A multilayered composite ceramic layer patterned structure substrate for optical and electronic devices
An electronic device, multi-layer composite technology, applied in the field of electronics, can solve problems such as difficult heat transfer, electrical conduction short circuit, etc., and achieve the effects of solving heat dissipation problems, good electrical isolation and thermal isolation, and effective radial heat conduction and transfer.
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Embodiment 1
[0022] as attached figure 1 As shown, the multilayer composite ceramic layer patterned structural substrate for optical and electronic devices described in this embodiment includes an aluminum or aluminum alloy substrate 10, on which Al 2 o 3 The pressure-resistant ceramic layer 20 and the AlN high thermal conductivity ceramic layer 40; the Al 2 o 3 There is an active brazing layer 30 between the pressure-resistant ceramic layer 20 and the AlN high thermal conductivity ceramic layer 40, and the high thermal conductivity ceramic layer and the active brazing layer are selectively etched through a mask to form a plurality of isolation bases 50; and A metal circuit layer (not shown in the figure) is formed on the isolation base. The Al 2 o 3 The steps of the pressure-resistant ceramic layer adopt the following process, and the reaction system is AlCl 3 -H 2 O-O 2 -H 2 , the reaction temperature is 420-500°C, the working pressure is 1200Pa, where AlCl 3 The flow rate is 5...
Embodiment 2
[0024] as attached figure 2 As shown, the multilayer composite ceramic layer patterned structural substrate for optical and electronic devices described in this embodiment includes an aluminum or aluminum alloy substrate 10, on which Al 2 o 3 The pressure-resistant ceramic layer 20 and the AlN high thermal conductivity ceramic layer 40; the Al 2 o 3 There is an active brazing layer 30 between the pressure-resistant ceramic layer 20 and the AlN high thermal conductivity ceramic layer 40; the aluminum or aluminum alloy substrate 10 and the Al 2 o 3 There is an aluminum transition layer 60 between the pressure-resistant ceramic layers 20, and the high thermal conductivity ceramic layer and the active brazing layer are selectively etched through a mask to form a plurality of isolation bases 50; and formed on the isolation bases There are metal circuit layers (not shown in the figure). Wherein, the step of the aluminum transition layer adopts the following process: evacuate t...
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