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A patterned ceramic layer printed circuit substrate for optical and electronic devices

A technology of printed circuit boards and electronic devices, which is applied in the direction of printed circuits connected with non-printed electrical components, printed circuit components, etc., can solve the problems of electrical conduction short circuit, heat transfer difficulties, etc., and achieve good electrical isolation and thermal stability. Effects of isolation, heat dissipation resolution, effective heat conduction and transfer

Active Publication Date: 2013-10-16
浙江云隐科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the multiple optical and / or electronic devices are coupled to a ceramic component with a single interface, it will cause difficulty in heat transfer between the coupled optical and / or electronic devices, and may cause electrical conduction short circuit

Method used

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  • A patterned ceramic layer printed circuit substrate for optical and electronic devices
  • A patterned ceramic layer printed circuit substrate for optical and electronic devices
  • A patterned ceramic layer printed circuit substrate for optical and electronic devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] as attached figure 1 As shown, the patterned ceramic layer printed circuit substrate for optical and electronic devices described in this embodiment includes an aluminum or aluminum alloy substrate 10, on which Al 2 o 3 A pressure-resistant ceramic layer 20, and on the pressure-resistant ceramic layer 20, a patterned AlN high thermal conductivity ceramic layer 30 is deposited through a baffle using a magnetron sputtering deposition method, and a plurality of thermally conductive isolation bases 50 are formed; and in the A metal circuit layer (not shown in the figure) is formed on the high thermal conductivity ceramic layer of the thermal conductivity isolation base. The Al 2 o 3 The pressure-resistant ceramic layer is prepared by the following process, and the reaction system is AlCl 3 -H 2 O-O 2 -H 2 , the reaction temperature is 420-500°C, the working pressure is 1200Pa, where AlCl 3 The flow rate is 50 ml / min, H 2 The flow rate of O is 10-20 ml / min, O 2 The...

Embodiment 2

[0026] as attached figure 2 As shown, the patterned ceramic layer printed circuit substrate for optical and electronic devices described in this embodiment includes an aluminum or aluminum alloy substrate 10, on which Al 2 o 3 A pressure-resistant ceramic layer 20, and on the pressure-resistant ceramic layer 20, a patterned AlN high thermal conductivity ceramic layer 30 is deposited through a baffle using a magnetron sputtering deposition method, and a plurality of thermally conductive isolation bases 50 are formed; and in the There is an aluminum transition layer 60 between the substrate 10 and the pressure-resistant ceramic layer 20; and a metal circuit layer (not shown in the figure) is formed on the thermally conductive isolation base with high thermally conductive ceramic layer. The aluminum transition layer is prepared by the following process: the degree of vacuuming is 5.0×10 -4 Pa, feed the Ar with a purity of 99.99% into the vacuum coating chamber, flow 20sccm, an...

Embodiment 3

[0028] as attached image 3 As shown, the patterned ceramic layer printed circuit substrate for optical and electronic devices described in this embodiment includes an aluminum or aluminum alloy substrate 10, on which Al 2 o 3 A pressure-resistant ceramic layer 20, and on the pressure-resistant ceramic layer 20, a patterned AlN high thermal conductivity ceramic layer 30 is deposited through a baffle using a magnetron sputtering deposition method, and a plurality of thermally conductive isolation bases 50 are formed; and in the There is an active brazing layer 70 between the substrate 10 and the pressure-resistant ceramic layer 20; and a metal circuit layer (not shown in the figure) is formed on the high thermal conductivity ceramic layer of the thermally conductive isolation base. The solder of the active brazing layer is prepared by the above-mentioned water mist method, and the solder used contains 0.5wt% Ag, 0.8 wt% In, 2.1 wt% Ti, 1.5 wt% Si, 7.2 wt% % Sn, 2.7 wt% Al, 0....

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Abstract

The invention relates to a patterned ceramic layer printed circuit substrate for optical and electronic devices. The patterned ceramic layer printed circuit substrate comprises a metal substrate, wherein a voltage-withstanding ceramic layer is formed on the metal substrate; on the voltage-withstanding ceramic layer, by using a PVD (physical vapor deposition) method, a patterned high heat-conducting ceramic layer is deposited through a baffle plate, and multiple heat-conducting isolation bases are formed; and a metal circuit layer is formed on every heat-conducting isolation base. The patterned ceramic layer printed circuit substrate for optical and electronic devices has a metal substrate in a relatively large size, can accommodate multiple optical and / or electronic devices, and is provided with good electrical isolation and thermal isolation between the multiple optical and / or electronic devices.

Description

technical field [0001] The invention belongs to the field of electronic technology, and more specifically, the invention relates to a patterned ceramic layer printed circuit substrate for optical and electronic devices. Background technique [0002] Devices used in optics and / or electronics, such as integrated circuits or laser diodes, require the use of thermally conductive materials for heat transfer. For this purpose, a metallic base body is used, for example a copper base body, and an electrical isolation is often required between the optical and / or electronic components and the metal base body. And some ceramic materials have higher heat transfer efficiency and are electrically insulating. For this purpose, highly thermally conductive ceramic materials are frequently used as intermediate materials for providing electrical isolation while still maintaining thermal conductivity between the optical and / or electronic components and the metal base body. In order to provide...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18
Inventor 高鞠
Owner 浙江云隐科技有限公司
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