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48 results about "Thermal Problem" patented technology

System and method for managing thermal issues in gas turbine engines

The present invention generally relates to a system that enables one to address various thermal management issues in advanced gas turbine engines. In one embodiment, the present invention relates to a method to extract heat from an air stream, utilize a significant fraction for on-board power generation, and reject a small quantity of heat to the fuel stream safely at, for example, a lower temperature. In another embodiment, the present invention relates to a method to extract heat from an air stream, utilize a significant fraction for on-board power generation, and reject a small quantity of heat to the fuel stream safely at, for example, a lower temperature with no potential air / fuel contact is disclosed.
Owner:ECHOGEN POWER SYST

Thermal analysis in a data processing system

Methods, systems, and media for thermal analysis are disclosed. Embodiments of the invention receive temperatures associated with elements of a system. The temperatures received are dependant upon airflow and heating patterns of the elements. Differences between the temperatures received and expected temperatures are detected. Potential airflow and heating patterns associated with a thermal problem are then determined, the potential airflow and heating patterns being substantially consistent with the temperatures received, to identify a root cause of the thermal problem as a probable source of the differences. More specifically, embodiments collect temperature readings from temperature sensors within an enclosure of the system; identify and upward temperature gradient or temperature that exceeds a threshold temperature; and select a failure scenario associated with a root cause of a thermal problem that is similar to the thermal problem described by the temperature readings collected.
Owner:IBM CORP

System for Unified Management of Power, Performance, and Thermals in Computer Systems

A system is provided for unified management of power, performance, and thermals in computer systems. This system incorporates elements to effectively address all aspects of managing computing systems in an integrated manner, instead of independently. The system employs an infrastructure for real-time measurements feedback, an infrastructure for regulating system activity, component operating levels, and environmental control, a dedicated control structure for guaranteed response / preemptive action, and interaction and integration components. The system provides interfaces for user-level interaction. The system also employs methods to address power / thermal concerns at multiple timescales. In addition, the system improves efficiency by adopting an integrated approach, rather than treating different aspects of the power / thermal problem as individual issues to be addressed in a piecemeal fashion.
Owner:IBM CORP

Method and apparatus for improved wafer singulation

Laser singulation of electronic devices from semiconductor substrates including wafers is performed using up to 3 lasers from 2 wavelength ranges. Using up to 3 lasers from 2 wavelength ranges permits laser singulation of wafers held by die attach film while avoiding problems caused by single-wavelength dicing. In particular, using up to 3 lasers from 2 wavelength ranges permits efficient dicing of semiconductor wafers while avoiding debris and thermal problems associated with laser processing die attach tape.
Owner:ELECTRO SCI IND INC

Refrigerator with microwave oven

The invention discloses a refrigerator with a microwave oven. The refrigerator with the microwave oven comprises a refrigerator liner, a first door body to a third door body, wherein a refrigerating chamber, a freezing chamber and a microwave oven chamber are limited in the refrigerator liner, the first door body to the third door body are arranged on the refrigerator liner to respectively open and close the refrigerating chamber, the freezing chamber and the microwave oven chamber. An air inlet channel and an air outlet channel are formed in the microwave oven chamber and communicated with a rear plate of the refrigerator liner to discharge heat produced in the microwave oven chamber. According to the refrigerator with the microwave oven, by the arrangement of the air inlet channel and the air outlet channel between the microwave oven chamber and the rear plate of the refrigerating liner, the heat produced in the microwave oven chamber can be discharged through the air channels, and air with normal temperature is blown into the microwave oven chamber through the air inlet channel , so that the heat in the microwave oven chamber can be continuously dissipated outside, the thermal problem of the microwave oven when the microwave oven and the refrigerator are combined, and the heat emitted by the microwave oven is prevented from influencing the temperature in a refrigerator chamber.
Owner:HEFEI MIDEA REFRIGERATOR CO LTD

