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Manufacturing technology of reflective layer on surface of circuit board for installing LED lamp beads

A technology of LED lamp and manufacturing process, which is applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of affecting luminous efficiency, uneven reflection, easy aging and falling off, etc., so as to ensure the reflection effect, improve the service life, and light The effect of improving

Inactive Publication Date: 2016-11-23
李玉俊
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, due to the manufacturing process, the current reflective coating used for LED lamps has a short service life and is easy to age and fall off, resulting in uneven reflection, which affects the luminous efficiency.

Method used

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Experimental program
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Embodiment Construction

[0010] The present invention will be further described below in combination with specific embodiments.

[0011] The technology of the reflective layer on the surface of the circuit board used for installing lamp beads in LED lamps, the production steps are as follows:

[0012] 1. Put the side of the circuit board with the circuit facing down, and the side without the circuit facing up, clean and polish the surface of the circuit board, and then remove the debris formed by grinding;

[0013] 2. roughen the surface of the circuit board to form a rough surface, the surface roughness Ra of the rough surface is 4.8 μm-5.6 μm, preferably 5.2um;

[0014] 3. Clean the circuit board with a circuit board cleaner, dry it, and set it aside;

[0015] 4. Evenly mix the reflective material and the adhesive and put it into the sprayer, and set it aside;

[0016] 5. Cover the side of the circuit board with a circuit board with a plastic film, and smooth the plastic film to make it stick to t...

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Abstract

The invention provides a manufacturing technology of a reflective layer on the surface of a circuit board for installing LED lamp beads, relates to a circuit board used for installing lamp beads in LED lamps, and belongs to the technical field of LED lamp manufacturing. The manufacturing technology comprises the steps of (1) placing one side, which is not provided with a circuit, of a circuit board upwards, cleaning the upper surface, polishing and smoothening the upper surface, and clearing chippings; (2) roughening the upper surface of the circuit board to obtain a rough surface with the surface roughness Ra of 4.8-5.6 microns, washing the circuit board and airing for use; (3) mixing and adding reflective materials and an adhesive to a coating machine; (4) covering the side, which is provided with a circuit, of the circuit board with a plastic film; and (5) spraying a coating with the thickness of 5-7 microns on the roughened surface of the circuit board by using the coating machine, and airing to obtain the reflective layer on the surface of the circuit board. According to the technical scheme, the most appropriate surface roughness and reflective coating thickness are selected. Therefore, the reflective effect is ensured, the lighting effect of an LED lamp is improved by 10%-15%, and a better energy-saving effect is achieved. Moreover, the service life of the reflective layer can be effectively prolonged by more than 20%.

Description

technical field [0001] The invention relates to a production process of a reflective layer on the surface of a circuit board for installing lamp beads in an LED lamp, and relates to a circuit board for installing lamp beads in an LED lamp. It belongs to the technical field of LED lamp manufacturing. Background technique [0002] LED lights have gradually attracted people's attention due to their advantages such as high brightness and low energy consumption. With the promotion of the concept of energy saving and emission reduction, in order to improve the luminous efficiency of LED lamps and minimize the light loss of LED lamps, the usual method is to install reflective devices in the lampshade, and set reflective devices on the surface of the circuit board for installing lamp beads. The layer is the most convenient and effective method. There are mounting holes on the circuit board. The pins of the LED lamp beads pass through the mounting holes and are welded to the circuit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 李玉俊
Owner 李玉俊
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