40results about How to "Excellent alkali developability" patented technology

There are provided: a curable resin composition having a high exposure sensitivity and a good developing property, and thereby capable of forming an accurate and precise pattern; a liquid crystal panel substrate on which a protective film for covering a color layer or spacers for a liquid crystal layer, by using the curable resin composition, hardly causing a color irregularity and contrast irregularity; and a liquid crystal panel using the liquid crystal panel substrate and having a superior display quality. The curable resin composition of the present invention comprises: a copolymer (a) having a molecular structure in which a constitutional unit including an acidic functional unit and a constitutional unit including a photocurable functional group are linked at least; a photopolymerization initiator (b) having a tertiary amine structure; and a photocurable compound (c) having at least one acidic functional group and at least three photocurable functional groups.

The present invention provides a photo curable and heat curable resin composition, the condensate of which and the printed circuit board. The composition includes the following components: (A-1) a carboxyl-containing photosensitive resin which is reacted by the reaction product and polyol acid anhydrides (d), and the reaction product is reacted by epoxides (a) and compound (b) and the monocarboxylic acid (c) containing undersaturated groups, (A-2) a carboxyl-containing photosensitive resin which is reacted by the compound (e) containing phenolic hydroxyl group reacted to the oxiranes (f) or cyclic carbonates compound (g), and the monocarboxylic acid (c) containing undersatruated groups and polyol acid anhydrides (d), (A-3) random one of the carboxyl-containing photosensitive resins which are reacted by the reaction product and the polyol acid anhydrides (d), and the reaction product is reacted by the linear polyfunctional epoxides (h) and the monocarboxylic acid (c) containing undersatruated groups; and (B) a carboxylated urethane (methyl) acrylic ester compound; (C) a photopolymerization evocating agent; (D) heat curable component; and (E) a diluent.

A polymerizable composition contains (A) a dye which is soluble in an organic solvent and in an alkaline aqueous solution and has an absorption in 700 to 1200 nm, (B) a radical polymerization initiator, (C) a compound having an ethylenically unsaturated bond, and (D) a binder polymer.

A photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after the IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; and (D) a photopolymerization initiator. The photosensitive resin composition has a tensile breaking elongation percentage of not less than 10% and a 2% weight loss temperature of not lower than 260 DEG C. after being cured.

The present invention provides a photocurable and thermosetting resin composition that can be developed by an alkaline aqueous solution. It does not use a photopolymerization initiator or uses less than the current amount, thereby reducing volatile components, and can be used with less ultraviolet rays. The amount of radiation cures. The composition contains (A) a carboxyl group-containing photosensitive resin, (B) a maleimide derivative, (C) a compound having two or more epoxy groups and / or oxetanyl groups in one molecule, and (D) A radically polymerizable compound having a cyclic ether group or a morpholino group.

There are provided: a curable resin composition having a high exposure sensitivity and a good developing property, and thereby capable of forming an accurate and precise pattern; a liquid crystal panel substrate on which a protective film for covering a color layer or spacers for a liquid crystal layer, by using the curable resin composition, hardly causing a color irregularity and contrast irregularity; and a liquid crystal panel using the liquid crystal panel substrate and having a superior display quality. The curable resin composition of the present invention comprises: a copolymer (a) having a molecular structure in which a constitutional unit including an acidic functional unit and a constitutional unit including a photocurable functional group are linked at least; a photopolymerization initiator (h) having a tertiary amine structure; and a photocurable compound (c) having at least one acidic functional group and at least three photocurable functional groups.

An alkali-developable photosensitive color composition containing a binder resin, a fluorine-containing copolymer, a photopolymerization initiator, a colorant, and a solvent. A photopolymerizable unsaturated compound is used as the binder resin. The photopolymerizable unsaturated compound is obtained by adding (B) an unsaturated monobasic acid to (A) a polyfunctional epoxy resin to form (C) an epoxy adduct and allowing the epoxy adduct (C) and (D) a polybasic acid anhydride to react with each other.

