82results about How to "Improved thermal isolation" patented technology

Embodiments of the present invention are generally directed to apparatus and methods for a plasma-processing chamber requiring less maintenance and downtime and possessing improved reliability over the prior art. In one embodiment, the apparatus includes a substrate support resting on a ceramic shaft, an inner shaft allowing for electrical connections to the substrate support at atmospheric pressure, an aluminum substrate support resting on but not fixed to a ceramic support structure, sapphire rest points swaged into the substrate support, and a heating element inside the substrate support arranged in an Archimedes spiral to reduce warping of the substrate support and to increase its lifetime. Methods include increasing time between in-situ cleans of the chamber by reducing particle generation from chamber surfaces. Reduced particle generation occurs via temperature control of chamber components and pressurization of non-processing regions of the chamber relative to the processing region with a purge gas.

A microelectronic package may include front and rear covers overlying the front and rear surfaces of a microelectronic element such as an infrared sensor and spaces between the microelectronic element and the covers to provide thermal isolation. A sensing unit including a microelectronic package may include a reflector spaced from the front cover to provide an analyte space, and the microelectronic element may include an emitter and a detector so that radiation directed from the emitter will be reflected by the sensor to the detector, and such radiation will be affected by the properties of the analyte in the analyte space. Such a unit provides a compact, economical chemical sensor. Other packages include elements such as valves for passing fluids into and out of the spaces within the package itself.

Micromachined, CMOS p+-active / n-well diodes are used as infrared sensing elements in uncooled Focal Plane Arrays (FPA). The FPAs are fabricated using a standard CMOS process followed by post-CMOS bulk-micromachining steps without any critical lithography or complicated deposition processes. Micromachining steps include Reactive Ion Etching (RIE) to reach the bulk silicon and anisotropic silicon wet etching together with electrochemical etch-stop technique to obtain thermally isolated p+-active / n-well diodes. The FPAs are monolithically integrated with their readout circuit since they are fabricated in any standard CMOS technology.

The invention provides an infrared detector of a microbridge structure and a method for manufacturing the infrared detector of the microbridge structure. The detector comprises a reading circuit substrate, a microbridge leg, a heat sensitive layer, an infrared reflection layer and an infrared absorption layer. The infrared absorption layer is supported by and arranged above the heat sensitive layer, a resonant cavity for incoming infrared light is formed by the infrared absorption layer and the infrared reflection layer, and the microbridge leg is arranged below the infrared reflection layer and electrically connected with the reading circuit substrate. Through the structure, the infrared absorptivity of the device can be improved while thermal conductance of the device can be reduced, the filling rate of the device is improved, the defects of the resonant cavity are overcome, and thus the thermal isolation effect and the responsivity of the device are improved and the performance of the device is optimized.

A phase change random access memory PCRAM device is described suitable for use in large-scale integrated circuits. An exemplary memory device has a pipe-shaped first electrode formed from a first electrode layer on a sidewall of a sidewall support structure. A sidewall spacer insulating member is formed from a first oxide layer and a second, “L-shaped,” electrode is formed on the insulating member. An electrical contact is connected to the horizontal portion of the second electrode. A bridge of memory material extends from a top surface of the first electrode to a top surface of the second electrode across a top surface of the sidewall spacer insulating member.

The present invention concerns a method for fabricating a nanowire thermoelectric device comprising the step of providing a substrate upon which to form nanowires. The substrate comprises substrate electrodes passing from a top exposed surface of the substrate to a bottom exposed surface of the substrate. Another step involves forming a first electrode pattern, which forms first and second electrically connected groups of substrate electrodes, on the bottom surface of the substrate. A p-type nanowire is then formed on the substrate by activating the first group of substrate electrodes during p-type material deposition. Similarly, a n-type nanowire is formed by activating the second group of substrate electrodes during n-type material deposition. And top electrodes are formed to connect the p-type and the n-type nanowires and a second electrode pattern is formed on the bottom side of the substrate to replace the first electrode pattern to form a thermocouple.

