81results about How to "Stable capacitance" patented technology

A semiconductor device includes a first insulating film having a cavity, a second insulating film formed on the first insulating film and having an opening exposing the cavity, a lower electrode of a concave shape in cross section formed on the bottom and sides of the cavity, a capacitive insulating film formed on the lower electrode, and an upper electrode formed on the capacitive insulating film. The diameter of the cavity of the first insulating film is larger than that of the opening of the second insulating film, and the end of the second insulating film located on the sides of the opening is formed in an eaves-like part to project like eaves inwardly beyond the sides of the first insulating film.

A dielectric ceramic represented by a general formula: 100BamTiO3+aROn+bMOv+cXOw (where R represents a rare earth element, M represents a predetermined metal element, and n, v, and w represent independently a positive number determined in accordance with the valences of the elements R and M and a sintering aid component X, respectively), and the solid solution regions of the secondary components in the main phase grains are 10% or less (including 0%) on average in terms of a cross-sectional area ratio. The sintering aid component X contains at least Si, and m, a, b, and c satisfy 0.995≦m≦1.030, 0.1≦a≦2.0, 0.1≦b≦3.0, and 0.1≦c≦5.0. In a monolithic ceramic capacitor, dielectric layers are formed from the above-described dielectric ceramic. Consequently, a dielectric ceramic having a good AC voltage characteristic, maintaining a desired large dielectric constant and a good temperature characteristic, exhibiting a small dielectric loss, and being capable of ensuring the reliability and a monolithic ceramic capacitor including the dielectric ceramic are realized.

The surface of a signal electrode is treated as substrate treatment. An oxide film on the surface of the signal electrode is removed by roughing. The roughened surface is used as a surface treated face. A coating of fluororesin is provided on the surface treated face for lining or thermal welding to the lining material. A signal electrode is provided in the resin lining. Since the oxide film was removed from the surface of the signal electrode for roughening, the adhesive force of the coating of the fluororesin is increased. The fluororesin coating and the resin lining melt each other, and the fluororesin coating is strongly bonded to the resin lining. The adhesion between the signal electrode and the resin lining is increased without opening a hole in the signal electrode. A method uses a primer film formed by substrate treatment on the surface of the signal electrode.

A dielectric ceramic contains a BaTiO3-based compound as a main ingredient, and can be represented by the general formula: 100AmBO3+aNiO+bROn+cMOv+dMgO+eXOw where R represents a rare earth element such as Dy, M represents a metal element such as Mn, and X represents a sintering aid component containing Si. Ni is uniformly solid-solved in crystal grains, and the solid-solution region of the rare earth element in the crystal grains is an average 10% or less in terms of a cross section ratio. 0.96≰m≰1.030, 0.05≰a≰3, 0.1≰b≰1.5, 0.1≰c≰1.0, 0.1≰d≰1.5, and 0.05≰e≰3.5 are satisfied. A laminated ceramic capacitor has dielectric layers formed of the dielectric ceramic. As a result, a dielectric ceramic, and a laminated ceramic capacitor having excellent AC voltage characteristics, capable of keeping desired dielectric characteristics and excellent temperature characteristics, and having excellent withstand voltage and capable of ensuring reliability can be realized.

An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.

A semiconductor device includes two floating gates, a control gate and a first dielectric layer. The floating gates are disposed on a semiconductor substrate. The control gate partially overlaps each of the floating gates, and a part of the control gate is disposed between the two floating gates. Furthermore, the first dielectric layer disposed between the two floating gates and the control gate has a fixed thickness.

Provided is a laterally diffused metal-oxide-semiconductor field-effect transistor, comprising a substrate (110), a source (150), a drain (140), a body region (160), a P-type field-limiting ring (135), and a well region on the substrate (110); the well region comprises an inserted well (122), which has P-type doping and is disposed below the drain and connected to the drain; N wells (124) disposed at the two sides of the inserted well (122); a P well (126) disposed next to the N well (124) and connected to the N well (124); a P-type field-limiting ring (135), which is disposed inside the N well (124), is a closed ring-shaped structure, and is located at the periphery below the drain (140); the inserted well (122) extends in its longitudinal direction to the position where it is in contact with said P-type field-limiting ring (135); the source (150) and the body region (160) are disposed inside the P well (126).