The invention provides a photocurable solder resist ink with high heat resistance and high crosslinking degree and a preparation method thereof. The raw materials of the solder resist ink mainly include: alkali-soluble photocurable epoxy resin containing dihydroxy group carboxylic acid in parts by weight 100 parts of resin, 3 to 10 parts of photoinitiator; wherein, the alkali-soluble photocurable epoxy resin containing dihydroxy group carboxylic acid is firstly carried out ring-opening reaction by epoxy resin and dihydroxy group carboxylic acid, It is obtained by esterification reaction with unsaturated acid anhydride. The prepared photocurable solder resist ink can be immersed in the trough at 260°C for at least 40s (or even 1min) after curing without discoloration and peeling off. In addition, it has good flame retardancy and anti-aging performance. Welding heat performance, solvent resistance, chemical resistance, electroless gold plating resistance, electroless tin plating resistance, electrical characteristics are excellent in all aspects.

An object of the present invention is to provide a phenolic hydroxyl group-containing resin excellent not only in heat resistance and alkali developability, but also in crack resistance during thick film formation, a photosensitive composition containing the same, a curable composition, and a resist agent material, providing a phenolic hydroxyl-containing resin, characterized in that it has the following structural formula (1) or (2) [wherein R 2 , R 3 Each independently is any of an aliphatic hydrocarbon group, an aromatic ring-containing hydrocarbon group, an alkoxy group, and a halogen atom. ] and the following structural formula (3) (where R 4 It is a hydrogen atom or an aliphatic hydrocarbon group having 1 to 7 carbon atoms. R 5 It is a hydrogen atom or an aliphatic hydrocarbon group having 8 to 24 carbon atoms. ) represented by the structural site (β) as a repeating unit, the R existing in the resin 2 , R 3 , R 5 At least one of them is an aliphatic hydrocarbon group having 8 to 24 carbon atoms.

The invention relates to a coloring composition, a color filter and a color liquid crystal display element. The coloring composition for the color filter is excellent in colority characteristic, alkali developability and storage stability. The coloring composition is characterized by comprising (A) a colorant containing a pigment; (B) a block copolymer containing a block A and a block B. The amine value of the block copolymer is 50 mg KOG / g to 80 mg KOG / g. The block A contains a repeated unit derived from an ethylenically unsaturated monomer with the mass percentages more than 60%. The block B contains a repeated unit derived from an alkylene glycol chain having ethylenically unsaturated monomer; (C) a solvent.

This resin composition contains a maleimide compound (A) having a transmittance of 5% or greater at a wavelength of 405 nm (h-line), a specific carboxylic acid-containing compound (B), and a photo curing initiator (C) having an absorbance of 0.1 or greater at a wavelength of 405 nm (h-line).

The object of the present invention is to provide a photosensitive resin composition capable of forming a photocurable film having excellent plating properties such as alkali developability and gold plating without impairing high sensitivity to ultraviolet rays. The photosensitive resin composition containing (A) a carboxyl group-containing photosensitive resin, (B) an antioxidant, (C) a photopolymerization initiator, (D) a reactive diluent, and (E) an epoxy compound, wherein the (B) antioxidant contains at least one compound selected from the group consisting of (B1) a compound having a phenolic hydroxyl group and phosphorus and (B2) a compound having a phenolic hydroxyl group and sulfur.

The present invention relates to an alkali development type resin which is obtained by reacting a compound (b) having an alcoholic hydroxyl group and one epoxy group in the molecule with the hydroxyl groups of a phenolic resin (a), and further reacting the hydroxyl groups in the obtained reaction product X with saturated and / or unsaturated polybasic acid anhydride (c); and relates to a photosensitive resin composition containing (A) said alkali development type resin, (B) an epoxy resin, (C) a photopolymerization initiator, and (D) a diluent. Said resin composition has excellent drying properties and alkali developability, and a coated film after curing is outstanding in various characteristics such as adhesion, solder heat resistance, electroless gold plating resistance, PCT resistance, flexibility, thermal shock resistance, and HAST characteristics, and is useful as a solder resist, etching resist, plating resist, or inter-layer insulating material used during manufacture of printed wiring boards.