Lead-free perovskite solar cell

The invention discloses a lead-free perovskite solar cell, which comprises a first electrode, a first carrier transport layer, a lead-free perovskite compound layer, and a second carrier transport layer arranged in sequence from bottom to top on a substrate and a second electrode, wherein the lead-free perovskite compound layer is made of a perovskite compound; the first electrode is a transparent conductive electrode, and the second electrode is an opaque metal electrode; the first carrier transport layer, the second carrier transport layer is made of an n-type metal compound with electron transport properties or a p-type metal compound with hole transport properties. The lead-free perovskite solar cell uses lead-free perovskite active materials, which avoids the environmental protection problem of recycling after device failure; uses inorganic metal compound semiconductors for the hole transport layer, which solves the problem of using organic semiconductor hole transport materials. Thermal problems; metal electrodes do not use precious metals silver, platinum and gold, which reduces the problem of expensive electrode materials in device preparation.
Owner:NANJING UNIV OF POSTS & TELECOMM

Implanted bioelectrode and medical assembly comprising same

The invention relates to the technical field of implanted medical appliances, and discloses an implanted bioelectrode. The bioelectrode comprises a lead wire (2), wherein two ends of the lead wire (2) are respectively connected with a contact (1) and a connector (3); and the contact (1) comprises a conductive non-magnetic nano-fiber with specific resistivity, or comprises a conductive film with specific central resistivity. The invention also discloses a medical assembly comprising the implanted bioelectrode. According to the implanted bioelectrode, the high-resistivity nano-fiber or film material is adopted to wind and manufacture the contact to effectively inhibit the eddy effect, so that the thermal problem in a nuclear magnetic resonance environment is solved, and the safety of the electrode in nuclear magnetic resonance imaging is improved.
Owner:TSINGHUA UNIV +1

LED module with microchannel heat sink and method of making same

The invention discloses an LED module with a micro-channel heat sink and a preparation method thereof. The LED module mainly includes a micro-channel heat sink with a micro-channel and an LED chip. The micro-channel heat sink uses silicon as a substrate, and The bottom of the silicon substrate has a plurality of micro-channels for circulating cooling liquid. The LED chip is directly flipped on the micro-channel heat sink through an alloy process, and the heat generated by the LED chip is passed through the alloy layer. It can be conducted to the microchannel heat sink, which is more conducive to heat conduction, has high heat dissipation efficiency, overcomes the defect that traditional heat sinks use air as a conduction medium, and is very suitable for cooling of high-power LED packages , avoiding the problem of excessive thermal resistance in the traditional packaging process, the preparation method of the present invention has simple process and can be used in large-scale industrial production.
Owner:SHANGHAI YAMING LIGHTING

Heat transfer coupling simulation order reduction method for buried pipe heat exchanger

The invention discloses a heat transfer coupling simulation order reduction method for a buried pipe heat exchanger. The method comprises the following steps: step 1, establishing a control equation;step 2, boundary determination; 3, obtaining an original system in a state space form of the mathematical model of the heat transfer problem of the buried pipe heat exchanger; 4, performing order reduction on the original system obtained in the step 3 by adopting a model order reduction method to obtain a price reduction system formula; 5, performing numerical solution on the reduced-order systemformula to obtain a solution of the reduced-order system; and step 6, through the reduced-order system coefficient matrix obtained in the step 4 and the reduced-order system state variable obtained inthe step 5, performing calculating to obtain an output variable, i.e., an approximate solution of an original system output variable, i.e., a numerical solution of an output variable of a control equation under a corresponding boundary condition. The scale of the order reduction system is far smaller than that of an original system, only one small-scale system needs to be solved, and therefore computing resources are saved, and the running time of a computing program is greatly shortened.
Owner:XI AN JIAOTONG UNIV

Backlight unit using thermal conductive resin for liquid crystal display

The present invention relates to a reflection plate for a backlight unit in a liquid crystal display device, and more particularly, to a reflection plate for a backlight unit in a liquid crystal display device, which is made of a thermoplastic thermal conductive resin composition having a thermal conductivity of at least 0.35 W / mK, thereby effectively solving the thermal problem of the backlight unit, and having excellent properties such as shock resistance, heat resistance, mechanical strength, and the like, as well as having excellent reflectivity, thereby improving the durability of the liquid crystal display device. Furthermore, the present invention relates to a backlight unit of a liquid crystal display device, comprising a reflection plate positioned at a lower portion of a lamp of the backlight unit for reflecting the light coming out of the lamp, a supporting rod for the lamp, and a lower plate functioning as a heat sink, wherein the reflection plate and the lower plate are made of the same material, thereby effectively solving the thermal problem of the backlight unit, and simplifying the manufacturing process.
Owner:LG CHEM LTD

