Method for improving binding force between outer layer conductive pattern and ink of thick copper plate

Abstract

The invention relates to the field of circuit board printing, and aims to solve the problems that the binding force between the existing PCB ink and an outer layer conductive pattern of a thick copper plate is poor, so that the ink is easy to fall off, a circuit cannot be effectively protected finally, a large amount of heat is released in the use process of a PCB, the PCB ink is damaged by heating, and the service life of the PCB is prolonged. According to the method for improving the binding force between the outer layer conductive pattern of the thick copper plate and the printing ink, the binding force between the outer layer conductive pattern of the thick copper plate and the printing ink can be obviously improved by using binding glue, meanwhile, the high temperature resistance of the binding glue is good, and the circuit cannot be effectively protected. The modified light-cured resin can separate the thick copper plate from the printing ink, so that a coating formed by the printing ink is prevented from being damaged under the heating condition, the thermal stability of a product is ensured, and the thermal stability of the product is further ensured as the modified light-cured resin has better heat resistance.

Description

technical field [0001] The invention relates to the field of circuit board printing, in particular to a method for improving the bonding force between the outer conductive pattern of a thick copper plate and ink. Background technique [0002] With the continuous development of electronic technology, more and more functional components are integrated on the PCB, and some high-current products have higher and higher requirements for the current conduction capacity and carrying capacity of the circuit, and the copper thickness of such products is getting higher and higher. The thicker it is, the ultra-thick copper printed circuit board that can provide high current and integrate power will inevitably become another trend in PCB development; PCB ink is a layer of ink applied on the PCB to protect the circuit. Its core material is an organic polymer with a certain viscosity, which we call PCB solder resist ink resin; However, the bonding force between the existing PCB ink and ...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the above-mentioned technical problems, the object of the present invention is to provide a method for improving the binding force between the outer conductive pattern of the thick copper plate and the ink: by containing The outer surface of the thick copper plate of the base material is pasted with a polymer photosensitive film to obtain a conductive pattern, and the thick copper plate is chemically etched with a chemical reagent to obtain a thick copper plate to be processed, and the bonding glue is sprayed on the thick copper plate to be processed. After spraying evenly, screen-print the modified ink, let it stand after printing, and then place it in a UV light curing machine for photocuring treatment, and then cool it to room temperature, which solves the problem of the existing PCB ink and the outer layer of the thick copper plate. The bonding force between the graphics is not good, so the ink is easy to fall off, and finally the circuit cannot be effectively protected, and when the PCB is in use, a large amount of heat will be released, causing the PCB ink to be damaged by heat, which will also lead to the inability to effectively protect the circuit. problem of protection