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Multilayer composite ceramic layer patterned structural substrates for optical and electronic devices

An electronic device and multi-layer composite technology, applied in the electronic field, can solve the problems of electrical conduction short circuit, heat transfer difficulties, etc., achieve good electrical isolation and thermal isolation, solve heat dissipation problems, and effectively conduct and transfer heat in the radial direction

Active Publication Date: 2016-01-13
浙江云隐科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the multiple optical and / or electronic devices are coupled to a ceramic component with a single interface, it will cause difficulty in heat transfer between the coupled optical and / or electronic devices, and may cause electrical conduction short circuit

Method used

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  • Multilayer composite ceramic layer patterned structural substrates for optical and electronic devices
  • Multilayer composite ceramic layer patterned structural substrates for optical and electronic devices

Examples

Experimental program
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Effect test

Embodiment 1

[0022] As attached figure 1 As shown, the multilayer composite ceramic layer patterned structure substrate for optical and electronic devices described in this embodiment includes an aluminum or aluminum alloy base 10 on which Al is sequentially formed. 2 O 3 The pressure-resistant ceramic layer 20 and the AlN high thermal conductivity ceramic layer 40; the Al 2 O 3 There is an active brazing layer 30 between the pressure ceramic layer 20 and the AlN high thermal conductivity ceramic layer 40, and the high thermal conductivity ceramic layer and the active brazing layer are selectively etched through a mask to form a plurality of isolation bases 50; and A metal circuit layer (not shown in the figure) is formed on the isolation base. The Al 2 O 3 The steps of the pressure-resistant ceramic layer adopt the following process, and the reaction system is AlCl 3 -H 2 O-O 2 -H 2 , The reaction temperature is 420-500℃, the working pressure is 1200Pa, among which AlCl 3 The flow rate is 50...

Embodiment 2

[0024] As attached figure 2 As shown, the multilayer composite ceramic layer patterned structure substrate for optical and electronic devices described in this embodiment includes an aluminum or aluminum alloy base 10 on which Al is sequentially formed. 2 O 3 The pressure-resistant ceramic layer 20 and the AlN high thermal conductivity ceramic layer 40; the Al 2 O 3 There is an active brazing layer 30 between the pressure-resistant ceramic layer 20 and the AlN high thermal conductivity ceramic layer 40; the aluminum or aluminum alloy substrate 10 is in contact with the Al 2 O 3 There is an aluminum transition layer 60 between the voltage-resistant ceramic layers 20, and the high thermal conductivity ceramic layer and the active brazing layer are selectively etched through a mask to form a plurality of isolation bases 50; and formed on the isolation bases There are metal circuit layers (not shown in the figure). Wherein, the steps of the aluminum transition layer adopt the follow...

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Abstract

The invention relates to a multi-layer composite ceramic layer patterned structural substrate for optical and electronic devices, which includes a metal base, and a pressure-resistant ceramic layer and a high thermal conductivity ceramic layer are sequentially formed on the metal base; the pressure-resistant There is an active brazing layer between the ceramic layer and the high thermal conductivity ceramic layer, and the high thermal conductivity ceramic layer and the active brazing layer are selectively etched through a mask to form a plurality of isolation bases; There are metal circuit layers. The multilayer composite ceramic layer patterned structural substrate for optical and electronic devices described in the present invention has a larger size metal substrate and can accommodate multiple optical and / or electronic devices, and the multiple optical and / or have good electrical and thermal isolation between electronic devices.

Description

technical field [0001] The invention belongs to the field of electronic technology, and more specifically, the invention relates to a multilayer composite ceramic layer patterned structural substrate used for optical and electronic devices. Background technique [0002] Devices used in optics and / or electronics, such as integrated circuits or laser diodes, require the use of thermally conductive materials for heat transfer. For this purpose, a metallic base body is used, for example a copper base body, and an electrical isolation is often required between the optical and / or electronic components and the metal base body. And some ceramic materials have higher heat transfer efficiency and are electrically insulating. For this purpose, highly thermally conductive ceramic materials are frequently used as intermediate materials for providing electrical isolation while still maintaining thermal conductivity between the optical and / or electronic components and the metal base body....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/15H05K3/02
Inventor 高鞠
Owner 浙江云隐科技有限公司
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