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30results about How to "Increase compound rate" patented technology

Method for manufacturnig silicon high-speed semiconductor switch device

The method is applicable to manufacture silicon semiconductor binistor with at least one PN junction such as GTO, IGBT etc. General manufacturing steps is carried out till the step of making metalized electrode. Platinum-silicon alloy is made on surface of silicon. Using proton or particle injection forms local high density defect area. Heating and annealing makes the defect area absorb platinum to convert to platinum impurity range. Then, General manufacturing steps is carried out till manufacturing completion. The performances of the invention are better than present life control technique. The parts made by the invention possesses higher switching speed and backward recovery speed, but the forward voltage drop and reverse leakage are not increased visibly.
Owner:BEIJING UNIV OF TECH

Preparation method of oxygen-sulfur dual-doped graphite phase carbon nitride

The invention discloses a preparation method of oxygen-sulfur dual-doped graphite phase carbon nitride. The method comprises the following steps: performing one-step thermal polymerization on melamineand L-cysteine at a temperature of 400-700 DEG C according to a mass ratio (1.5-2.5):100 of the L-cysteine to melamine, thereby obtaining the oxygen-sulfur dual-doped graphite phase carbon nitride. According to dual doping in the invention, the element O and the element S respectively enter the graphite phase carbon nitride in a chemical bond form. The energy gap of the doped graphite phase carbon nitride is reduced, the impedance is reduced, the graphite phase carbon nitride has high photocatalytic activity, and the photocatalytic nitrogen fixation efficiency of 2.0% of GCNOS reaches 0.509 mMg<-1>h<-1> within 240 minutes, and reaches 2.1 times that of the photocatalytic nitrogen fixation efficiency of pure graphite phase carbon nitride.
Owner:NANJING UNIV OF SCI & TECH

Back junction backcontact solar cell

The invention provides a back junction backcontact solar cell. The back junction backcontact solar cell comprises a substrate, a composite layer, a tunneling oxide layer, a P-type doped semiconductor layer, an N-type doped semiconductor layer, a positive electrode and a negative electrode, wherein the composite layer is combined on a front surface of the substrate, the tunneling oxide layer is combined on a back surface of the substrate, the P-type doped semiconductor layer and the N-type doped semiconductor layer are combined on the tunneling oxide layer, the positive electrode is arranged on the P-type doped semiconductor layer, and a negative electrode is arranged on the N-type doped semiconductor layer. The invention proposes a back junction backcontact solar cell employing a tunneling oxide layer passivation contact structure; with the adoption of the tunneling oxide layer passivation contact structure, direct contact of a metal electrode and the substrate is prevented, the combination of a carrier on a metal contact interface is effectively reduced, and an opening voltage of the cell is increased; and moreover, combination addition cannot brought by metal contact, the vast majority of areas of an emission field and a back field can be covered by metal contact, transverse transmission of the carrier is prevented, the series resistance is favorably reduced, and the cell efficiency is further improved.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI

Hexagonal boron nitride modified graphitized carbon nitride composite optical catalyst as well as preparation method and application thereof

The invention discloses a hexagonal boron nitride modified graphitized carbon nitride composite optical catalyst as well as a preparation method and application thereof. According to the composite optical catalyst, by taking graphitized carbon nitride as a carrier, laminated hexagonal boron nitride modifies the graphitized carbon nitride carrier. The preparation method comprises the following steps: mixing the hexagonal boron nitride with a graphitized carbon nitride precursor; and calcining the mixed precursor to obtain the hexagonal boron nitride modified graphitized carbon nitride composite optical catalyst. The hexagonal boron nitride modified graphitized carbon nitride composite optical catalyst disclosed by the invention has the advantages of being environmentally friendly, fully free of metal doping, large in specific surface area, high in photoproduction electron-hole separating efficiency, high in optical catalytic activity, good in stability, corrosion-resistant and the like. The preparation method has the advantages of being simple, low in cost of raw materials, less in energy consumption, easy to control conditions and the like. The composite optical catalyst disclosed by the invention is used for degrading dye wastewater and has the advantages of being simple in application method, stable in optical catalytic performance, high in corrosion resistance, high in dye wastewater degrading efficiency.
Owner:HUNAN UNIV

