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High-thermal-resistant high-crosslinking degree photocuring solder resist ink and preparation method thereof

A technology of high cross-linking degree and solder resist ink, which is applied in the fields of high heat resistance and high cross-linking degree light-curing solder resist ink and its preparation, high cross-linking degree light-curing solder resist ink and its preparation field, which can solve the problem of system dispersion. Uniform, difficult to form a uniform film, difficult to separate, etc.

Active Publication Date: 2019-12-03
鹤山市炎墨科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, physical modification fails to fundamentally change the heat resistance of the system, and there may be uneven dispersion of the system during use, phase separation during long-term storage, and difficulty in uniform film formation during coating
The currently used chemical modification method is mainly through the introduction of some rigid heat-resistant segments on the main chain structure of carboxylated epoxy acrylate, which will involve a variety of side reactions during the synthesis process, resulting in the appearance of various by-products. The presence of these by-products is difficult to separate and affects the overall quality of the product

Method used

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  • High-thermal-resistant high-crosslinking degree photocuring solder resist ink and preparation method thereof
  • High-thermal-resistant high-crosslinking degree photocuring solder resist ink and preparation method thereof
  • High-thermal-resistant high-crosslinking degree photocuring solder resist ink and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0055] Under nitrogen protection, add 50.0g of diethylene glycol diethyl ether acetate (DCAC) into a 1L three-necked flask equipped with a stirrer, raise the temperature to 90°C, add 88.8g of epoxy resin NPCN-704, and keep the temperature for one hour to fully Dissolve, cool down to 60°C and add 57.3g of 2,2-dimethylolpropionic acid (DMPA) dissolved in 40g of diethylene glycol ether acetate (DCAC) (the molar ratio of epoxy group to carboxyl group is 1: 1), heat up to 70°C and then add 1.5g of catalyst 4-dimethylaminopyridine dissolved in 2g of diethylene glycol ethyl ether acetate, stir and react at a constant temperature of 95°C for 1 hour, then heat up to 105°C and stir at a constant temperature React for 12 hours. Then cool the reaction system to 80°C, add 94.0 g of itaconic anhydride dissolved in 30 g of diethylene glycol ethyl ether acetate (the molar ratio of carboxylic acid to anhydride is 1:2.1) and 0.5 g of hydroquinone as a polymerization inhibitor , the temperature...

Synthetic example 2

[0057] Under nitrogen protection, add 50.0g of diethylene glycol diethyl ether acetate (DCAC) into a 1L three-necked flask equipped with a stirrer, raise the temperature to 90°C, add 88.8g of epoxy resin NPCN-704, and keep the temperature for one hour to fully Dissolve, cool down to 60°C and add 57.3g of 2,2-dimethylolpropionic acid (DMPA) dissolved in 40g of diethylene glycol ether acetate (DCAC) (the molar ratio of epoxy group to carboxyl group is 1: 1), heat up to 70°C and then add 1.5g of catalyst 4-dimethylaminopyridine dissolved in 2g of diethylene glycol ethyl ether acetate, stir and react at a constant temperature of 95°C for 1 hour, then heat up to 105°C and stir at a constant temperature React for 12 hours. Then the reaction system was cooled to 80°C, and 82.2 g of maleic anhydride (MAH) dissolved in 30 g of diethylene glycol ether acetate (the molar ratio of carboxylic acid to anhydride was 1:2.1) and a pair of polymerization inhibitors were added. 0.5 g of hydroqu...

Synthetic example 3

[0059] Under nitrogen protection, add 50.0g of diethylene glycol diethyl ether acetate (DCAC) into a 1L three-necked flask equipped with a stirrer, raise the temperature to 90°C, add 88.8g of epoxy resin NPCN-704, and keep the temperature for one hour to fully Dissolve, cool down to 60°C and add 63.3g of 2,2-dimethylolbutyric acid (DMBA) dissolved in 40g of diethylene glycol ether acetate (DCAC) (the molar ratio of epoxy group to carboxyl group is 1: 1), heat up to 70°C and then add 1.5g of catalyst 4-dimethylaminopyridine dissolved in 2g of diethylene glycol ethyl ether acetate, stir and react at a constant temperature of 95°C for 1 hour, then heat up to 105°C and stir at a constant temperature React for 12 hours. Then cool the reaction system to 80°C, add 94.0 g of itaconic anhydride dissolved in 30 g of diethylene glycol ethyl ether acetate (the molar ratio of carboxylic acid to anhydride is 1:2.1) and 0.5 g of hydroquinone as a polymerization inhibitor , the temperature w...

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Abstract

The invention provides a high-thermal-resistant high-crosslinking degree photocuring solder resist ink and a preparation method thereof. The solder resist ink mainly comprises the following raw materials in parts by weight: 100 parts of a dyhydroxy group carboxylic acid containing alkaline-solubility photocuring epoxy resin and 3-10 parts of a photoinitiator, wherein the dyhydroxy group carboxylicacid containing alkaline-solubility photocuring epoxy resin is prepared by firstly implementing an open loop reaction on an epoxy resin and dyhydroxy group carboxylic acid and secondly implementing an esterification reaction with unsaturated anhydride. A product after curing of the prepared photocuring solder resist ink can be at least soaked for 40 seconds (or even 1 minute) without color changeor peeling in a trough of 260 DEG C, in addition has good flame retardancy and aging resistance, and meanwhile has excellent properties of aspects such as mechanical properties, solder resist thermalresistance, solvent resistance, chemical resistance, electrolysis-free gold plating resistance, electrolysis-free tin plating resistance and electric properties.

Description

technical field [0001] The invention belongs to the technical field of photocurable inks, and relates to a photocurable solder resist ink with high heat resistance and high crosslinking degree and a preparation method thereof, in particular to a photocurable solder resist ink with high crosslinking degree for printed circuit boards and its preparation method. Background technique [0002] Printed circuit board (PCB for short), is the substrate of modern electrical installation and connection components, and is an important basic assembly in the electronics industry. [0003] Among them, photocurable solder resist ink is one of the key materials of printed circuit board (PCB). Short circuit, adjust the amount of solder adhesion, reduce the dissolved pollution of copper in the weld, save solder, reduce the weight of the instrument, increase the high density of wiring, avoid false soldering and improve the inspection speed. [0004] With the development of PCB substrates in t...

Claims

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Application Information

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IPC IPC(8): C09D11/101C09D11/102C09D11/03
CPCC09D11/101C09D11/102C09D11/03
Inventor 李明辉徐明亨谢明星张军华尹邦超
Owner 鹤山市炎墨科技有限公司
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