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Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

A technology of resin composition and manufacturing method, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of long processing time and the like

Active Publication Date: 2022-08-05
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] On the other hand, drilling by laser processing has the problem that the processing time becomes longer for a high-density substrate with a large number of holes.

Method used

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  • Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
  • Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
  • Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0378] Hereinafter, the present embodiment will be described more specifically with reference to Examples and Comparative Examples. This embodiment is not limited to the following examples at all.

[0379] [Synthesis of maleimide compound (TMDM)]

Synthetic example 1

[0381] The compound (TMDM) represented by the formula (20) was synthesized as follows.

[0382] [Synthesis of amic acid compound (hereinafter, abbreviated as MA-TMDA)]

[0383] First, MA-TMDA represented by the formula (32) was synthesized by the following method.

[0384]

[0385] In a 100 mL four-necked flask equipped with an argon blowing inlet, a Dean-Stark trap, a serpentine condenser, and a thermometer, 5.2 g (53 mmol) of maleic anhydride, N-methylpyrrolidone (NMP ) 20 mL and 20 mL of toluene were stirred at room temperature (25° C.) under argon gas flow to completely dissolve maleic anhydride. To this solution, TMDA (manufactured by Junya Pharmaceutical Co., Ltd., 5-amino-1,3,3-trimethyl-1-(4-aminophenyl)-indane and 6-amino-1,3 , 3-trimethyl-1-(4-aminophenyl)-indane mixture) 5.0 g (19 mmol), and NMP 10 mL, and stirred at room temperature (25° C.) for 17 hours.

[0386] A part of the reaction solution was fractionated, water and ethyl acetate were added, and the mi...

Embodiment 1

[0396] The compound represented by formula (16) (also referred to as compound (A-1)) was synthesized as follows.

[0397] In a 200 mL flask, 6.26 g (25 mmol) of bis(trimethylol)propane (manufactured by Tokyo Chemical Industry Co., Ltd.), cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride (Mitsubishi Chemical Industries, Ltd.) were added. Gas Chemical Co., Ltd., H-TMAn (trade name) 20.81 g (105 mmol), 4-dimethylaminopyridine 3.05 g (25 mmol), triethylamine 11.13 g and dichloromethane 70 g, at room temperature (25°C) under stirring for 7 hours.

[0398] To the reaction solution, 50 mL of water and 6 mL of methanol were added, and after stirring for 1 hour, 50 mL of 5% hydrochloric acid was further added and stirred. Then, the liquid was separated, the aqueous layer was removed, and 350 mL of methyl ethyl ketone and 100 mL of 5% hydrochloric acid were added to the organic layer. The solution was transferred to a separatory funnel, washed once with 150 mL of 5% hydrochloric acid...

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Abstract

The compound (A) is represented by formula (1). (In formula (1), each R1 independently represents a group represented by formula (2) or a hydrogen atom, and each R2 independently represents a hydrogen atom or a C1-6 linear or branched alkyl group. (In the formula, at least one of R1 represents a group represented by formula (2). ). (In formula (2),-* represents an atomic bond. ).

Description

technical field [0001] The present invention relates to a compound and its production method, a resin composition, a resin sheet, a multilayer printed circuit board, and a semiconductor device. Background technique [0002] Due to the miniaturization and high density of the multilayer printed circuit board, researches are being actively conducted to reduce the thickness of the laminate used for the multilayer printed circuit board. Along with thinning, thinning is also required for the insulating layer, and a resin sheet that does not contain glass cloth is required. In the resin composition used as the material of the insulating layer, a thermosetting resin is the mainstream, and the drilling for obtaining conduction between the insulating layers is generally performed by laser processing. [0003] On the other hand, drilling by laser processing has a problem that the processing time becomes longer as the number of holes increases in a high-density substrate. Therefore, i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07C69/75C08F22/40C07B53/00C08K5/092C08L35/00C07C67/08H05K1/03
CPCC07C69/75C07C2601/14H05K1/0313H05K2201/0129H05K3/389H05K1/0271H05K2201/068C07B2200/07C08G73/12C08L79/085C07C69/757C08K5/092C07C67/08C08G73/1025H05K1/03
Inventor 片桐俊介铃木卓也四家诚司熊泽优音
Owner MITSUBISHI GAS CHEM CO INC
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