Flip-chip structure micro-size photonic crystal LED array chip and preparation method thereof

The invention discloses a flip-chip structure micro-size photonic crystal LED array chip and a preparation method thereof. The LED array chip of the invention has four light emitting units connected in parallel, the metal connecting line of the positive electrode and the semiconductor material are separated by a dielectric insulation layer, and the negative electrode is directly covered on the upper surface of the semiconductor material. The active region of the light-emitting unit has a photonic crystal with periodic distribution, and the depth of the photonic crystal exceeds the depth of theactive layer. Except electrode pad, DBR is distributed on the whole chip surface. Metal electrodes form metal mirrors. The preparation method of the invention adopts the scheme that an ohmic contactlayer and an electrode are firstly prepared and then a photonic crystal is etched without planarizing and the like traditional process flow; Using thick strip dielectric insulating layer to insulate the electrode from semiconductor material and thin dielectric mask layer and adhesive mask layer to etch together is conducive to the deposition of DBR and the rapid escape of photon mode. The processflow of the invention is simple and reliable.
Owner:SOUTH CHINA UNIV OF TECH

Glass powder, preparation method thereof and application of glass powder in TOPCon battery

The invention discloses glass powder, and relates to the field of silver electrode slurry. The glass powder comprises the following components in parts by weight: 25-50 parts of lead oxide, 25-45 parts of tellurium oxide, 10-30 parts of bismuth oxide, 2-10 parts of molybdenum oxide, 0-6 parts of silicon dioxide, 0-6 parts of boron oxide, 0-4 parts of alkaline earth metal oxide, 0-6 parts of alkalimetal oxide and 0-3 parts of rare earth metal oxide. The invention further provides TOPCon battery silver paste containing the glass powder, the contact performance of the TOPCon battery silver pasteon thin Poly (60-100 nm) and metal compounding can be balanced, and the efficiency of a client is improved by 0.1% or above.
Owner:GUANGZHOU RUXING TECH DEV +1

High-speed photonic integrated chip based on surface plasmon enhancement and preparation method

The invention relates to a high-speed photon integrated chip based on surface plasmon enhancement and a preparation method. The chip takes a silicon substrate LED epitaxial wafer as a carrier, an LED device and a photoelectric detector are arranged on the silicon substrate LED epitaxial wafer, the LED device and the photoelectric detector are connected through a waveguide, and the LED device and the photoelectric detector each comprise a p-n junction, a p-type electrode and an n-type electrode. The surface plasmon enhanced LED device, the optical waveguide and the surface plasmon enhanced photoelectric detector are integrated on the same chip, and light emitted by the LED device is laterally coupled into the optical waveguide, is transmitted through the optical waveguide and is detected by the photoelectric detector at the other end of the waveguide. The surface plasmon coupling effect can improve the modulation bandwidth of the LED device and the responsivity of the photoelectric detector, and meanwhile, increase the overlapping degree of the light-emitting spectrum of the LED and the response spectrum of the detector, and finally a high-speed photon integrated chip is achieved.
Owner:NANJING UNIV OF POSTS & TELECOMM

High-speed LED optical communication modulator

The invention discloses a high-speed LED optical communication modulator. The high-speed LED optical communication modulator comprises a control unit and a variable power supply unit; the variable power supply unit is an energy supply unit capable of switching in the positive and negative directions; the control unit generates switching and sequential control signals so that the variable power supply unit is driven to supply power to an LED; the sequential control signals are used for reducing the bending of an energy band via sequential control so that radiative recombination of carriers is improved; when the variable power supply supplies power in the positive direction, the LED is turned on, and the carriers are over-injected; and when the variable power supply supplies power in the reverse direction, the LED is turned off, and the carriers are injected in a reverse manner. The high-speed LED optical communication modulator also comprises a discharge circuit used for further accelerating the turn-off. According to the high-speed LED optical communication modulator, the over-injection of the carriers during turn-on and reverse injection of the carriers during turn-off are controlled so that the recombination rate of the carriers is increased, and the switching speed is greatly increased; the turn-off is further accelerated via the auxiliary discharge circuit; and the bending of the energy band is reduced via sequential control, and the radiative recombination of the carriers is improved.
Owner:NANJING UNIV

