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Thermal conduction coating material, thermal conduction coating, and composite heat dissipation film

A thermally conductive coating and thermally conductive coating technology, used in coatings, polyurea/polyurethane coatings, film/flaky adhesives, etc., can solve the problem of product heat dissipation performance decline, graphite sheet surface fragile, short circuit of electronic products, etc. problems, to achieve the effect of improving thermal conductivity and insulation, good thermal conductivity, and high thermal emissivity

Active Publication Date: 2017-10-24
SHENZHEN SELEN SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Graphite sheet has the advantages of high thermal conductivity, low density, light and thin, and good bending resistance, and has been widely used in recent years. However, graphite sheet has the disadvantages of fragile surface, poor machinability, and strong conductivity. Tiny debris falling out of the battery may cause a short circuit in the electronic product
At present, the graphite film products used in the market are all processed by laminating single-sided adhesive and double-sided adhesive. The process of laminating the graphite sheet is likely to cause the graphite sheet to be scrapped due to wrinkling, and the heat dissipation performance of the product is greatly reduced.

Method used

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  • Thermal conduction coating material, thermal conduction coating, and composite heat dissipation film
  • Thermal conduction coating material, thermal conduction coating, and composite heat dissipation film
  • Thermal conduction coating material, thermal conduction coating, and composite heat dissipation film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Thermally conductive coating formula: 70 parts of difunctional aliphatic PUA oligomer, 5 parts of ethoxyethoxyethyl acrylate, 10 parts of diethylene glycol diacrylate, 8 parts of 1-hydroxycyclohexyl phenyl ketone Parts, 5 parts of boron nitride (average particle size 200nm), 1 part of KH-550, 1 part of TDL-ND2 special dispersant for nano-powder.

[0056] Composite heat dissipation film structure: 10μm thermal conductive coating + 25μm graphite sheet + 20μm double-sided adhesive.

[0057] Preparation method of composite heat dissipation film:

[0058] (1) Preparation of thermally conductive coating:

[0059] a. Nano-powder dispersion: 5 parts of boron nitride (average particle size 200nm), 70 parts of bifunctional aliphatic PUA oligomer, 1 part of TDL-ND2 special dispersant for nano-powder, 1 part of KH-550 Add one portion to the mixing cup in turn, stir in the planetary mixer at a rate of 1600rpm for 150s, repeat the stirring 10 times, and remove the air bubbles; Per...

Embodiment 2

[0078] 70 parts of difunctional aliphatic PUA oligomer, 5 parts of ethoxyethoxyethyl acrylate, 10 parts of diethylene glycol diacrylate, 8 parts of 1-hydroxycyclohexyl phenyl ketone, nitrogenated 2.5 parts of boron (average particle size 200nm), 2.5 parts of silicon carbide (average particle size 20nm), 1 part of KH-550, 1 part of TDL-ND2 special dispersant for nano powder.

[0079] The structure and preparation method of the composite heat dissipation film are the same as in Example 1, and the formula is changed to the above formula.

Embodiment 3

[0081] 70 parts of difunctional aliphatic PUA oligomer, 3 parts of ethoxy ethoxy ethyl acrylate, 10 parts of diethylene glycol diacrylate, 10 parts of 1-hydroxycyclohexyl phenyl ketone, nitrogenated 2 parts of boron (average particle size 200nm), 2 parts of silicon carbide (average particle size 20nm), 1 part of alumina (average particle size 800nm), 1 part of KH-550, 1 part of TDL-ND2 special dispersant for nano powder .

[0082] The structure and preparation method of the composite heat dissipation film are the same as in Example 1, and the formula is changed to the above formula.

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Abstract

The present invention provides a thermal conduction coating material, which comprises 50-75% of a PUA oligomer, 0.5-20% of 2-(2-ethoxyethoxy)ethyl acrylate, 0.2-10% of ethylene glycol diacrylate, 1-10% of a photoinitiator, 1-10% of nanometer powder, 0.2-1% of a dispersant, and 0.2-1% of a coupling agent, and can form a thermal conduction coating after the coating material is subjected to ultraviolet light curing. The invention further provides a composite heat dissipation film, which sequentially comprises a thermal conduction coating (I), a graphite sheet (II) and a double-sided adhesive layer (V) from top to bottom, has advantages of excellent bending resistance, excellent voltage breakdown resistance and excellent radiation heat dissipation performance, can effectively reduce the heat source temperature, and can meet the use requirements in the heat dissipation field.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a coating and a heat dissipation film. Background technique [0002] With the rapid development of the microelectronics industry, electronic components and electronic equipment are increasingly miniaturized, integrated and high-density. The heating problem of electronic products has become a bottleneck restricting its development. Manufacturers usually use heat dissipation films to accelerate the heat dissipation of electronic products. . Graphite sheet has the advantages of high thermal conductivity, low density, light and thin, and good bending resistance, and has been widely used in recent years. However, graphite sheet has the disadvantages of fragile surface, poor machinability, and strong conductivity. Tiny debris falling out of the battery may cause a short circuit in the electronic product. At present, the graphite film products used in the market are all processed by la...

Claims

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Application Information

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IPC IPC(8): C09D175/14C09D5/00C09D7/12C09J7/02H01B3/30
CPCC08K3/34C08K3/36C08K5/13C08K13/02C08K2003/282C08K2003/385C08K2201/011C09D5/00C09D175/14C09J2203/326C09J2301/312C09J2400/10C09J2433/00H01B3/302
Inventor 邝许平曹兴矦亚茹陈斌
Owner SHENZHEN SELEN SCI & TECH CO LTD
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