A memory device has a sidewall insulating member with a sidewall insulating member length according to a first spacer layer thickness. A first electrode formed from a second spacer layer having a first electrode length according to a thickness of a second spacer layer and a second electrode formed from the second spacer layer having a second electrode length according to the thickness of the second spacer layer are formed on sidewalls of the sidewall insulating member. A bridge of memory material having a bridge width extends from a top surface of the first electrode to a top surface of the second electrode across a top surface of the sidewall insulating member, wherein the bridge comprises memory material.

An electrical fuse is formed on a semiconductor substrate and a first dielectric layer is formed over the electrical fuse. At least one opening is formed by lithographic methods and a reactive ion etch in the first dielectric layer down to a top surface of the electrical fuse or down to shallow trench isolation. A second dielectric layer is deposited by a non-conformal deposition. Thickness of the second dielectric layer on the sidewalls of the at least one opening increases with height so that at least one cavity encapsulated by the second dielectric layer is formed in the at least one opening. The at least one cavity provides enhanced thermal isolation of the electrical fuse since the cavity provides superior thermal isolation than a dielectric material.

The invention provides a silicone tunable optical filter, comprising a silicone tuning cavity, a highly-doped silicone resistance heater, a lower cantilever beam, an upper cantilever beam, a left surface highly-doped cantilever beam, a right highly surface doped cantilever beam, a metal lead, a stress balancing metal lead, a left lead region, a right lead region and an SOI (Silicon-on-Insulator) supporting silicon substrate 11. The silicone tunable optical filter is obtained by using an SOI wafer with high resistance and a silicone machining process. A making method provided by the invention comprises the following steps of: (a) making a highly doped region on the surface of an SOI wafer device layer; (b) sputtering metal on the surface of the wafer device layer and making a metal structure; (c) making the silicone tuning cavity and each cantilever beam structure on the surface of the wafer device layer; (d) releasing the silicone tuning cavity and the cantilever beam structure from asubstrate layer of the lower surface of the silicon wafer; and (e) making high reflective films on the upper and lower surfaces of the silicone tuning cavity to form an optical F-P interference cavity body. The made filter has the advantages of very good optical performance, simple making process and high structural reliability.

The invention discloses an integrated microfluidic chip applied to localization, culture and interaction of different cells. The chip is composed of a flow layer, a control layer and a covering layer from up down; wherein, the flow layer is mainly composed of a micron pipe network and four round cavities, every two adjacent cavities are connected by a small pipe, and the flow layer is provided with ten sample inlet / outlets in total; the control layer is composed of a plurality of enclosed micro valve switches at the terminal of single pipe and can control time and space of input and output of samples at different pipe positions of the flow layer. The integrated microfluidic chip of the invention has the advantages of good quality of preparation material, strong repeatability of preparation method and wide application range and can be used for research on localization co-culture and interaction of multiple cells.

The invention relates to a multilayered composite ceramic layer patterned structure substrate for optical and electronic devices. The multilayered composite ceramic layer patterned structure substrate comprises a metal substrate, wherein a voltage-withstanding ceramic layer and a high heat-conducting ceramic layer are sequentially formed on the metal substrate; an active brazing layer is arranged between the voltage-withstanding ceramic layer and the high heat-conducting ceramic layer; multiple isolation bases are formed by selective etching performed on the high heat-conducting ceramic layer and the active brazing layer through a mask; and a metal circuit layer is formed on every isolation base. The multilayered composite ceramic layer patterned structure substrate for optical and electronic devices has a metal substrate in a relatively large size, can accommodate multiple optical and / or electronic devices, and is provided with good electrical isolation and thermal isolation between the multiple optical and / or electronic devices.

