39results about How to "Improve voltage breakdown performance" patented technology

A distributed active transformer on a semiconducting substrate is provided. The distributed active transformer includes an outer primary, a secondary disposed adjacent to the outer primary, and an inner primary disposed adjacent to the outer primary and the secondary. A plurality of first three terminal devices is coupled to the outer primary at a plurality of locations. A plurality of second three terminal devices coupled to the inner primary at a plurality of locations, and each second three terminal device is disposed opposite from and coupled to one of the plurality of first three terminal devices. A plurality of power control actuation circuits is also provided, where each power control actuation circuit is coupled to one of the first three terminal devices and the second three terminal devices.

The invention relates to a preparation method for preparing copper-based electrical contact materials based on 3D printing technology. The method comprises the following steps: (1) establishing a three-dimensional skeleton model of Cr, and 3D printing and forming; (2) the obtained in step (1) Inserting a soft magnetic phase core structure into the Cr three-dimensional framework; and (3) infiltrating the highly conductive phase Cu into the framework obtained in step (2). The copper-based electrical contact material of the present invention has an ordered magnetic field microstructure unit, which can generate a large magnetic field on the surface to drive arc spot movement, and improve the breaking current capability and voltage breakdown capability of the material.

The invention discloses a high-heat-radiation wave-absorption shielding film. A third adhesive layer, a polypropylene film layer and a fourth adhesive layer are sequentially arranged between a wave-absorption layer and a release material layer of the shielding film; a plurality of convex points are arranged on the contact surfaces of the fourth adhesive layer and the release material layer; the wave-absorption layer is prepared from the following ingredients including 100 parts of wave absorption powder, 20 to 35 parts of butyl acrylate, 10 to 20 parts of acrylic acid, 20 to 35 parts of 2-ethylhexyl acrylate, 10 to 30 parts of methyl methacrylate, 1 to 3 parts of vinyl acetate, 0.1 to 1 part of methacrylate-2-HEA, 0.5 to 2 parts of polyacrylate sodium and 0.4 to 1 part of methyl ethyl ketone peroxide; the wave absorption powder is prepared from the following ingredients including 100 parts of carbonyl iron powder, 60 parts of nickel sesquioxide, 9 parts of nanometer graphite powder, 15parts of cobalt chloride, 62 parts of unsaturated polyester and 42 parts of sodium dodecyl benzene sulfonate. The high-heat-radiation wave-absorption shielding film is favorable for diffusing the heat generated by electromagnetic waves; the performance stability is improved; the service life of the product is prolonged.

The invention provides a polypropylene voltage-resisting insulating resin and a preparation method thereof. The polypropylene voltage-resisting insulating resin comprises the following components in parts by mass: 100 parts of mixed resin and 0.5-5 parts of silicon dioxide, wherein the mixed resin comprises the following components in parts by mass: 10-30 parts of pre-irradiated polypropylene resin, 45-80 parts of polypropylene resin and 10-25 parts of polypropylene-polystyrene resin. The invention further provides the preparation method of the polypropylene voltage-resisting insulating resin. The polypropylene voltage-resisting insulating resin is good in voltage breakdown resistance and the breakdown field strength is up to 33.2KV / mm.

The invention discloses a wave absorbing paster for an electronic product. The paster includes a graphite flake as a reflection layer, a wave-absorbing layer and a release material layer, and a firstadhesive layer is arranged between the graphite flake and the wave-absorbing layer; a second adhesive layer is arranged between the wave-absorbing layer and the release material layer; the wave-absorbing layer is prepared from the following components of wave-absorbing powder, butyl acrylate, acrylic acid, 2-ethylhexyl acrylate, methyl methacrylate, vinyl acetate monomer, hydroxyethyl-2-methacrylate, sodium polyacrylate and methyl ethyl ketone peroxide; the wave-absorbing powder is prepared from the following components of BaFe12O19, nickel sesquioxide, nano graphite powder, cobalt naphtenate,unsaturated polyester and an acrylic leveling agent. The attenuation ratio of the wave absorbing paster for the electronic product reaches 88% in electromagnetic waves of 2-10 GHz, and not only is polymer gluing facilitated, but also the save absorbing paster effectively absorbs electromagnetic waves and the withstand voltage breakdown effect of the wave absorbing flake of the electronic productcan be improved at the same time.

The invention discloses a composite pasting film with the electromagnetic field shielding function. The composite film comprises a PET insulating layer, a metal layer, a wave absorbing layer and a release material layer. A first adhesive layer is disposed between the PET insulating layer and the metal layer, a second adhesive layer is arranged between the metal layer and the wave absorbing layer, and a plurality of parallel prism protruding parts are arranged on the surface, making contact with the wave absorbing layer, of the metal layer. The wave absorbing layer is formed by mixing the components comprising, by weight, 100 parts of wave absorbing powder, 20-35 parts of butyl acrylate, 10-20 parts of acrylic acid, 20-35 parts of 2-ethylhexyl acrylate, 10-30 parts of methyl methacrylate, 1-3 parts of vinyl acetate, 0.1-1 part of methacrylic acid-2-hydroxyethyl, 0.5-2 parts of sodium polyacrylate and 0.4-1 part of methyl ethyl ketone peroxide. The composite pasting film with the electromagnetic field shielding function increases the utilization rate of a reflection electromagnetic field of the metal layer, remarkably improves wave absorbing performance of protective adhesive tape, avoids over-concentration of heat and facilitates heat diffusion.

