The invention relates to a preparation method of an SMT (surface-mounted technology)
adhesive, and belongs to the technical field of binding materials. According to the preparation method of the SMT
adhesive, micro
silicon powder is taken as packing for preparation of the SMT
adhesive, does not easily react with other substances and does not chemically react with most acid and alkali, particles ofthe micro
silicon powder uniformly cover the surface of an object and have higher
corrosion resistance, tensile strength and
compressive strength of a cured product can be enhanced, and
wear resistance can be improved; besides, the micro
silicon powder is high in purity, low in
impurity content and stable in performance and can reduce exothermic peak temperature of an
epoxy resin curing reaction,reduce
linear expansion coefficient and shrink rage of the cured product and increase
flame retardant property, so that the high-
temperature resistance of the SMT adhesive is improved. By means of addition of talcum powder for preparation of the SMT adhesive, the talcum powder can be subjected to a
chemical reaction with an
organosilicon functional group in a
silane coupling agent, silicon oxygenbonds with certain adhesive strength and protection force are formed, a
coating can continuously bear certain
heat load, high-temperature adhesive force is increased, and the high-
temperature resistance of the SMT adhesive is improved accordingly.