Distributed feedback laser chip and preparation method thereof

The embodiment of the invention discloses a distributed feedback laser chip and a preparation method thereof. The laser chip comprises a substrate, a laser structure located on one side of the substrate, a first electrode and a second electrode. A grating pattern is arranged on the side, adjacent to the second electrode, of the laser structure, the grating pattern comprises a ridge-shaped structure, the ridge-shaped structure comprises first areas and second areas which are circularly arranged in the first direction, and the refractive index of the first areas is larger than that of the secondareas; the second electrode covers the ridge-shaped structure, extends to partial regions of the second regions and is in contact with a film layer, close to one side of the substrate, of the film layer where the grating pattern is located, wherein the first direction is parallel to the plane where the substrate is located. The technical scheme of the embodiment of the invention has the advantages of high modulation rate, high internal quantum efficiency, low resistance, good single-mode characteristic, small stress, low cost and the like, can greatly improve the modulation rate, the electro-optical conversion efficiency, the single-mode characteristic, the production yield and the like of the laser, and is very beneficial to large-scale production and application.
Owner:因林光电科技(苏州)有限公司

White light organic light emitting diode and manufacturing method thereof

The invention discloses a white light organic light emitting diode and a manufacturing method thereof. The white light organic light emitting diode comprises an ITO glass substrate, a hole transport layer, a nano particle layer, a white light emitting layer, an electron transmission layer and a composite metal cathode layer stacked sequentially from bottom to top, wherein the nano particle layer is formed by mixing of silica-coated silver nanometer cubes and silica nanospheres. In comparison with the prior art, through introducing the silica-coated silver nanometer cubes and the silica nanospheres, the performance of the white light organic light emitting diode is effectively enhanced, and potential application value is achieved.
Owner:NANJING UNIV OF POSTS & TELECOMM

High-speed LED optical-communication resonant-type modulator

The invention discloses a high-speed LED optical-communication resonant-type modulator. The modulator comprises a power supply unit, a control unit, an inductor, a resistor, a capacitor, an LED, a switch K101 and a switch K103; when the K101 and the K103 are connected, the voltage-limiting constant-current control unit provides a forward power supply for the LED, the LED is quickly overshot and connected then, and the resonant capacitor performs energy storage through the resonant inductor; and, when the K103 is still connected, the K101 is disconnected, resonance is generated between the inductor and the capacitor, a reverse power supply is provided for the LED in an LED reverse recovery time, and then the LED is quickly and electrically disconnected. The modulator further comprises a K102; and, when the K102 is connected, and when the K101 and the K103 are disconnected, forward one-way discharging of the LED is performed further. The composite rate of carriers is improved, so the switch speed is greatly improved; disconnection is further accelerated through an auxiliary discharge pathway; and energy zone bending is reduced through time sequence control, and radiation recombination of the carriers is improved.
Owner:NJU OPTOELECTRONICS ENG RES INST CO LTD

Rare earth electrogenerated dark blue light device

The invention belongs to the field of photoelectric devices, and discloses a rare earth electrogenerated dark blue light device. The device sequentially comprises a top electrode, an electron transport layer, a light emitting layer, a hole transport layer and a bottom electrode from top to bottom, wherein the light emitting layer is made of an Eu-based perovskite type material, and in the Eu-basedperovskite type material, an Eu element occupies a B site in a perovskite ABX3 structure and does not contain Pb; the electron transport layer and the hole transport layer are used for localizing electrons or holes in the light-emitting layer and adjusting injection balance of the electrons and the holes. According to the invention, the Eu-based perovskite type material (such as CsEuBr3) is usedas a luminescent layer material to construct the rare earth electrogenerated dark blue light device, and the material is an inorganic material, so that the material is good in stability, not easy to age and long in service life, the existing display color gamut can be widened, and the technical problems of poor OLED stability, easy aging and easy blue light color distortion are solved.
Owner:HUAZHONG UNIV OF SCI & TECH