Method of modeling thermal problems using a non-dimensional finite element method

The method of modeling thermal problems using a non-dimensional finite element method is a computerized method for modeling thermal systems that relies on the variational principle. The variational principle specifies the total potential of the system, given by a scalar quantity Π, which is defined by an integral form for a continuum problem. The solution of the continuum problem is a function that makes Π stationary with respect to the state variables. The governing equation of the problem is used to calculate the potential Π. The non-dimensional form of the potential is obtained by insertion of the defined non-dimensionless parameters. The element non-dimensional stiffness matrix and the non-dimensional load vectors are then obtained by invoking the stationarity of the non-dimensional potential Π with respect to a non-dimensional temperature vector {θ}.
Owner:KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS

Aeronautical miniaturized inertial navigation component using 50-type laser gyro

The invention relates to an aeronautical miniaturized inertial navigation component using a 50-type laser gyro, belonging to the technical field of laser inertial navigation. An inertial sensitive element component of the invention has a compact body structure, and an integrated aluminum alloy body has a complicated structure, which is processed by precision casting and then by finish machining; the structure of the sensitive element component has a simple installation relationship, which increases structural reliability and accuracy; and the body design comprehensively considers the structural strength and stiffness, jitter efficiency, installation accuracy, body barycenter trimming, assembly process, weight reduction, processing technology and other factors. Aiming at low structural strength stiffness, low jitter efficiency and thermal problems that are easy to occur in the miniaturized body structure, a large number of finite element analysis and design works are carried out to makethe whole body structure have better force and thermal characteristics.
Owner:BEIJING AEROSPACE ERA LASER NAVIGATION TECH CO LTD

Method for predicting steel billet temperature distribution in heating furnace based on particle swarm optimization algorithm

The invention provides a method for predicting billet temperature distribution in a heating furnace based on a particle swarm optimization algorithm, which comprises the following steps of: establishing a one-dimensional unsteady-state heat conduction differential equation for representing a billet temperature distribution model in the heating furnace, and determining initial conditions and boundary conditions of the one-dimensional unsteady-state heat conduction differential equation; replacing a particle value in the particle swarm optimization algorithm with a random initial value of a boundary condition, and solving the one-dimensional unsteady state heat conduction differential equation to obtain a solving temperature value; taking a mean square error between a solved temperature value and a temperature measurement value as an objective function of a heat conduction inverse problem, taking the mean square error as a fitness value, returning the fitness value to a particle swarm optimization algorithm, sequentially carrying out inversion on boundary conditions according to a time sequence, and updating the boundary conditions based on the inversion; and calculating a heat conduction positive problem by using the updated boundary conditions, and outputting temperature values at specified moments and specified positions. The method can better solve the damping and delay problems of the unsteady state heat conduction differential equation, and is more suitable for solving the unsteady state heat conduction problem.
Owner:NANJING JINGHUANRE METALLURGICAL ENG CO LTD

Thermal change self-early warning type mutual inductor

The invention discloses a thermal change self-early-warning type mutual inductor, and belongs to the field of mutual inductors, according to the thermal change self-early-warning type mutual inductor, through the arrangement of a double-variable early-warning strip, after the mutual inductor is excessively heated, the lower end of a heat sink variable rod is hot-melted gradually, the upper end of the heat sink variable rod sinks gradually, and then the upper surface of the double-variable early-warning strip is driven to sink; the double-variable early warning strip is integrally of a multi-concave structure, the effect of timely early warning on workers is achieved, the problem of excessive heating is solved in time, the influence on the service life of the mutual inductor is reduced, meanwhile, potential safety hazards are reduced, in addition, along with the prolonging of the overheating phenomenon, colored liquid at the lower end of the heat sink variable rod overflows and gradually ascends along the colored liquid, and the working efficiency is improved. Therefore, the double-variable early warning strip is discolored at the sunken part, and the early warning effect is further improved.
Owner:邢程

