20 parts of a curing agent, 33-46 parts of a filler, 2-5 parts of a diluent, 6-9 parts of a toughener, 0.3-0.5 part of a silane coupling agent, 0.3-0.5 part of an antifoaming agent and 0.2-0.8 part of a pigment. The underfill adhesive prepared in the invention has the advantages of low halogen content, low dielectric constant, high arc resistance, high weather resistance and the like, so packaging components have a high environmental protection property, a high electrical insulation property and a high reliability.

Description

technical field [0001] The invention relates to a low dielectric constant environment-friendly bottom filling glue and a preparation method thereof, belonging to the field of adhesives. Background technique [0002] With the continuous innovation of the electrical and electronic industry, more and more requirements are put forward for electronic packaging technology. Environmental protection, multi-functionality, energy saving, and safety have become the main development trends of electronic products. At the same time, high-precision packaging technologies such as BGA and CSP have been widely used in the packaging industry. Underfill is one of the key electronic materials required for microelectronic packaging such as BGA and CSP. Its main function is to protect high-density arrayed solder balls and chips, and to ensure the processability, weather resistance and safety of packaged components. [0003] At present, most underfills have high halogen content, which does not me...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08L2203/206C08L2205/025C08L2205/03C08L2205/04C08L2207/53C09J11/04C09J11/06C09J11/08C09J163/00C08L63/00C08K7/20C08K7/18C08K5/5435
Inventor 闫善涛王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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