The invention provides a flip LED
chip structure and a manufacturing method thereof. The flip LED
chip structure comprises a three-dimensional graphic structure, a
sapphire substrate, a
semiconductor material layer, an N
electrode, a contact
reflective layer, an insulating
isolation layer, a P
electrode and a
welding electrode 10, wherein the
semiconductor material layer comprises an N-type
semiconductor material, a light-emitting layer and a P-type semiconductor material. The manufacturing method comprises the steps of: forming a
mask material on the surface of the
sapphire substrate, manufacturing a
photoresist pattern on the
mask by adopting a photoetching method,
etching the
mask, removing a
photoresist, forming a three-dimensional graphic structure
mask layer on the surface of the substrate, forming the three-dimensional graphic structure on the surface of the substrate, and eliminating the mask finally. According to the flip LED
chip structure and the manufacturing method thereof, the light emergent surface of the
sapphire substrate of the flip LED chip can be designed and processed optically according to
light source requirements of a specific application scene, and the single, periodic or non-periodic three-dimensional graphic structure can be manufactured, thereby realizing the needed
light source requirements.