Design method of soaking plate wick structure with enhanced capillary action

The invention discloses a design method of a soaking plate wick structure with enhanced capillary action. Based on a Poiseuille flow hypothesis, similarity between ideal Poiseuille flow and steady-state heat conduction is used, fan-shaped parts of a steady-state heat conduction problem are optimized as a topological optimized first-order configuration of a condensation end of a soaking plate, andthe micro-channel layout in a fan-shaped area is optimized by utilizing a plant vein bifurcation rule to obtain a wick structure. According to the design method, the distribution of channels in the wick of the soaking plate is designed by simulating the distribution of the leaf veins of plant leaves, the capillary force is guaranteed, the flow velocity is high, and the obtained wick structure hassuperior thermal performance.
Owner:XI AN JIAOTONG UNIV

Fan speed regulation method

The invention provides a fan speed regulation method. An actual rotating speed of a fan is determined according to three factors of input voltage, output current and ambient temperature, specific formulas of the rotating speed of the fan under different working conditions are specifically analyzed, data sampling is carried out on the ambient temperature Ta, output current Io and input voltage Vincorrespondingly, then digital signals ae processed, the pulse width modulation duty ratio of the fan rotating speed regulation according to the actual rotating speed formula of the fan, and a fan driving circuit is controlled to be started to realize regulation on the fan rotating speed. The thermal problem and noise problem of a balancing module are solved.
Owner:SHENZHEN WINLINE TECH

Variable-flow variable-temperature-area heat supply system scheduling method considering heat loss nonlinearity

The invention relates to a variable-flow variable-temperature-area heat supply system scheduling method considering heat loss nonlinearity, which comprises the following steps: establishing a heat supply pipe network model, respectively setting a heat source and a user as different nodes, and connecting the nodes through pipelines; according to the established heat supply pipe network model, constructing an objective function and constraint conditions of a heat supply optimal scheduling strategy; processing the objective function and the constraint condition through a McCormick Envelope optimization method, and converting a nonlinear problem into a linear problem; solving the constructed linear optimization problem, and obtaining a heat supply optimal scheduling strategy under the condition that constraint conditions are met; and enabling a regional heat supply system to carry out corresponding scheduling based on the heat supply optimal scheduling strategy. The optimal scheduling method is applied to the heat supply problem of the regional heat supply network, the heat supply temperature and the flow can be used as variables, the optimal scheduling strategy is obtained under the condition that the heat loss of the pipe network is considered, the operation cost and loss of the system are reduced, and the economical efficiency of the system is improved.
Owner:杭州鸿晟电力设计咨询有限公司

A shell-and-tube heat exchanger combining heat pipes and phase change materials

ActiveCN110631302BSolve heat transfer problemsFast heat exchange response speedChemical industryIndirect heat exchangersData connectionTemperature control
The invention provides a heat tube and phase change material combined shell-and-tube heat exchanger. The system comprises a shell, a cooling liquid inlet, a cooling liquid outlet, a heat tube, a powerpump, a cold medium source and a heat source shell. The shell is filled with cooling liquid. The heat source shell is arranged in the shell. The heat source shell internally comprises a heat source and a phase change material. The heat source surrounds the interior of the phase change material. The evaporating end of the heat tube is arranged in the phase change material. A second temperature sensor is arranged on the surface of the heat source shell and is in data connection with a controller. The controller automatically controls the opening degree of a valve according to the detected temperature data. By controlling the temperature of the surface of the heat source shell, the temperature of the heat source is prevented from being too high or too low, and the effect of automatically controlling and saving energy is realized. Heat generated during conveying of the heat tube is used, the phase change heat transferring is realized through the liquid, and the heat exchange problem of high heat flux density can be quite well solved.
Owner:SHANDONG UNIV

Electromechanical converter system for electric vehicles

The invention relates to a converter system (1, 1', 1'') for an electric vehicle and in particular a lightweight electric vehicle. The converter system (1, 1', 1'') has a supporting housing (10, 10', 10'') for connecting to the vehicle, has an electromechanical energy converter arranged at least partially in the supporting housing (10, 10', 10''), said electromechanical energy converter having at least one stator (21, 21') and a rotor (22, 22') which is rotatable relative to the stator (21, 21') about a drive axis (7, 40), and has a power transmitting device which connects the rotor (22, 22') to a connection element. To permit a particularly cheap design which is easy to maintain and to reduce thermal problems,
Owner:SWISSMOVE

