815results about How to "Light evenly" patented technology

The invention provides a self-oscillation type high power LED constant-current drive circuit with low cost, high reliability and stability and high drive efficiency, the circuit comprises a rectifier and filter circuit, a switching circuit, a steady voltage constant current output circuit, a transformer, a self-oscillation type pulse width modulation signals generating circuit and a current feedback obstruction circuit, wherein the rectifier and filter circuit accesses commercial power into rectification, changes the commercial power into direct current, and then outputs commercial power to the switching circuit to switch in a self-oscillation type with high frequency, then high frequency voltage of the steady voltage constant current output circuit is transformed into direct voltage through the transformer to drive the LED, simultaneously sampling current signals produces jam signals through the current feedback obstruction circuit to control the switching circuit to work, the circuit does not adopt any driving chips and only uses fewer common individual devices to form a self-oscillation type structure to drive the switching circuit and to combine current feedbacks, which realizes constant current driving of the high power LED.

An illuminating device comprises one or more luminescent devices (1). The luminescent device comprises a semiconductor light emitting element (10) emitting a excitation light having an peak within a wavelength range from 350 nm to 430 nm, and a luminescent part (20) comprising a sealing member (22) and a phosphor (21) absorbing the light from the semiconductor light emitting element (10) and emitting a light with different emission spectrum. For the luminescent device (1), an excitation light contribution degree ΔE, an index quantitatively representing what extent of a visible component of the excitation light is involved in color mixing of a combined light of the luminescent device (1), is 0.005 or less, and a mean color rendering index Ra is 70 or more.

The present invention provides a novel structure of picture elements in current programming-type semiconductor devices, and in particular, the structure of picture elements of an active matrix organic light emitting diode (OLED) display. The device makes a self-compensation for OLED current deviations due to the deterioration in threshold voltage and uneven electric characteristic in thin film transistors. The invention also provides a method for driving a data driver capable of compensating for the uneven electric characteristic of thin film transistors in the driver for driving picture elements in the current programming-type active matrix OLED display device.

The invention discloses a method for detecting appearance of a semiconductor chip. The device comprises a sucking mechanism, a U-shaped reflecting plate, two light sources, plane reflecting mirrors, a lens, a camera and an adjusting mechanism, wherein the sucking mechanism is used for sucking a chip to be detected to a position to be detected; the U-shaped reflecting plate is arranged on the sucking mechanism; the two light sources are symmetrically arranged on the side of the chip; one part of light emitted by the two light sources irradiates the U-shaped reflecting plate and performs backlight illumination on the bottom surface and one group of opposite sides of the chip, and the other part of light performs backlight illumination on the other group of opposite sides of the chip; a plurality of plane reflecting mirrors are obliquely and symmetrically arranged at the periphery below the chip, so that light rays reflected by the plane reflecting mirrors are vertically transmitted to the front end face of the lens; the lens is arranged on the camera and positioned below the chip; the camera is arranged on the adjusting mechanism; and the adjusting mechanism is used for adjusting the working distance of the camera. By a backlight illumination technology, a device is clearly imaged, contrast is high, lighting uniformity is achieved, detection time is shortened, and efficiency is improved.

The method of manufacturing a light emitting module includes: providing a light guiding plate having a first main surface serving as a light emitting surface; and a second main surface positioned opposite to the first main surface and provided with a recess; providing a light adjustment portion containing a fluorescent material; providing a light emitting element unit in which a light emitting element comprising an electrode is integrally bonded to the light adjustment portion; bonding the light adjustment portion of the light emitting element unit to the recess; and forming wiring on the electrode of the light emitting element.

A light emitting device includes a substrate having a conductive portion; a light emitting element having one or more electrodes on a lower surface side thereof, the electrodes being positioned on the conductive portion of the substrate; a phosphor layer disposed on a surface of the light emitting element and on a peripheral surface area of the conductive portion next to the light emitting element; and a reflection layer covering a part of the phosphor layer disposed on the peripheral surface area of the conductive portion.

A backlight unit using LEDs in which a plurality of LEDs of different colors used for a surface light source are connected in an electric connection structure incorporating series and parallel connections so that the LEDs of the same color are driven by a single driving circuit, thereby improving the driving efficiency of LEDs. The backlight unit includes a plurality of LED modules each having a plurality of red LEDs, a plurality of green LEDs, and a plurality of blue LEDs electrically connected, respectively. The backlight unit also includes an LED driver composed of a red LED driving circuit, a green LED driving circuit, and a blue LED driving circuit for driving each color group of the plurality of LEDs provided in the LED modules. The plurality of red LEDs, the plurality of green LEDs, and the plurality of blue LEDs in the respective LED modules are electrically connected, respectively.

The invention relates to the technical field of lighting lamps, in particular to an LED lamp bulb which comprises a lamp holder, a lamp shade, an LED and a circuit board, wherein the bottom end of the lamp shade is installed and fixed at the top end of the lamp holder; the circuit board is installed and fixed inside the lamp shade and electrically connected with the lamp holder; and the interior of the lamp shade is filled with mixed gas used for conducting heat generated by the LED to the exterior of the lamp bulb. As the heat generated by the LED is emitted by the mixed gas, the LED lamp bulb has the characteristics of light weight, small volume and low production cost; in addition, the mixed gas is used as the medium of heat transmission, therefore the LED lamp bulb can quickly emit the heat generated by the LED to the exterior of the lamp bulb, with fast heat dissipation speed, thus effectively resolving the heat dissipation problem of the LED and prolonging the service life of the LED.