Visible light communication LED array and preparation method thereof

The invention provides a visible light communication LED array and a preparation method thereof. The visible light communication LED array comprises a substrate, wherein the M LED structures are located on the substrate at intervals, M is larger than 2, and each LED structure comprises a mesa structure, an n electrode and a p electrode, and the n electrode and the p electrode are located on the mesa structure; an interconnection line located on the substrate and the mesa structure, wherein the interconnection line is connected between the p electrode of one LED structure and the n electrode ofthe other LED structure in the M LED structures; an insulating protection layer positioned on the interconnection line; and a welding spot window penetrating through the insulating protective layer so as to expose part of the interconnection line as a welding spot, wherein the welding spot is connected with the LED structure in series. The visible light communication LED array provided by the invention can improve the modulation bandwidth and the optical power at the same time, thereby improving the signal transmission quality in visible light communication.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Novel plasma enhanced chemical vapor deposition (PECVD) coating technology

The invention relates to the field of crystalline silicon surface coating, in particular to a novel plasma enhanced chemical vapor deposition (PECVD) coating technology. The technology comprises the steps that crystalline silicon is placed into a furnace and heated, and the temperature is stabilized; ammonia gas is introduced for purging; vacuumizing for leakage detection is performed; pre-deposition is performed; chemical reaction gas is injected, and radio frequency ionization is performed; vacuumizing is performed; gas is injected; annealing is performed; and the coated crystalline siliconis taken out of the furnace. According to battery pieces prepared through silicon wafers coated by means of the coating technology provided by the invention, bombardment damage on the surfaces of thesilicon wafers is repaired, the number of dangling bonds on the surfaces of the silicon wafers is decreased, the number of recombination centers is decreased, the recombination rate of electrons is decreased, the number of electron hole pairs used for outputting current is increased, the short-circuit current of the battery pieces is increased, the efficiency of the battery pieces is improved, andthe competitiveness in the industry is greatly enhanced.
Owner:JETION SOLAR HLDG

Ultrafast micro-LED of MIS structure based on local surface plasmon coupling enhancement and production method of ultrafast micro-LED

The invention relates to the field of photoelectric semiconductors, and particularly relates to an ultrafast micro-LED of an MIS structure based on local surface plasmon coupling enhancement and a production method of the ultrafast micro-LED. The micro-LED sequentially comprises a substrate, a buffer layer, a gallium nitride layer, a p-type active layer, an insulating layer, a current expansion layer and a metal nanoparticle structure from bottom to top, an opening extending to the surface of the p-type active layer is formed in the surface of the metal nanoparticle structure so that an exposed area is formed on the surface of the p-type active layer, a p-type ohmic contact electrode is arranged on the surface of the exposed area, and an n-type ohmic contact electrode is arranged on the surface of the metal nanoparticle structure. According to the micro-LED provided by the invention, the carrier recombination rate and recombination efficiency of the device can be effectively improved, and the service life of effective carriers is shortened so that the modulation bandwidth of the device is greatly increased, and the application of the micro-LED in optical communication is expanded.
Owner:XIAMEN UNIV