The invention relates to a patterned ceramic layer printed circuit substrate for optical and electronic devices. The patterned ceramic layer printed circuit substrate comprises a metal substrate, wherein a voltage-withstanding ceramic layer is formed on the metal substrate; on the voltage-withstanding ceramic layer, by using a PVD (physical vapor deposition) method, a patterned high heat-conducting ceramic layer is deposited through a baffle plate, and multiple heat-conducting isolation bases are formed; and a metal circuit layer is formed on every heat-conducting isolation base. The patterned ceramic layer printed circuit substrate for optical and electronic devices has a metal substrate in a relatively large size, can accommodate multiple optical and / or electronic devices, and is provided with good electrical isolation and thermal isolation between the multiple optical and / or electronic devices.

The present invention relates to thermally driven pumps. More specifically, one embodiment of the present invention relates to the use of a thermoelectric material to create a thermally driven, bi-directional pump, such as a micro pump, with no moving parts using the thermal transpiration effect (a Knudsen pump). One embodiment of the thermally driven pump of the present invention utilizes a thermoelectric material to assist with the thermal transpiration process resulting in a substantially symmetrical, bidirectional pump. A thermoelectric module is used to induce a temperature gradient across a nanoporous article having at least one nanochannel thus creating fluid flow via thermal transpiration across the nanochannel. The use of the thermoelectric module eliminates the need for a heat sink thereby making the pump substantially symmetrical and enabling bidirectional flow which is accomplished by reversing the polarity of the power supply to the thermoelectric module resulting in reversing the direction of heat transfer.A second embodiment of the thermally driven pump of the present invention comprises a uni-directional, pneumatic, micro fluidic, Knudsen pump which can be integrated into a lab-on-chip device and is configured to pump liquids. The Knudsen pump of the second embodiment is generally comprised of a channel system comprised of a nanochannel and a shallow channel embedded in a bottom substrate and capable of alignment in series with other channels within a lab-on-chip substrate. The nanochannel and shallow channel are both covered by a second substrate comprised of material conducive to finalize creation of the Knudsen channels. A heater is also included within the nanochannel to induce gas flow by thermal transpiration which pneumatically moves liquid through the channels of a lab-on-chip.

An IR tip assembly includes a shroud having at least one feature that permits releasable attachment of a disposable cover fitted to a shroud. When the disposable cover is fitted to the shroud, at least one air gap is defined between the shroud and the disposable cover. An IR sensor disposed within the IR tip assembly is mechanically and thermally coupled to a heat sink. The at least one defined air gap creates a thermal isolation between the disposable cover and the disposed IR sensor. There can also be airflow through the at least one air gap. Apparatus and methods to create the airflow are described.

In a fire protection device for protecting a zone in which a building and / or people is / are located, it is suggested that it be constructed from fire-resistant material and be larger than the spatial dimensions of the zone to be protected. This fire protection device particularly enables the owner or resident of a building to protect the building from the threat of an external fire even when the fire service is not present.

A thermal inkjet printhead with generally planar heater elements disposed in respective bubble forming chambers such that they are bonded on one side to the chamber so that the other side faces into the chamber. Each heater element receives an energizing pulse to heat ejectable liquid above its boiling point to form a gas bubble on the side facing into the chamber, whereby the gas bubble causes the ejection of a drop of the ejectable liquid from the nozzle. The chamber has a dielectric layer proximate the side of the heater element bonded to the chamber. The dielectric layer has a thermal product less than 1495 Jm−2K−1s−1 / 2, the thermal product being (ρCk)1 / 2, where ρ is the density of the layer, C is specific heat of the layer and k is thermal conductivity of the layer. The present invention reduces the drop ejection energy and the heat dissipation into the printhead IC by improving the thermal isolation between the heater and the substrate.

The invention concerns a refrigerant compressor with a motor, a compressor driven by the motor, and a muffling device having at least one muffler with a housing. It is endeavoured to reduce the thermal influence of suction gas in the refrigerant compressor. For this purpose, it is ensured that the housing has at least one outer wall, which is made of a foamed plastic.