A transfer material comprises a temporary support and an electroluminescent element layer, and positioned between said temporary support and said electroluminescent element layer. Using the above transfer material, an organic electroluminescent device is produced by a method comprising the steps of superposing the transfer material on an electrode layer side of a substrate has partially or wholly transparent or opaque electrode layer, contacting the transfer material and the substrate, and transferring at least one electroluminescent element to the electrode layer side of a substrate with at least one heating means and pressing means.

A nitride semiconductor light emitting device comprising an n-side nitride semiconductor layer and a p-side nitride semiconductor layer formed on a substrate, with a light transmitting electrode 10 formed on the p-side nitride semiconductor layer, and the p-side pad electrode 14 formed for the connection with an outside circuit, and the n-side pad electrode 12 formed on the n-side nitride semiconductor layer for the connection with the outside circuit, so as to extract light on the p-side nitride semiconductor layer side, wherein taper angles of end faces of the light transmitting electrode 10 and / or the p-side nitride semiconductor layer are made different depending on the position.

An area light source device according to the present invention includes a plate-shaped light guide plate that has one surface that serves as a transmissive surface and another surface that is on the opposite side from the transmissive surface and in which a plurality of recessed portions are provided. The area light source device also includes at least two light-emitting diodes that are accommodated in each of the recessed portions, that emit light in a direction in which the light guide plate extends, and that are disposed such that they emit light in different directions. In this configuration, directing a light-emitting face of any one of the light-emitting diodes such that it faces a given light-emitting area makes it possible to cause light to be emitted uniformly within the light-emitting area and also makes it possible to cause light to be emitted only within the specific light-emitting area.

An improved LED illuminated rolling game ball designed to use three AAA batteries. The ball includes a plastic, opaque spherical body with an axially aligned bore in which a multiple LED light assembly extends. The light assembly includes an outer tube, an intermediate sleeve, a multiple AAA battery holder, a multiple LED bulb holder, one switch cap and one end cap. In one embodiment, outer tube is a solid structure made of electrical conductive material includes two opposite end openings that connect to the switch and end caps that hold the outer tube in place in the bore. LED bulb holes are formed on the outer tube. The intermediate sleeve is located inside the outer tube and the battery holder is located inside the intermediate sleeve. The LED bulb holder includes a PCB with two or more LED bulbs arms that hold the LED bulbs outward through the bores formed on the outer tube.

A light emitting diode (LED) lamp includes a heat dissipation module, a circular light guide plate (LGP), and LED light sources. The heat dissipation module includes a heat dissipation element and a heat-conducting base that has a containing concave. The heat dissipation element connecting and surrounding the heat-conducting base is distant from the circumference of the heat-conducting base. The circular LGP in the containing concave has a top surface, a bottom surface, and an annular side surface. The top surface faces the heat-conducting base and has concentric annular trenches. The LED light sources are configured in the containing concave and face the annular side surface. The LED light sources are suitable for emitting a light beam which is capable of passing through the annular side surface to enter the circular LGP and capable of being reflected by the annular trenches and emitted from the bottom surface.

An (Al, Ga, In)N and ZnO direct wafer bonded light emitting diode (LED), wherein light passes through electrically conductive ZnO. Flat and clean surfaces are prepared for both the (Al, Ga, In)N and ZnO wafers. A wafer bonding process is then performed between the (Al, Ga, In)N and ZnO wafers, wherein the (Al, Ga, In)N and ZnO wafers are joined together and then wafer bonded in a nitrogen ambient under uniaxial pressure at a set temperature for a set duration. After the wafer bonding process, ZnO is shaped for increasing light extraction from inside of LED.

The invention relates to a light emitting diode package that can prevent deterioration of phosphor and a method of manufacturing the same. The light emitting diode package includes a package body having a recessed part, a light emitting diode chip mounted on a floor surface of the recessed part and a lens structure disposed on an upper surface of the package body, apart from the light emitting diode chip. Phosphor is dispersed in at least a part of the lens structure.

A nitride semiconductor chip is provided that offers enhanced luminous efficacy and an increased yield as a result of an improved EL emission pattern and improved surface morphology (flatness). This nitride semiconductor laser chip (nitride semiconductor chip) includes a GaN substrate having a principal growth plane and individual nitride semiconductor layers formed on the principal growth plane of the GaN substrate. The principal growth plane is a plane having an off angle in the a-axis direction relative to the m plane, and the individual nitride semiconductor layers include a lower clad layer of AlGaN. This lower clad layer is formed in contact with the principal growth plane of the GaN substrate.

A structure of direct type backlight module with high uniform emitting light explores a design of lenticular lens of diffusing plate. The lenticular lens is against the central location of light source, where the light of lamp is scattered and the curvature of said lenticular lens far away light source is enlarged, then to reduce the scatter effect and achieve uniformity. The other lenticular lens also can be designed for light location and distance. Each lenticular lens is against light location, and incident light can be reflected through the angle of microstructure surface at the entrance facet, but farther location can be resulted in total refraction due to large inclined angle, and diminishing the transmission light of light source then influencing the uniformity, finally reducing total reflection of wide angle.