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Photocuring resin composition, dry film, and print circuit board

A technology of photocurable resin and composition, applied in secondary processing of printed circuits, optics, optomechanical equipment, etc., can solve problems such as defects, and achieve the effects of reduced halogen gas generation, excellent concealment, and low halogen content

Active Publication Date: 2008-11-12
TAIYO INK MFG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Among the discoloration of such a copper circuit, the worst phenomenon is that even on the same copper circuit, only the edge of the circuit (the part where the resist is thinned) is discolored.
In such a case, when inspecting and mounting the board, it is not aligned with the inspection data, even if it is a good product, it will become defective

Method used

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  • Photocuring resin composition, dry film, and print circuit board
  • Photocuring resin composition, dry film, and print circuit board
  • Photocuring resin composition, dry film, and print circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～7 and comparative example 1～2

[0116] The varnish (A-1) obtained in the synthesis of the carboxylic acid-containing resin and the components shown in Table 1 were kneaded at the compounding ratios shown in Table 1 using a three-roll mill to obtain a photocurable resin composition.

[0117] Table 1

[0118]

[0119]

[0120] About the photocurable resin composition of Examples 1-7 and Comparative Examples 1-2, performance and characteristic were evaluated according to the following evaluation criteria. The results are shown in Table 2.

[0121] Performance evaluation:

[0122]

[0123] The circuit pattern substrate with a copper thickness of 35 μm is polished and ground, washed with water, dried, and then the photocurable resin composition of Examples 1-7 and Comparative Examples 1-2 is coated on the entire surface by the screen printing method. Dry in a circulating drying oven for 60 minutes. After drying, use an exposure device equipped with a metal halide lamp to expose through a step exposure ...

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Abstract

The invention provides a coloring photo-curing resin composition and condensate thereof, dry film and printing circuit board, which can form a solder resist layer with excellent concealment of color change caused by oxidation of copper circuit. The photo-curing resin composition can develop through alkali water solution and contains carboxylic acid resin (A), photopolymerization initiator (B), compound (C) with more than two olefinic unsaturated radicals and red colorant (D).

Description

technical field [0001] The present invention relates to a colored photocurable resin composition not containing halogen-containing phthalocyanine green. More specifically, the present invention relates to a colored photocurable resin composition that does not contain halogen-containing phthalocyanine green and can provide a solder resist layer excellent in concealment of discoloration due to oxidation of copper circuits. Background technique [0002] Typically, solder resist is formed to protect copper circuits. This is useful in that discoloration due to heat and moisture in the copper circuit, electrical discoloration, flaws and contamination on the copper circuit cannot be seen. [0003] The solder resist is applied to the glass epoxy base material on which the copper circuit is formed, an image is formed by exposure, and the film pattern is formed by developing and thermosetting. Since a copper circuit is formed on the base material, when applying a solder resist or la...

Claims

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Application Information

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IPC IPC(8): G03F7/028G03F7/004H05K3/28
CPCC08F2/50G03F7/027G03F7/028G03F7/029G03F7/033G03F7/038G03F7/0388
Inventor 岩山弦人木村纪雄有马圣夫
Owner TAIYO INK MFG
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