Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Bonding sheet for capacitor and method for manufacturing capacitor built-in printing wiring board

A technology for printed wiring boards and manufacturing methods, applied in the direction of multilayer circuit manufacturing, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., to achieve cheap and stable manufacturing, and the effect of stabilizing electrostatic capacitance

Inactive Publication Date: 2008-06-25
NIPPON MEKTRON LTD
View PDF4 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] As described above, conventional capacitors for printed wiring boards with built-in components have problems in terms of inter-wiring insulation and high-frequency characteristics as an interlayer arrangement of printed wiring boards.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bonding sheet for capacitor and method for manufacturing capacitor built-in printing wiring board
  • Bonding sheet for capacitor and method for manufacturing capacitor built-in printing wiring board
  • Bonding sheet for capacitor and method for manufacturing capacitor built-in printing wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] FIG. 1 is a cross-sectional process diagram showing a method of manufacturing an adhesive sheet for capacitors in Example 1 of the present invention. First, as shown in FIG. 1(1), a base material having high fluidity adhesive resin layers 2 and 3 on both surfaces of a high dielectric constant and low fluidity dielectric layer 1 is prepared. Here, the dielectric layer 1 is a film-shaped molded product having a dielectric constant of about 2000 and containing about 60 to 85% by weight of barium titanate, and about 15 to 40% by weight of a solvent portion and an epoxy resin.

[0053] The relative dielectric constant of this film-like molded article is about 20-60. Regarding the thickness, it is preferable to be as thin as possible within the range that does not cause film defects such as pinholes, and a thickness of 5 to 30 μm is also suitable because of its flexibility. However, if a single body is used, it is brittle and prone to tearing, so the flow of various processe...

Embodiment 2

[0076] 2 is a cross-sectional process view showing a method of manufacturing a capacitor in Example 2 of the present invention. First, as shown in FIG. 2(1), prepare adhesive resin layers 2 and 3 with high fluidity on both sides of a dielectric layer 1 with high dielectric constant and low fluidity as shown in FIG. 1(1). base material.

[0077] Next, as shown in FIG. 2(2), prepare a metal base material having a three-layer structure of copper foil 4a (for example, a thickness of 18 μm) / nickel foil 7 (for example, a thickness of 2 μm) / copper foil 5 (for example, a thickness of 18 μm). , the electrode portion 5a is formed by selective etching in the photoprocessing method.

[0078] In addition, although not shown in figure, the electrode part 5b which opposes is formed in the copper foil 4a. The exposed nickel foil other than the electrode portion was removed by selective etching, and a roughening treatment for improving the adhesion strength between the copper foil and the ad...

Embodiment 3

[0086] 3 is a cross-sectional process view showing a method of manufacturing a capacitor in Example 3 of the present invention. First, as shown in FIG. 3(1), prepare the substrate shown in FIG. 1(1) with high fluidity adhesive resin layers 2, 3 on both sides of the dielectric layer 1 with high dielectric constant and low fluidity. Material.

[0087] Next, as shown in FIG. 3(2), a so-called double-sided copper-clad laminate having copper foils 10 and 11 on both sides of a polyimide film 9 having a thickness of 25 μm is prepared, and is processed by selective etching in a photoprocessing method. The electrode portion 10a is formed. In addition, although not shown in figure, the opposing electrode part 10b is formed on the polyimide film 9. As shown in FIG. And roughening process for improving the adhesive strength of copper foil and an adhesive material in a subsequent process is performed.

[0088] Next, as shown in FIG. 3 (3), the base material on which the electrodes 10a, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a chip for forming a thin capacitor applied in parts built-in multi-layer flexible printed wiring boards and provides a method for manufacturing the parts built-in multi-layer flexible printed wiring boards using the chip. The invention also relates a bonding film for the capacitor and the manufacturing method, which is used for forming the capacitor by bonding electrodes on two surfaces of a dielectric layer, wherein, the capacitor is built-in printed wiring boards to form the bonding film. The bonding film is characterized in that: having a dielectric layer (1) which has high dielectric constant and is formed by flowing materials which can not occur accompanying substantive thickness changing and transforming at the pressure and temperature of the pressing time when the electrodes are boned onto the dielectric layer and has two surfaces with cohesive property; and bonding resin layers (2, 3), which have the fluidity to fill the surrounding of the electrodes and are arranged on two surfaces of the dielectric layer (1).

Description

technical field [0001] The present invention relates to an adhesive sheet (capacitor) and a method of manufacturing a printed wiring board with a built-in capacitor manufactured using the adhesive sheet. An adhesive sheet for a capacitor of a multilayer flexible printed wiring board and a method for manufacturing a printed wiring board using the same. Background technique [0002] In recent years, there has been an increasing demand for miniaturization and high density of mounting substrates mounted in small electronic devices. As part of this, there has been a growing demand to mount CSPs (Chip Scale Packages), chip resistors, chip capacitors, and the like on the surface of wiring boards at high density, centering on mobile phones and the like. [0003] In multilayer printed wiring boards loaded with components such as CSPs, capacitors such as decoupling capacitors are provided for various purposes, but due to the increase in mounting costs, component costs, and high-densi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/16H05K3/46H01L23/498H01L21/48
CPCH01L2924/0002H01L2924/00H05K3/46
Inventor 松田文彦
Owner NIPPON MEKTRON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com