Multi-ceramic layer led packaging structure
A technology of LED packaging and ceramic layer, which is applied in the electronic field, can solve problems such as crack failure, ceramic layer cracks, and difficult performance requirements, and achieve the effects of improving wettability, solving heat dissipation problems, and improving reliability
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Embodiment 1
[0021] The multi-ceramic layer LED packaging structure described herein includes a metal base 10, and a pressure-resistant ceramic layer 20 and a high thermal conductivity ceramic layer 30 are sequentially formed on the metal base 10, and a high thermal conductivity ceramic layer 30 is formed on the high thermal conductivity ceramic layer 30. A metal circuit layer 40 and a fluorescent ceramic layer 50 ; and an LED chip 60 is arranged on the metal circuit layer 40 and the fluorescent ceramic layer 50 . The metal matrix can be metal matrixes such as Al, Cu, Ag and Ni or their alloy matrix; the metal circuit layer is formed by dry etching through a deposited conductive metal layer, and the conductive metal is usually preferably Cu, Ag, Al or their alloy materials. In the multi-ceramic layer LED packaging structure, the multi-ceramic layers are all formed by a known sintering method, and the fluorescent ceramic layer is a Ce-doped YAG layer, and the Ce-doped YAG layer is cerium-do...
Embodiment 2
[0023] The multi-ceramic layer LED packaging structure described herein includes a metal base 10, and a pressure-resistant ceramic layer 20 and a high thermal conductivity ceramic layer 30 are sequentially formed on the metal base 10, and a high thermal conductivity ceramic layer 30 is formed on the high thermal conductivity ceramic layer 30. A metal circuit layer 40 and a fluorescent ceramic layer 50 ; and an LED chip 60 is arranged on the metal circuit layer 40 and the fluorescent ceramic layer 50 . The metal matrix can be metal matrixes such as Al, Cu, Ag and Ni or their alloy matrix; the metal circuit layer is formed by dry etching through a deposited conductive metal layer, and the conductive metal is usually preferably Cu, Ag, Al or their alloy materials. In the multi-ceramic layer LED packaging structure, the multi-ceramic layers are all formed by a known sintering method, and the fluorescent ceramic layer is a Eu-doped SiN layer, and the Eu-doped SiN layer is formed by...
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