High-speed modulation light emitting diode and manufacturing method thereof

The invention relates to a high-speed modulation light emitting diode and a manufacturing method thereof. The light emitting diode comprises a light emitting diode chip comprising a light emitting epitaxial structure. The light emitting epitaxial structure comprises a buffering layer, a first N-type gallium nitride contact layer, a gallium nitride depletion layer, a P-type aluminum gallium nitride electronic barrier layer, a first P-type indium gallium nitrogen layer, a quantum well layer, a second P-type indium gallium nitrogen layer, an N-type gallium nitride layer, a second N-type gallium nitride contact layer and a conductive layer. The quantum well layer is one of an undoped In<0.2>Ga<0.8>N / In<0.05>Ga<0.95>N quantum well layer and an indium gallium nitrogen / gallium nitride quantum well layer of a silicon doping barrier whose deposition quardi-period condensation is 5*1017 cm<-3>. The invention also provides a manufacturing method of the high-speed modulation light emitting diode. According to the invention, while the high-speed modulation light emitting diode is kept with light outputting power similar to that of a traditional light emitting diode, modulation width is increased.
Owner:迪优未来科技(清远)有限公司

A rare-earth electro-induced deep blue light device

The invention belongs to the field of optoelectronic devices, and discloses a rare-earth electroinduced deep blue light device, which sequentially includes a top electrode, an electron transport layer, a light-emitting layer, a hole transport layer and a bottom electrode from top to bottom, wherein the light-emitting layer adopts The material is Eu-based perovskite-type material. In Eu-based perovskite-type material, Eu element occupies the perovskite ABX 3 The B site in the structure does not contain Pb; the electron transport layer and the hole transport layer are used to localize electrons or holes in the light-emitting layer and adjust the injection balance of electrons and holes. The present invention uses Eu-based perovskite materials (such as CsEuBr 3 ) is used as a light-emitting layer material to construct a rare-earth electro-induced deep blue light device. Since the material is an inorganic material, it has good stability, is not easy to age, and has a long life. Technical issues with color distortion.
Owner:HUAZHONG UNIV OF SCI & TECH

Formula and manufacturing method of waterproof coiled material floor

The invention discloses a formula and a manufacturing method of a waterproof coiled material floor. The formula of the waterproof coiled material floor comprises the following components: 40-45 partsof a softener, 14-19 parts of butadiene styrene rubber, 8-13 parts of polypropylene particles, 18-25 parts of a modifier, 27-35 parts of a filler, 7-10 parts of aminopropyltriethoxysilane, 2-5 parts of methyl methacrylate, 12-16 parts of an adhesive, 5-8 parts of an accelerant, 3-4 parts of a preservative and 7-11 parts of a thermal insulation material. Through the added adhesive, the viscosity ofthe mixed material during compounding can be improved; the tightness degree of the compounded material is improved; by use of the accelerant, the compounding speed of the materials can be increased,the compounding and forming speed of the materials can be increased as soon as possible, time is saved, the waterproof performance of the materials is guaranteed, meanwhile, the heat insulation effectof the materials is enhanced, practicability is improved, and by means of the manufacturing method, the machining and manufacturing process is simplified, machining efficiency is improved, and meanwhile quality is guaranteed.
Owner:优用(湖州)新材料有限公司

High speed led optical communication modulator

The invention discloses a high-speed LED optical communication modulator. The high-speed LED optical communication modulator comprises a control unit and a variable power supply unit; the variable power supply unit is an energy supply unit capable of switching in the positive and negative directions; the control unit generates switching and sequential control signals so that the variable power supply unit is driven to supply power to an LED; the sequential control signals are used for reducing the bending of an energy band via sequential control so that radiative recombination of carriers is improved; when the variable power supply supplies power in the positive direction, the LED is turned on, and the carriers are over-injected; and when the variable power supply supplies power in the reverse direction, the LED is turned off, and the carriers are injected in a reverse manner. The high-speed LED optical communication modulator also comprises a discharge circuit used for further accelerating the turn-off. According to the high-speed LED optical communication modulator, the over-injection of the carriers during turn-on and reverse injection of the carriers during turn-off are controlled so that the recombination rate of the carriers is increased, and the switching speed is greatly increased; the turn-off is further accelerated via the auxiliary discharge circuit; and the bending of the energy band is reduced via sequential control, and the radiative recombination of the carriers is improved.
Owner:NANJING UNIV

