Metal-based composite material as well as preparation method and application thereof

Abstract

The invention provides a metal-based composite material and a preparation method and application thereof. According to the metal-based composite material disclosed by the invention, the reinforcement particles are distributed in the metal matrix in a gradient manner, so that the metal-based composite material has excellent comprehensive performance, including relatively high heat conductivity coefficient, adjustable thermal expansion coefficient, relatively high hardness, relatively low density and good and long-term stable performance, and is an ideal heat dissipation packaging material. According to the metal-based composite material, in the metal-based composite material, the reinforcement particles are distributed in the metal matrix in a gradient mode, the gradient material can relieve the internal thermal stress of the material under the cyclic change of the high-temperature and low-temperature environment, and the failure of electronic components due to the thermal problem can be solved. For example, a silicon carbide aluminum-based composite material (SiCp / Al) with a high volume fraction ratio has excellent comprehensive performance, including relatively high heat conductivity coefficient, adjustable thermal expansion coefficient, relatively high hardness and relatively low density, and is an ideal material in the field of electronic packaging.

Description

technical field [0001] The invention belongs to the technical field of metal composite materials, and in particular relates to a metal matrix composite material and its preparation method and application. Background technique [0002] In electronic and photonic systems, effective thermal management has always been a key technology for product size miniaturization, performance optimization, functional diversification and effective enhancement of reliability. Semiconductor technology trends indicate that heat dissipation in electronic equipment has continued to increase in recent decades, and heat dissipation will become a limiting factor in the manufacture of high-end electronic equipment for the foreseeable future. Failure to dissipate heat effectively will lead to overheating of electronic equipment, increased temperature, and even failure. With the development of chip technology, the integration level of electronic devices is increasing at a rate of 40% to 50% per year. ...

AI Technical Summary

Problems solved by technology

In order to prevent the substrate from cracking during the mechanical drilling process, aluminum alloy is often used to prepare this part, but it is unavoidable that the remaining aluminum alloy must have an interface with the composite material. This position has a large stress and a small area, and it is most likely to occur. fracture

This is also the place where the substrate has the most faults at present. It can only be avoided by using a net shape process made of SiCp / Al composite material. However, aluminum silicon carbide is difficult to drill by machining.

In addition, the products produced by non-net shape technology still have an aluminum layer with a thickness of tens to hundreds of microns on the surface, forming a large internal stress, which cannot be removed by heat treatment.

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