Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Solder resist composition and printed wiring board

A technology for printed circuit boards and compositions, which is applied in the directions of printed circuits, printed circuit manufacturing, and secondary treatment of printed circuits, etc. It can solve the problems of reduced reflectivity, insufficient absorption, and difficulty in forming high-definition pattern latent images, and achieves Effect of increasing illuminance and suppressing decrease in reflectance

Active Publication Date: 2012-10-10
TAIYO HLDG CO LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, the white solder mask composition itself has a high reflectivity, so it reflects light when it is patterned and exposed, so that it cannot sufficiently absorb the light required for its curing, and the resolution is poor. As a result, it is difficult to form a high-definition pattern. latent image
[0011] In addition, for printed circuit boards on which LEDs are directly mounted, the light and heat emitted by the LEDs will promote the deterioration and coloring of the white solder mask, causing a decrease in reflectivity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Solder resist composition and printed wiring board
  • Solder resist composition and printed wiring board
  • Solder resist composition and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0077] Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not limited to a following example.

[0078] (A) Synthesis of carboxyl-containing resin without aromatic ring

Synthetic example 1

[0080] In a 2-liter separable flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel, and a nitrogen introduction tube, 900 g of diglyme as a solvent and 21.4 g of peroxide (2 -Ethylhexanoic acid) tert-butyl (manufactured by NOF Corporation, trade name: PERBUTYL O), heated to 90°C. After heating, 309.9 g of methacrylic acid, 116.4 g of methyl methacrylate, and 109.8 g of lactone-modified 2-hydroxyethyl methacrylate (manufactured by Daicel Chemical Industries, Ltd., trade name: PLACCEL FM1), 21.4 g of bis(4-tert-butylcyclohexyl) peroxydicarbonate (manufactured by NOF Corporation, trade name: PERBUTYL TCP) as a polymerization initiator. Furthermore, this was aged for 6 hours to obtain a carboxyl group-containing copolymer resin. In addition, the above reaction was carried out under a nitrogen atmosphere.

[0081] Next, 363.9 g of 3,4-epoxycyclohexyl methacrylate (manufactured by Daicel Chemical Industries, Ltd., trade name: Cyclomer A200) and 3.6 g...

Synthetic example 2

[0083] In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, add diethylene glycol monoethyl ether acetate as a solvent, and azobisisobutyronitrile as a catalyst, and heat it to 80 °C under a nitrogen atmosphere. °C, a monomer obtained by mixing methacrylic acid and methyl methacrylate in a molar ratio of 0.40:0.60 was added dropwise over 2 hours. Furthermore, after stirring this for 1 hour, it heated up to 115 degreeC, made it deactivate, and obtained the resin solution.

[0084] After the resin solution is cooled, using tetrabutylammonium bromide as a catalyst, under the condition of 95-105°C and 30 hours, butyl glycidyl ether and the equivalent carboxyl group of the obtained resin are reacted at a molar ratio of 0.40. Addition reaction and cooling.

[0085] Furthermore, tetrahydrophthalic anhydride and the OH group of the resin obtained above were added-reacted at the molar ratio of 0.26 under the conditions of 95-105 degreeC, and 8 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
acid valueaaaaaaaaaa
acid valueaaaaaaaaaa
acid valueaaaaaaaaaa
Login to View More

Abstract

A high reflective / high definition solder composition and a printed circuit board using thereof are provided secure the excellent patterning ability by light and resolving potency. A high reflective / high definition solder composition contains a carboxyl containing resin without an aromatic ring, bisacylphosphine oxide based photopolymerization initiator, a mono-acylphosphineoxide based photopolymerization initiator, a photo-polymerizable monomer, a rutile-type titanium oxide, and an organic solvent. The carboxyl containing resin without the aromatic ring is a copolymer resin having a carboxyl group obtained by reacting a (meth) acrylic copolymer resin containing the carboxyl group, and a compound with an ethylenically unsaturated group.

Description

[0001] This application is a divisional application of Chinese patent application 201010175136.8. The filing date of the original application 201010175136.8 is May 14, 2010, and its name is "solder resist composition and printed circuit board". technical field [0002] The present invention relates to a solder resist composition capable of forming a high-reflectance solder resist film suitable for use as a permanent mask of a printed circuit board, and the use of the solder resist composition to form a resist on the surface of a printed circuit board formed with a circuit. Printed circuit boards made of solder patterns. Background technique [0003] In a printed circuit board, circuit wiring is usually formed by etching away unnecessary portions of copper foil bonded to a laminate, and electronic components are arranged at predetermined positions by soldering. In such a printed wiring board, a solder resist film formed by coating and curing on a base material is used as a pr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027H05K3/28
CPCG03F7/027G03F7/028G03F7/0385H05K3/00H05K3/287H05K3/3452
Inventor 能坂麻美大胡义和宇敷滋
Owner TAIYO HLDG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com