The present invention relates to a high reliability SMD? The LED packaging structure includes a metal base, and a pressure-resistant ceramic layer is formed on the metal base, and a metal circuit layer and a high thermal conductivity ceramic layer are formed on the pressure-resistant ceramic layer; and on the metal circuit layer and high SMD is provided on the thermally conductive ceramic layer? LED? Lamp beads. The high reliability SMD described in the present invention? In the LED packaging structure, the thermal conductivity of the high thermal conductivity ceramic layer is greater than 50? W / mK,? Lateral and radial heat conduction can be realized, and the voltage-resistant ceramic layer has high voltage-resistant breakdown performance.

The invention relates to a multi-layer composite ceramic layer patterned structural substrate for optical and electronic devices, which includes a metal base, and a pressure-resistant ceramic layer and a high thermal conductivity ceramic layer are sequentially formed on the metal base; the pressure-resistant There is an active brazing layer between the ceramic layer and the high thermal conductivity ceramic layer, and the high thermal conductivity ceramic layer and the active brazing layer are selectively etched through a mask to form a plurality of isolation bases; There are metal circuit layers. The multilayer composite ceramic layer patterned structural substrate for optical and electronic devices described in the present invention has a larger size metal substrate and can accommodate multiple optical and / or electronic devices, and the multiple optical and / or have good electrical and thermal isolation between electronic devices.

The invention relates to a multi-ceramic-layer LED packaging structure which comprises a metal substrate, wherein a voltage-withstanding ceramic layer and a high heat-conducting ceramic layer are sequentially formed on the metal substrate; a metal circuit layer and a fluorescent ceramic layer are formed on the high heat-conducting ceramic layer; and an LED chip is arranged on the metal circuit layer and the fluorescent ceramic layer. The printed circuit board has multiple functional ceramic layers, and fulfills aims of thermal conductivity, resistance to high-voltage breakdown and improvement of luminous efficiency.

The invention relates to an ultraviolet (UV)-curable paint, a coating and a graphite heat dissipation material. The UV-curable paint is prepared from 50-75% of a polyurethane acrylate (PUA) oligomer, 0.5-20% of an active diluent (1), 0.2-10% of an active diluent (2), 0.05-10% of an active diluent (3), 1-10% of a photoinitiator and 0.05-0.4% of an auxiliary agent, wherein the active diluent (1) is prepared from ethoxyethoxyethyl acrylate, the active diluent (2) is prepared from ethylene glycol diacrylate, and the active diluent (3) is prepared from hydroxyl acrylate and / or tetrahydrofurfuryl acrylate. The paint can be subjected to ultraviolet curing, heating does not need to be carried out in the curing process, and a solvent is not evaporated in the curing process; after a graphite sheet substrate is coated with the paint and the paint is cured, the coating is low in shrinkage rate; the graphite heat dissipation material has excellent bending resistance, voltage breakdown resistance, wear resistance and flexibility; the coating has better adhesion force with substrates such as the graphite sheet substrate, and is an environment-friendly material.

The invention relates to a multi-ceramic layer patterned structural substrate for optical and electronic devices, which includes a metal base, and a pressure-resistant ceramic layer and a high-thermal-conduction ceramic layer are sequentially formed on the metal base; the pressure-resistant ceramic layer There is a transition layer between the high thermal conductivity ceramic layer and the high thermal conductivity ceramic layer and the transition layer through a mask to form a plurality of isolation bases; and a metal circuit layer is formed on the isolation base. The multi-ceramic layer patterned structure for optical and electronic devices described in the present invention has a larger size metal substrate and can accommodate multiple optical and / or electronic devices, and the multiple optical and / or electronic There is good electrical and thermal isolation between devices.

The invention discloses a multifunctional protection film for an electronic product. The multifunctional protection film comprises a PET insulating layer, a metal layer, a wave-absorbing layer and a release material layer, wherein a first adhesive layer is arranged between the PET insulating layer and the metal layer, a second adhesive layer is arranged between the metal layer and the wave-absorbing layer, a third adhesive layer is arranged between the wave-absorbing layer and the release material layer, and the surface, contacting with the wave-absorbing layer, of the metal layer is provided with a plurality of prism lug bosses arranged in parallel. The wave-absorbing layer comprises 100 parts of wave-absorbing powder, 25 to 35 parts of butyl acrylate, 12 to 15 parts of acrylic acid, 20 to 35 parts of 2-ethylhexyl acrylate, 10 to 30 parts of methyl methacrylate, 1 to 3 parts of vinyl acetate, 0.1 to 1 part of 2-hydroxyethyl methacrylate, 0.5 to 2 parts of sodium polyacrylate and 0.4 to 1 part of methylethyl ketone peroxide. The multifunctional protection film prevents excess concentration of heat, is beneficial for heat diffusion, avoids upwarp of the film caused by temperature rise and improves stability of product performance.