The invention discloses a heat-shielding structure of a steering engine. The structure is in a truncated inverted conical barrel shape, the top of the inverted conical barrel is defined as the front section, the bottom is defined as the back section, the inner circumferential surface of the inverted conical barrel is an outer isolating surface comprising a steel plate 1 and is used for separatingheat radiated to the steering engine 5 by flames ejected backwards by an exhaust nozzle 6, the outer circumferential surface is a connecting surface comprising an asbestos pad 2, the connecting surface extends from the back section to the front section to be in sealed connection with a projectile shell 4, the steering engine 5 and the exhaust nozzle 6 respectively, and the structure is placed in atruncated inverted conical barrel cavity, defined by the projectile shell 4, the steering engine 5, the exhaust nozzle 6 and an engine shell 7, at the tail of the engine. With the structure, branching and ejection of tail flames of the engine are facilitated, radiation of the tail flames of the engine, backflow heating and bottom environment pressure directly act on the heat-shielding structure,the structure is simple and reliable, and materials are cheap and easy to obtain.

The present invention relates to an evaporator device for coating substrates, in particular for applying an aluminum layer of OLEDs. In order to attain high evaporator tube temperatures, such as are required for example for the vaporization of materials with low vapor pressure, the heating system is placed into the interior of the evaporator tube. The thermal losses are thereby minimized and higher tube temperatures are possible at comparably couple in heating power.

A calorimeter includes a bucket cover which is used to reconfigure an isothermal water reservoir to provide for temperature equilibration prior to sample analysis and subsequently define a fixed volume of water during analysis in which high precision temperature measurements can be recorded. The apparatus includes mechanisms for sealing and controlling the cover, and for coupling the combustion vessel to the cover while minimizing the thermal contact between them. Improved thermal isolation between the fixed volume of water and the surrounding environment is also achieved.

The invention provides a novel two-section type seven-phase permanent magnet fault-tolerant motor and belongs to the technical field of permanent-magnet synchronous motors. The motor comprises a motor shell, two rotor assemblies, two stator assemblies, a rotary shaft, a bearing, a bush, an insulating sleeve, a magnet isolating board and an end cover. The two stator assemblies and the two rotor assemblies are coaxially installed on the same shell. The two stator assemblies are a three-phase winding and a four-phase winding respectively and connected with the rotary shaft through the rotor assemblies respectively, so that a three-phase permanent magnet fault-tolerant motor section and a four-phase permanent magnet fault-tolerant motor section are formed. The magnet isolating board is installed between the two motor sections. Phase windings of the stator assemblies are in a concentrated single-layer winding mode and are embedded separately through teeth. Power is supplied to each phase winding through an independent H-bridge driving mode. The novel two-section type seven-phase permanent magnet fault-tolerant motor is good in physical isolation capacity, magnetic field isolation capacity, thermal field isolation capacity and electric isolation capacity and can effectively restrain short circuit currents of the permanent magnet motor, greatly improve the reliability of the permanent magnet motor and satisfy the requirements for primary fault work, secondary fault work and third fault safety.

An electrical fuse is formed on a semiconductor substrate and a first dielectric layer is formed over the electrical fuse. At least one opening is formed by lithographic methods and a reactive ion etch in the first dielectric layer down to a top surface of the electrical fuse or down to shallow trench isolation. A second dielectric layer is deposited by a non-conformal deposition. Thickness of the second dielectric layer on the sidewalls of the at least one opening increases with height so that at least one cavity encapsulated by the second dielectric layer is formed in the at least one opening. The at least one cavity provides enhanced thermal isolation of the electrical fuse since the cavity provides superior thermal isolation than a dielectric material.

The present invention relates to a multi-stage turbocharger arrangement (1), having a high-pressure turbocharger (20) which has a turbine housing (26A), a bearing housing (27A), a compressor housing (28A); and having a low-pressure turbocharger (21) which has a turbine housing (26B), a bearing housing (27B), a compressor housing (28B); wherein the turbine housings (26A, 26B) are provided with an integrated inner shell (23) for conducting exhaust gas.

