Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

A technology of resin composition and compound, which is applied in the field of compound and can solve problems such as long processing time

Pending Publication Date: 2022-07-22
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] On the other hand, drilling by laser processing has the problem that the processing time becomes longer for a high-density substrate with a large number of holes.

Method used

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  • Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
  • Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
  • Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0372] Hereinafter, the present embodiment will be described more specifically with reference to Examples and Comparative Examples. This embodiment is not limited to the following examples at all.

[0373] [Synthesis of maleimide compound (TMDM)]

Synthetic example 1

[0375] The compound (TMDM) represented by (21) was synthesized by the following formula.

[0376] [Synthesis of amic acid compound (hereinafter, abbreviated as MA-TMDA)]

[0377] First, MA-TMDA represented by the formula (33) was synthesized by the following method.

[0378]

[0379] In a 100 mL four-necked flask equipped with an argon blowing inlet, a Dean-Stark trap, a serpentine condenser, and a thermometer, 5.2 g (53 mmol) of maleic anhydride, N-methylpyrrolidone (NMP ) 20 mL and 20 mL of toluene were stirred at room temperature (25° C.) under argon gas flow to completely dissolve maleic anhydride. To this solution, TMDA (manufactured by Junya Pharmaceutical Co., Ltd., 5-amino-1,3,3-trimethyl-1-(4-aminophenyl)-indane and 6-amino-1,3, 3-trimethyl-1-(4-aminophenyl)-indane mixture) 5.0 g (19 mmol) and NMP 10 mL were stirred at room temperature (25° C.) for 17 hours.

[0380] A part of the reaction solution was fractionated, water and ethyl acetate were added, and the mi...

Embodiment 1

[0390] The compound represented by formula (16) (also referred to as compound (A-1)) was synthesized as follows.

[0391] In a 200 mL flask, 6.56 g (55.5 mmol) of 1,10-decanediol (manufactured by Tokyo Chemical Industry Co., Ltd.), cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride (Mitsubishi Chemical Industries, Ltd.) were added. Gas Chemical Co., Ltd., H-TMAn (trade name) 23.10 g (116.6 mmol), 4-dimethylaminopyridine 6.77 g (55.5 mmol), triethylamine 12.35 g and dichloromethane 60 g, at room temperature (25 °C) under stirring for 7 hours.

[0392] To the reaction solution, 100 mL of water and 50 mL of dichloromethane were added, and the mixture was further stirred for 1 hour. Further, 150 mL of dichloromethane and 50 mL of 1M hydrochloric acid were added for liquid separation, and the aqueous layer was removed. To the obtained organic layer, 60 mL of 1M hydrochloric acid was added and stirred. After liquid separation and removal of the aqueous layer, the mixture was wash...

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Abstract

The compound (A) is represented by formula (1). R1O-R2-OR1 (1) (In formula (1), each R1 independently represents a group represented by formula (2), or a hydrogen atom, and R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms. In the formula (1), at least one of R1 represents a group represented by formula (2). ). (In formula (2),-* represents an atomic bond. ). R1O-R2-OR1 (1)

Description

technical field [0001] The present invention relates to a compound and a method for producing the same, a resin composition, a resin sheet, a multilayer printed circuit board, and a semiconductor device. Background technique [0002] Due to the miniaturization and high density of the multilayer printed circuit board, researches are being actively conducted to reduce the thickness of the laminate used for the multilayer printed circuit board. Along with thinning, thinning is also required for the insulating layer, and a resin sheet that does not contain glass cloth is required. In the resin composition used as the material of the insulating layer, a thermosetting resin is the mainstream, and the drilling for obtaining conduction between the insulating layers is generally performed by laser processing. [0003] On the other hand, drilling by laser processing has a problem that the processing time becomes longer as the number of holes increases in a high-density substrate. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07C67/08C07B53/00C08F22/40C08K5/092C08L35/00C08F2/44C08F2/50H05K1/03C07C69/75
CPCC08F2/50C07C2601/14C07F9/5337C08L33/18C07C69/75C08G73/12C08G73/126C08L79/085C08K5/12H05K1/0326H05K1/0346C08K5/092C07C67/08H05K1/03C08G73/121C08F222/40C07D307/83C08J5/18C08J2333/24
Inventor 片桐俊介铃木卓也四家诚司熊泽优音
Owner MITSUBISHI GAS CHEM CO INC
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