Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

139results about How to "Solve the lack of life" patented technology

Light emitting element

Provided is an organic thin film light emitting element which has achieved all of improved luminous efficiency, improved driving voltage and improved durability life. Specifically provided is a light emitting element which comprises a hole transport layer and an electron transport layer between a positive electrode and a negative electrode and emits light by means of electrical energy. The light emitting element is characterized in that: the hole transport layer of the light emitting element contains a compound represented by general formula (1); the electron transport layer contains a donor compound; and the donor compound is an alkali metal, an inorganic salt containing an alkali metal, a complex of an alkali metal and an organic substance, an alkaline earth metal, an inorganic salt containing an alkaline earth metal, or a complex of an alkaline earth metal and an organic substance. (In the formula, R1-R20 each represents one group selected from the group consisting of hydrogen, deuterium, an alkyl group, a cycloalkyl group, an amino group, an aryl group, a heterocyclic group, a heteroaryl group, an alkenyl group, a cycloalkenyl group, an alkynyl group, analkoxy group, an alkylthio group, an arylether group, an arylthioether group, a halogen, a cyano group, a —P(═O)R24R25 group and a silyl group; R24 and R25 each represents an aryl group or a heteroaryl group; and these substituents may be further substituted, or adjacent two substituents may combine together to form a ring. Meanwhile, R21-R23 may be the same or different and each represents one group selected from the group consisting of an alkyl group, a cycloalkyl group, an aryl group and a heteroaryl group; and these substituents maybe further substituted.)
Owner:TORAY IND INC

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

ActiveUS20090096100A1Decrease in heat dissipation propertyImprove heat dissipation propertyPorous dielectricsFinal product manufactureThermal cycle testSemiconductor
A die bonding portion is metallically bonded by well-conductive Cu metal powders with a maximum particle diameter of about 15 μm to 200 μm and adhesive layers of Ag, and minute holes are evenly dispersed in a joint layer. With this structure, the reflow resistance of about 260° C. and reliability under thermal cycle test can be ensured without using lead.
Owner:RENESAS ELECTRONICS CORP

Organic electroluminescence device

An organic electroluminescence device including a lower electrode disposed on a substrate, an organic layer having at least a light emission layer and disposed above the lower electrode, and upper electrode having a transparent conductive film and disposed above the organic layer, in which the device has an electron injecting layer between the organic layer and the upper electrode. The electron injecting layer has a buffer layer comprising an insulative material and a mixed layer comprising an organic material that has an electron transporting property and a metal material that has an electron injecting property.
Owner:SONY CORP

Ai/Ain Joint Material, Base Plate For Power Module, Power Module, And Manufacturing Method Of Ai/Ain Joint Material

A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.
Owner:MITSUBISHI MATERIALS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products