The invention relates to a laser cutting processing method of a ceramic substrate. The laser cutting processing method comprises the following steps: using a pulse laser device, recombining the laser frequency to enable multiple laser pulses to be located at the same point of a machined workpiece, achieving doting scoring or imaginary line scoring on the ceramic substrate, and carrying out separation in a splintering mode at the later period. The invention further relates to a laser cutting system of the ceramic substrate workpiece. The laser cutting system comprises an X-axis displacement table, a Y-axis displacement table, a CCD camera, a feeding-discharging system, a workpiece suction disc, a locating system, a Z-axis displacement table and a laser focusing assembly, wherein the laser focusing assembly is arranged above the workpiece suction disc, the workpiece suction disc is connected with the Y-axis displacement table, the Z-axis displacement table is arranged above the workpiece suction disc and connected with the laser focusing assembly, the CCD camera is arranged below the workpiece suction disc, and the feeding-discharging system comprises a 90-degree supporting plate, a suction disc A, a suction disc B, a feeding box and a discharging box and is used for completing automatic feeding-discharging motions of the machined workpiece. Both the notch quality and the yield are greatly improved.