1786 results about "Balun" patented technology

A power line coupler for communicating data signals over a power distribution system having a first and second overhead energized medium voltage power line conductors is provided. In one embodiment, the coupler includes a first lightening arrestor having a first end and a second end, wherein the first end of the first arrestor is connected to the first power line conductor. The coupler further includes a first high frequency impedance having a first end connected to the second end of the first lightening arrestor and the first impedance having a second end connected to a neutral conductor of the power line distribution system. The coupler may further include a second lightening arrestor having a first end and a second end, wherein the first end of the second arrestor is connected to the second power line conductor. The coupler further including a second high frequency impedance having a first end connected to the second end of the second lightening arrestor and a second end connected to the neutral conductor. The first high frequency impedance and the second high frequency impedance may each comprise an air core coil that forms an inductor. The coupler may further include a balun having a first winding and a second winding, wherein the first winding is coupled to a communication device, and wherein the second winding has a first end connected to the first end of the first high frequency impedance and a second end connected to the first end of the second high frequency impedance.

An RF antenna coupling structure includes a first transformer, a second transformer, and a transformer balun. The first transformer includes a primary winding and a secondary winding, wherein the primary winding of the first transformer is operably coupled to a power amplifier, and wherein the secondary winding of the first transformer has a desired output impedance corresponding to the operational needs of the power amplifier. The second transformer includes a primary winding and a secondary winding, wherein the primary winding of the second transformer is operably coupled to a low noise amplifier, and wherein the secondary winding of the second transformer has a desired output impedance corresponding to the needs of the low noise amplifier. The transformer balun includes a differential winding and a single-ended winding, wherein the differential winding is operably coupled to the secondary windings of the first and second transformers and the single-ended winding is operably coupled to an antenna.

A radio frequency integrated circuit includes a power amplifier, a low noise amplifier, a first transformer balun, and a second transformer balun. The power amplifier includes a first power amplifier section and a second power amplifier section. When enabled, the first and second power amplifier sections amplify an outbound radio frequency (RF) signal to produce a first amplified outbound RF signal and a second amplified outbound RF signal, respectively. The power amplifier provides the first amplified outbound RF signal to the first transformer balun and the second outbound RF signal to the second transformer balun, where the first transformer balun is coupled to a first antenna and the second transformer balun is coupled to a second antenna. The low noise amplifier includes a first low noise amplifier section and a second low noise amplifier section. When enabled, the first low noise amplifier section amplifies a first inbound RF signal to produce a first amplified inbound RF signal, and, when enabled, the second low noise amplifier section amplifies a second inbound RF signal to produce a second amplified inbound RF signal. The low noise amplifier receives the first inbound RF signal from the first transformer balun and receives the second inbound RF signal from the second transformer balun.

An amplifier system is provided that includes a first balun with an input and an output. A second balun has an input and an output. An amplifier assembly is provided and has at least a first amplifier in parallel to a second amplifier. The first amplifier provides the input to the first balun and the second amplifier provides the input to the second balun. A power combining circuit is provided. The first and second baluns are coupled to a common node of the power combining circuit. A first lumped element circuit is coupled between the output of the first balun and the power combining circuit. A second lumped element circuit is coupled between the output of the second balun and the power combing circuit. The outputs are coupled to the common node.

A triple balanced mixer has a compact size and is readily assembled. The triple balanced mixer has a planar substrate that is formed from several layers of low temperature co-fired ceramic. The substrate has a top layer, a bottom layer and inner layers. Vias extend through the substrate. A local oscillator balun and RF balun are located on the inner layers. An intermediate frequency balun is mounted to the top layer. Diode rings are mounted on the top layer. The diode rings are electrically connected to the local oscillator balun, the RF balun and the intermediate frequency balun through the vias.

A frequency upconverter using mixers operating on one or more signals and inverted versions thereof and a subtractor, such as a balun, for subtractively combining the mixer outputs to produce an upconverted signal.

A near field probe for testing installed components of an electromagnetic radiating system on a missile. The probe design comprises a diode antenna with a balun. The probe utilizes a dual diode arrangement which provides approximately twice the output voltage as the previous probe. The probe may then be placed further away from the radiating system under test.

The present invention provides all organic fully-packaged miniature bandpass filters, baluns, diplexers, multiplexers, couplers and a combination of the above manufactured using liquid crystalline polymer (LCP) and other multilayer polymer based substrates. These devices are manufactured using one or more LCP layers having integrated passive components formed thereon to provide the density and performance necessary for multi-band wireless devices. In the designs involving multiple LCP layers, the LCP layers are separated by prepeg layers. In accordance with an aspect of the present invention, coplanar waveguide, hybrid stripline / coplanar waveguide and / or microstrip topologies are utilized to form the integrated passive components, and the devices can be mass produced on large area panels at least 18 inches by 12 inches with line widths smaller than 10 um.