42results about How to "Good light curing effect" patented technology

The present invention provides a photocurable and thermosetting resin composition that can be developed by an alkaline aqueous solution. It does not use a photopolymerization initiator or uses less than the current amount, thereby reducing volatile components, and can be used with less ultraviolet rays. The amount of radiation cures. The composition contains (A) a carboxyl group-containing photosensitive resin, (B) a maleimide derivative, (C) a compound having two or more epoxy groups and / or oxetanyl groups in one molecule, and (D) A radically polymerizable compound having a cyclic ether group or a morpholino group.

A carbazole oxime ester-type photoinitiator represented by the following structural formula (I) is disclosed. The photoinitiator has excellent properties in application, especially high photosensibility. The photoinitiator can greatly improve the photocuring properties of photopolymers when applying on them, thus can significantly increase the productivity of photosensitive compositions in application fields such as preparing color filter. The preparation method of the carbazole oxime ester-type photoinitiator and its use in photosensitive composition are also disclosed.

The invention relates to a photoinitiator of diphenyl sulfide oxime esters. The photoinitiator has a chemical structure shown as a formula (1) in the specifications, is excellent in application performance, high in photosensibility, free of yellowing and good in dissolubility, and has the advantages of greatly increasing a photo-curing performance when applied to photosensitive compositions and obviously increasing the performance and production efficiency in the photosensitive composition application field, such as preparation of color filters. The invention further relates to a preparation method of the photoinitiator and application of the photoinitiator to the photosensitive compositions.

A liquid resin composition is provided which satisfies both a tackiness-free requirement and a curing sensitivity requirement for production of an optical waveguide by a roll-to-roll process. An optical waveguide produced by using the liquid resin composition and a production method of the optical waveguide are also provided. The liquid resin composition for the production of the optical waveguide comprises:(A) a (meth)acrylate polymer, as a major component, having a plurality of (meth)acryl groups in its molecule;(B) a liquid thiol monomer having a plurality of thiol groups in its molecule; and(C) a photopolymerization initiator.

The invention provides a photosensitive resin composition and a photoresist. The photosensitive resin composition comprises resin, and the resin comprises at least two kinds of photosensitive resin, wherein the two kinds of photosensitive resin independently have the structure shown in the structural formula I, one kind of photosensitive resin is high-molecular-weight photosensitive resin, the weight-average molecular weight of the photosensitive resin is 6,300-7,800, and the weight-average molecular weight of the photosensitive resin is 5,000-5,500; the structural formula I is shown in the specification, and the photosensitive resin with the structural formula I has the photocuring performance, wherein the adhesiveness to a substrate, the alkali solvent resistance and the solvent resistance are high; and the two photosensitive resins with the advantages are compounded, so the molecular weight of each photosensitive resin is further controlled; the resolution and the adhesive force canbe improved by utilizing the high molecular weight photosensitivity, and the developability is improved and the residual film rate is reduced by utilizing the low molecular weight photosensitive resin, so a black matrix with high sensitivity and uniform CD can be prepared.

The invention discloses a novel ink photocuring device. The novel ink photocuring device comprises a rack and a curing furnace, wherein an UV lamp pipe is arranged in the curing furnace; a charge portand a discharge port are formed in the left side and the right side of the curing furnace; the rack is provided with an upper left roll and a lower left roll at the left side of the curing furnace inthe vertical direction, and provided with an upper right roll and a lower right roll at the right side of the curing furnace; a conveying belt is arranged on the upper left roll, the lower left roll,the upper right roll and the lower right roll; the conveying belt sequentially passes through the lower right roll, the curing furnace, the lower left roll, the upper left roll and the upper right roll; a low-voltage halogen lamp is arranged at the top of the outer side of the curing furnace; the upper right roll and the upper left roll are both located above the low-voltage halogen lamp in the vertical direction; exhaust ports are formed in the front side and the rear side of the curing furnace separately; an exhaust fan is arranged on each exhaust port; the curing furnace is provided with alight barrier at the outer side of each exhaust port; and each light barrier is in an arc shape with a middle part sunken towards the corresponding exhaust port. According to the novel ink photocuring device disclosed by the invention, secondary photocuring is carried out through the low-voltage halogen lamp above the curing furnace, so that the photocuring effect can be effectively improved; andmeanwhile, rapid and stable heat dissipation is realized by virtue of the exhaust fans.

The invention belongs to the technical field of building materials, and in particular relates to a two-component tile grout. During the use of the present invention, firstly, the mixed polymer in component A can form a film on the surface of the gap, and at the same time enhance the bonding performance with the tiles, and secondly, the additives added can be cured with the mixture in component B. Deposition, filling the gaps of tiles, and using the additives in component B can well combine the metal ions in it, and can be compounded with composite glue to form a good filling effect, thus solving the problem of the current gap filling materials. Problems of cracking and poor water resistance.

A high reflective / high definition solder composition and a printed circuit board using thereof are provided secure the excellent patterning ability by light and resolving potency. A high reflective / high definition solder composition contains a carboxyl containing resin without an aromatic ring, bisacylphosphine oxide based photopolymerization initiator, a mono-acylphosphineoxide based photopolymerization initiator, a photo-polymerizable monomer, a rutile-type titanium oxide, and an organic solvent. The carboxyl containing resin without the aromatic ring is a copolymer resin having a carboxyl group obtained by reacting a (meth) acrylic copolymer resin containing the carboxyl group, and a compound with an ethylenically unsaturated group.

The invention relates to the field of circuit board printing, and aims to solve the problems that the binding force between the existing PCB ink and an outer layer conductive pattern of a thick copper plate is poor, so that the ink is easy to fall off, a circuit cannot be effectively protected finally, a large amount of heat is released in the use process of a PCB, the PCB ink is damaged by heating, and the service life of the PCB is prolonged. According to the method for improving the binding force between the outer layer conductive pattern of the thick copper plate and the printing ink, the binding force between the outer layer conductive pattern of the thick copper plate and the printing ink can be obviously improved by using binding glue, meanwhile, the high temperature resistance of the binding glue is good, and the circuit cannot be effectively protected. The modified light-cured resin can separate the thick copper plate from the printing ink, so that a coating formed by the printing ink is prevented from being damaged under the heating condition, the thermal stability of a product is ensured, and the thermal stability of the product is further ensured as the modified light-cured resin has better heat resistance.