Systems and methods for thermal management of multilayered integrated circuits

Thermal management in three dimensional integrated circuits can be difficult. Although three dimensional integrated circuits offer multiple benefits in alleviating back-end-of-the-line (BEOL) interconnect issues by reducing the wire length and reaping resistance-capacitance (RC) quadratic benefits, the thermal issues associated with stacking high performance (and subsequently high-power consumption) dice have so far proven to be prohibitive. Disclosed are methods and devices for efficient thermal management in multilayered ICs by determining thermally dangerous regions and selectively activating them to avoid undesirable temperature effects.
Owner:VATHYS INC

Simplified calculation method for sleeve type ground heat exchanger

The invention relates to the technical field of geothermal resource development and utilization, and discloses a simplified calculation method of a sleeve type ground heat exchanger, which comprises the following steps: 1) the thermophysical properties of a backfill material and surrounding rock soil are uniform and consistent, the thermophysical parameters of the backfill material and surrounding rock soil do not change along with the change of radial and vertical sizes, and the influence of groundwater seepage and soil moisture transfer is neglected; and 2) no heat conduction phenomenon exists in the vertical direction, that is, the heat transfer process is a two-dimensional heat transfer problem along the radial direction of the buried pipe. According to the simplified calculation method of the sleeve type buried pipe heat exchanger, by adopting the calculation method, grid division in the heat transfer calculation process of the sleeve type buried pipe heat exchanger can be reduced, and meanwhile, the complex three-dimensional unsteady-state heat transfer problem is simplified into the two-dimensional unsteady-state heat transfer problem; therefore, simplified calculation can be carried out on the sleeve type ground heat exchanger under different conditions, calculation efficiency is improved, and the method has certain actual use value and popularization value.
Owner:HENAN WANJIANG NEW ENERGY DEV CO LTD

System and method for measuring blade heat exchange coefficient in high-temperature environment

ActiveCN111830083ASolving difficult problems that cannot be directly measuredRaise the flow temperatureRadiation pyrometryMaterial heat developmentEngineeringAir blower
The invention provides a system and a method for measuring a heat exchange coefficient of a blade in a high-temperature environment. The measuring system comprises an air blower, an air compressor, aboiler, an air storage tank, an infrared thermal imager, an experiment section, a thermocouple and the like. Instantaneous high-temperature and high-pressure airflow is applied to a to-be-measured blade through the measuring system, and a temperature value of a surface of the blade is collected through the infrared thermal imager; a differential equation for calculating the heat transfer coefficient is obtained through theoretical derivation, and the heat transfer coefficient corresponding to each measurement point can be obtained through calculation; the measuring system can approximately meet the effect that a constant-temperature incoming flow is suddenly given to act on the wall surface of the experimental blade, the response time of the temperature step is reduced; according to theoretical calculation, the differential equation is simplified under the condition that accuracy is guaranteed, a complex heat exchange problem of the turbine blade can be resolved, the fuel gas temperature for measuring the heat exchange coefficient is increased to 1200 K from 300 K, and a problem that the heat exchange coefficient of the blade cannot be directly measured under the high-temperature environment is effectively solved.
Owner:SHENYANG AEROSPACE UNIVERSITY

Metal-based composite material as well as preparation method and application thereof

The invention provides a metal-based composite material and a preparation method and application thereof. According to the metal-based composite material disclosed by the invention, the reinforcement particles are distributed in the metal matrix in a gradient manner, so that the metal-based composite material has excellent comprehensive performance, including relatively high heat conductivity coefficient, adjustable thermal expansion coefficient, relatively high hardness, relatively low density and good and long-term stable performance, and is an ideal heat dissipation packaging material. According to the metal-based composite material, in the metal-based composite material, the reinforcement particles are distributed in the metal matrix in a gradient mode, the gradient material can relieve the internal thermal stress of the material under the cyclic change of the high-temperature and low-temperature environment, and the failure of electronic components due to the thermal problem can be solved. For example, a silicon carbide aluminum-based composite material (SiCp / Al) with a high volume fraction ratio has excellent comprehensive performance, including relatively high heat conductivity coefficient, adjustable thermal expansion coefficient, relatively high hardness and relatively low density, and is an ideal material in the field of electronic packaging.
Owner:深圳市知行新材料科技有限公司
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