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Epoxy resin for crazing-resistant photocuring solder resist coating material and preparation method of epoxy resin

A technology of epoxy resin and light curing, which is applied in the direction of epoxy resin coating, photosensitive material for optical mechanical equipment, coating, etc., which can solve the problems of high heat resistance temperature and few applications

Pending Publication Date: 2021-05-18
鹤山市炎墨科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult for active rubber used as a toughening agent to achieve such a high heat-resistant temperature, so solder resist coatings toughened with active rubber are rarely used in the market.

Method used

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  • Epoxy resin for crazing-resistant photocuring solder resist coating material and preparation method of epoxy resin
  • Epoxy resin for crazing-resistant photocuring solder resist coating material and preparation method of epoxy resin
  • Epoxy resin for crazing-resistant photocuring solder resist coating material and preparation method of epoxy resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] The preparation method of the alkali-soluble light-curable epoxy resin with anti-craze property in this embodiment comprises the following steps:

[0062] (1) Under the condition of nitrogen protection, preheat 113.5g of Aromatic-150 solvent to 90°C, add 197.5g of epoxy resin NPCN-704, keep the temperature under stirring condition for 1h to fully dissolve, cool down to 70°C and add 67.7g of acrylic acid (The molar ratio of epoxy group to acrylic acid is 1:1), then heat up to 80°C, add 1.19g of cyclic ester ring-opening polymerization catalyst triphenylphosphine dissolved in 2g of Aromatic-150 solvent in advance, and then add polymerization inhibitor to Hydroquinone 0.3g, stirred and reacted at 105°C for 1 hour, then adjusted the temperature to 115°C, kept stirring at this temperature for 9 hours, until the acid value of the solution was less than 3mgKOH / g, the photocurable epoxy acrylic resin was obtained ;

[0063] (2) Under nitrogen protection conditions, the photocure...

Embodiment 2

[0068] The preparation method of the alkali-soluble light-curable epoxy resin with anti-craze property in this embodiment comprises the following steps:

[0069] (1) Under the condition of nitrogen protection, preheat 113.5g of Aromatic-150 solvent to 90°C, add 197.5g of epoxy resin NPCN-704, keep the temperature under stirring condition for 1h to fully dissolve, cool down to 70°C and add 67.7g of acrylic acid (The molar ratio of epoxy group to acrylic acid is 1:1), then heat up to 80°C, add 1.19g of cyclic ester ring-opening polymerization catalyst triphenylphosphine dissolved in 2g of Aromatic-150 solvent in advance, and then add polymerization inhibitor to Hydroquinone 0.3g, stirred and reacted at 105°C for 1 hour, then adjusted the temperature to 115°C, kept stirring at this temperature for 9 hours, until the acid value of the solution was less than 3mgKOH / g, the photocurable epoxy acrylic resin was obtained ;

[0070] (2) Under the condition of nitrogen protection, the p...

Embodiment 3

[0075] The preparation method of the alkali-soluble light-curable epoxy resin with anti-craze property in this embodiment comprises the following steps:

[0076] (1) Under the condition of nitrogen protection, preheat 113.5g of Aromatic-150 solvent to 90°C, add 197.5g of epoxy resin NPCN-704, keep the temperature under stirring condition for 1h to fully dissolve, cool down to 70°C and add 67.7g of acrylic acid (The molar ratio of epoxy group to acrylic acid is 1:1), then heat up to 80°C, add 1.19g of cyclic ester ring-opening polymerization catalyst triphenylphosphine dissolved in 2g of Aromatic-150 solvent in advance, and then add polymerization inhibitor to Hydroquinone 0.3g, stirred and reacted at 105°C for 1 hour, then adjusted the temperature to 115°C, kept stirring at this temperature for 9 hours, until the acid value of the solution was less than 3mgKOH / g, the photocurable epoxy acrylic resin was obtained ;

[0077] (2) Under nitrogen protection conditions, the photocu...

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Abstract

The invention provides an epoxy resin for a crazing-resistant photocuring solder resist coating material and a preparation method of the epoxy resin, and provides the crazing-resistant photocuring solder resist coating material prepared from the epoxy resin, and a preparation method of the crazing-resistant photocuring solder resist coating material. According to the invention, acrylic acid is introduced through a ring-opening reaction, and then the hydroxyl group and long aliphatic chain anhydride are subjected to an esterification reaction to obtain the epoxy resin, wherein the long chain anhydride is introduced into the reaction of hydroxyl and anhydride in the second step, so that flexibility is provided for the system, chain segment movement is enhanced, the glass transition temperature of the polymer is reduced, and the purposes of reducing the development of the crazing or easily treating the crazing to retract and disappear can be achieved; and the weather resistance, low temperature resistance, impact strength, fatigue resistance and other properties of a cured product of the coating material are enhanced, the application field of the solder resist photocureable coating material is widened, and the requirements of the current photocureable industry on the solder resist coating material are met.

Description

technical field [0001] The invention belongs to the technical field of photocurable solder resist coatings, and relates to an epoxy resin for photocurable solder resist coatings with silver streak resistance and a preparation method thereof, in particular to the preparation of photocurable coatings applied to printed circuit boards. Background technique [0002] Printed circuit board (PCB for short) is the substrate of modern electrical installation and connection components, and is an important basic assembly in the electronics industry. [0003] Among them, light-curing solder resist coating is one of the key materials of printed circuit board (PCB). Short circuit, adjust the amount of solder adhesion, reduce the dissolved pollution of copper in the weld, save solder, reduce the weight of the instrument, increase the high density of wiring, avoid false soldering and improve the inspection speed. [0004] Traditional photocurable solder resist coatings are usually composed...

Claims

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Application Information

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IPC IPC(8): C08G59/17C08G59/14C09D163/10G03F7/004
CPCC08G59/1466C08G59/1494C09D163/10G03F7/004C08L2205/03C08L2205/02
Inventor 李明辉李博文张军华
Owner 鹤山市炎墨科技有限公司
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