The invention discloses a
silicon on insulator (SOI) process-based back gate drain / source semi-floating front gate power-
metal-
oxide-
semiconductor field effect transistor (P-
MOSFET)
radio frequency switch zero loss device. A drain / source region of a
silicon on insulator P-channel
metal oxide semiconductor (SOI PMOS) device is transformed, and the
junction depth of a source (or drain) region is set to be slightly smaller than the thickness of N-type top
silicon, namely an N-type channel region; the back gate drain semi-floating is taken as an example, the
junction depth of a source region is deeper, the
junction depth of the drain region is set to be slightly smaller than the thickness of P-type top silicon, a parasitic
diode is formed,
direct current signals applied to a drain
electrode are isolated, and by offsetting a body and a back gate, a back gate
MOSFET channel is switched-on; according to the structure, impedence under the on state of a front gate
MOSFET is adjusted, the
radio frequency loss of the front gate MOSFET serving as a switch under the on state is reduced, and even a zero loss
radio frequency switch is formed; when the self-
heating effect of the device is generated to cause negative impedence of the back gate MOSFET, or when the back gate MOSFET works in an amplification state, a front gate
coupling signal can be directly amplified, and
energy loss of the front gate under the on state is compensated, so that an ultralow and zero loss radio frequency switch is formed.