A glass bottle body made up by a neck jointed in continuity to a receptacle tubular wall, said bottle body being closed by a bottom wall placed on a bottle end side opposite regarding said neck, defining said bottom wall a receptacle capable of holding liquids, characterised in that said bottom wall is extended, in a perimeter area, by a base tubular wall that internally defines a cavity, said base tubular wall and the receptacle tubular wall being in opposite sides of the bottom wall; and the average height of the base tubular wall being equal to or larger than the average thickness of the base tubular wall, being the contents of the bottle highlighted by two laterally visible layers of the bottom of the bottle, producing a stand effect.

The invention relates to a cylinder head (10, 50, 90, 130) for an air compressor, having at least one intake duct (12, 52, 92, 132) for the intake of non-compressed air from the surroundings, and having at least one pressure duct for discharging the compressed air, and also having a cooling water duct (14, 16, 54, 56, 94, 96, 136), wherein the at least one intake duct (12, 52, 92, 132) can be closed off in pressure-tight fashion with respect to a compression chamber (22, 62, 102, 142) by means of at least one intake lamella (20, 60, 100, 140) arranged on an underside (18, 58, 98, 138) of the cylinder head. It is provided according to the invention that the at least one intake duct (12, 52, 92, 132) is surrounded in sections by a substantially concentric annular groove (26, 66, 106, 146) which is close to the intake lamella. In this way, heating of the air flowing out of the surroundings into the cylinder head (10, 50, 90, 130) via the at least one intake duct (12, 52, 92, 132) is advantageously reduced.

The invention provides a power source thermal isolation high-power LED lamp. Safety and reliability of a power source of the high-power LED lamp can be improved, and adverse effects on a power sourcebin due to heat dissipation are lowered. In the power source thermal isolation high-power LED lamp, a front face cover, a light source plate and a heat dissipation shell form a light source bin. The power source bin is fixedly connected with the back of the heat dissipation shell. The power source bin and the heat dissipation shell are relatively independent, and a space is kept. A set of bosses are formed on the back of the heat dissipation shell and between heat dissipation fins. The bottom face of the power source bin is fixedly connected with the set of bosses through a set of screws, a space is kept between the bottom face of the power source bin and the heat dissipation fins below the bottom face of the power source bin, and fixed installation of the power source bin is achieved. Atleast one connecting column is further formed on the back of the heat dissipation shell. The connecting column is provided with a center channel communicating with the light source bin so as to achieve penetrating and connecting of circuits. The bottom face of the power source bin is provided with a connector matched with the connecting column, and a seal thermal isolation rubber ring is arrangedon the joint.

The present invention relates to thermally driven pumps. More specifically, one embodiment of the present invention relates to the use of a thermoelectric material to create a thermally driven, bi-directional pump, such as a micro pump, with no moving parts using the thermal transpiration effect (a Knudsen pump). One embodiment of the thermally driven pump of the present invention utilizes a thermoelectric material to assist with the thermal transpiration process resulting in a substantially symmetrical, bidirectional pump. A thermoelectric module is used to induce a temperature gradient across a nanoporous article having at least one nanochannel thus creating fluid flow via thermal transpiration across the nanochannel. The use of the thermoelectric module eliminates the need for a heat sink thereby making the pump substantially symmetrical and enabling bidirectional flow which is accomplished by reversing the polarity of the power supply to the thermoelectric module resulting in reversing the direction of heat transfer.A second embodiment of the thermally driven pump of the present invention comprises a uni-directional, pneumatic, micro fluidic, Knudsen pump which can be integrated into a lab-on-chip device and is configured to pump liquids. The Knudsen pump of the second embodiment is generally comprised of a channel system comprised of a nanochannel and a shallow channel embedded in a bottom substrate and capable of alignment in series with other channels within a lab-on-chip substrate. The nanochannel and shallow channel are both covered by a second substrate comprised of material conducive to finalize creation of the Knudsen channels. A heater is also included within the nanochannel to induce gas flow by thermal transpiration which pneumatically moves liquid through the channels of a lab-on-chip.