LED module with microchannel heat sink and method of making same

A LED module and heat sink technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of unfavorable ultra-high power LED integration, large heat flow channel thermal resistance, and low LED life, and achieve the goal of overcoming bad conductor air The effect of conductive medium, large volume/area ratio, and avoiding excessive thermal resistance

Inactive Publication Date: 2011-12-14
SHANGHAI YAMING LIGHTING
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide an LED module with a micro-channel heat sink and a preparation method thereof to solve the problem that the thermal resistance of the heat flow channel of the LED module in the prior art is relatively large, which is not conducive to Realize the integration of ultra-high-power LEDs with small area and small volume, and the problems of low life and low reliability of LEDs

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  • LED module with microchannel heat sink and method of making same
  • LED module with microchannel heat sink and method of making same
  • LED module with microchannel heat sink and method of making same

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Embodiment Construction

[0023] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0024] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change...

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Abstract

The invention discloses an LED module with a micro-channel heat sink and a preparation method thereof. The LED module mainly includes a micro-channel heat sink with a micro-channel and an LED chip. The micro-channel heat sink uses silicon as a substrate, and The bottom of the silicon substrate has a plurality of micro-channels for circulating cooling liquid. The LED chip is directly flipped on the micro-channel heat sink through an alloy process, and the heat generated by the LED chip is passed through the alloy layer. It can be conducted to the microchannel heat sink, which is more conducive to heat conduction, has high heat dissipation efficiency, overcomes the defect that traditional heat sinks use air as a conduction medium, and is very suitable for cooling of high-power LED packages , avoiding the problem of excessive thermal resistance in the traditional packaging process, the preparation method of the present invention has simple process and can be used in large-scale industrial production.

Description

technical field [0001] The invention relates to an LED module and a preparation method, in particular to an LED module with a microchannel radiator and a preparation method. Background technique [0002] LED (Light Emitting Diode) is called the fourth-generation lighting source or green light source. It has the characteristics of energy saving, environmental protection, long life, and small size. It can be widely used in various indications, displays, decorations, backlights, general lighting and urban lighting. night scenes etc. Heat dissipation is one of the bottlenecks restricting the popularity of high-power LEDs. If the heat cannot be dissipated quickly, the junction temperature of the LED will be too high, which will affect the service life and reliability of the LED. [0003] The heat flow path of the current mainstream LED packaging is: from the LED chip to the die-bonding layer, and then to the substrate, thermal conductive adhesive and heat sink. This packaging fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/64H01L33/48H01L25/075
CPCH01L2224/45144H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/19107H01L2924/00014H01L2924/00
Inventor 吴军孙宙琰郑利红
Owner SHANGHAI YAMING LIGHTING
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