Photocurable/thermosetting resin composition and cured product thereof
A resin composition and photocurable technology, which is applied in the field of photocurable and thermosetting resin compositions, can solve the problems of increased photopolymerization initiator addition, yellowing of cured products, and odor, and achieve improved photocuring Excellent performance, excellent electrical insulation, and excellent adhesion
Active Publication Date: 2009-12-16
TAIYO HLDG CO LTD
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Problems solved by technology
[0004] In this photocurable resin composition, the active energy ray-curable resin constituting the composition cannot initiate polymerization alone, so it is necessary to use it in combination with a photopolymerization initiator. Tendency to increase the amount added
[0005] However, when the mixing amount of the photopolymerization initiator increases, there are the following problems: unreacted photopolymerization initiator or decomposition product of the photopolymerization initiator remains in the cured product; The volatile components of the initiator cause the cured product to turn yellow or produce a foul smell
However, a large amount of ultraviolet irradiation is required, and the obtained cured coating film cannot obtain sufficient characteristics
Method used
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Embodiment 1~4 and comparative example 1~3
[0151] The mixed components shown in Table 1 using the varnishes A-1, A-2, and A-3 synthesized above were kneaded with a three-roll mill to obtain a photocurable / thermosetting resin composition. Table 2 shows the characteristic values of each composition.
[0152] Table 1
[0153]
[0154] Table 2
[0155]
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Abstract
The present invention provides a photocurable and thermosetting resin composition that can be developed by an alkaline aqueous solution. It does not use a photopolymerization initiator or uses less than the current amount, thereby reducing volatile components, and can be used with less ultraviolet rays. The amount of radiation cures. The composition contains (A) a carboxyl group-containing photosensitive resin, (B) a maleimide derivative, (C) a compound having two or more epoxy groups and / or oxetanyl groups in one molecule, and (D) A radically polymerizable compound having a cyclic ether group or a morpholino group.
Description
technical field [0001] The present invention relates to a photocurable / thermosetting resin composition and its cured product. In particular, it is useful as various resist materials for printed circuit boards, interlayer insulation materials for multilayer printed circuit boards, and as coating materials, Surface treatment agents, molding materials, adhesives, adhesives, printing inks, adhesives, etc., and photocurable and thermosetting resin compositions useful for forming laminates, optical waveguides, etc. [0002] In more detail, the present invention relates to new photocurability of components that can reduce volatilization when curing or using at high temperature or under reduced pressure without using a photopolymerization initiator or using a smaller amount than the current one. Thermosetting resin composition and cured product thereof. Background technique [0003] A photocurable resin composition that is polymerized by active energy rays such as ultraviolet light...
Claims
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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/00C08G65/26G02B6/12G03F7/004G03F7/027G03F7/038H05K1/02H05K1/03H05K3/28
CPCG02B6/138G03F7/0045G03F7/038H05K3/287H05K3/4676C08L63/00C08G59/4042C08L71/00
Inventor 峰岸昌司
Owner TAIYO HLDG CO LTD
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