Current type CdZnTe detector with strip-shaped electrode structure and preparation method of current type CdZnTe detector

The invention provides a current type CdZnTe detector with a strip-shaped electrode structure and a preparation method of the current type CdZnTe detector, and solves the problems of low response speed and low response amplitude of an existing CdZnTe detector to pulse X rays. The current type CdZnTe detector takes a CdZnTe crystal as a substrate, two surfaces of the substrate are respectively provided with a strip-shaped electrode and a planar electrode, and the exposed surfaces of the substrate are subjected to oxidation treatment; and the strip-shaped electrode and the planar electrode are in ohmic contact with the CdZnTe crystal.
Owner:NORTHWESTERN POLYTECHNICAL UNIV

High-speed LED optical communication bridge-type modulator

The invention discloses a high-speed LED optical communication bridge-type modulator, and the modulator comprises a power supply unit, an LED, a switch K101, a switch K102, a switch K103, a switch K104, a switch K105, a control unit, a voltage-limiting constant current control unit, and a constant voltage control unit. The switches K101 and K102 are connected, and the switches K103, K104 and K105 are disconnected. The forwarding power supply of the LED is carried out, thereby enabling the LED to be quickly overshot and connected. The switches K103 and K104 are connected, and the switches K101, K102 and K105 are disconnected. The reverse power supply of the LED is carried out, thereby enabling the LED to be quickly turned off. The control of time sequence controls the time of reverse power supply through the monitoring of a reverse current of the LED, and the reverse power supply is not carried out in the whole disconnection process but in a small time period, so as to prevent band bending from causing the great decrease of radiative recombination rate, and improving the disconnection speed of light. The switch K105 is connected, and the switches K101, K102, K103 and K104 are disconnected. The switch K105 is a discharge circuit which aims at speeding up the recombination of residual carriers of the LED, and controls the forwarding unidirectional discharge of the LED. The modulator improves the recombination speed of carriers, and is high in switching speed.
Owner:NJU OPTOELECTRONICS ENG RES INST CO LTD

A distributed feedback laser chip and its preparation method

The embodiment of the invention discloses a distributed feedback laser chip and a preparation method thereof. Wherein the laser chip includes a substrate, a laser structure on one side of the substrate, a first electrode, and a second electrode; a grating pattern is arranged on the side adjacent to the second electrode of the laser structure, and the grating pattern includes a ridge structure, and the ridge structure It includes a first region and a second region arranged circularly along the first direction, the refractive index of the first region is greater than that of the second region; the second electrode covers the ridge structure and extends to a part of the second region, and The film layer where the grating pattern is located is in contact with the film layer on the side close to the substrate; wherein, the first direction is parallel to the plane where the substrate is located. The technical solution of the embodiment of the present invention has the advantages of high modulation rate, high internal quantum efficiency, low resistance, good single-mode characteristics, small stress, and low cost, and can greatly improve the modulation rate, electro-optical conversion efficiency, single-mode performance and Production yield, etc., are very conducive to mass production applications.
Owner:因林光电科技(苏州)有限公司

High speed led optical communication bridge modulator

The invention discloses a high-speed LED optical communication bridge-type modulator, and the modulator comprises a power supply unit, an LED, a switch K101, a switch K102, a switch K103, a switch K104, a switch K105, a control unit, a voltage-limiting constant current control unit, and a constant voltage control unit. The switches K101 and K102 are connected, and the switches K103, K104 and K105 are disconnected. The forwarding power supply of the LED is carried out, thereby enabling the LED to be quickly overshot and connected. The switches K103 and K104 are connected, and the switches K101, K102 and K105 are disconnected. The reverse power supply of the LED is carried out, thereby enabling the LED to be quickly turned off. The control of time sequence controls the time of reverse power supply through the monitoring of a reverse current of the LED, and the reverse power supply is not carried out in the whole disconnection process but in a small time period, so as to prevent band bending from causing the great decrease of radiative recombination rate, and improving the disconnection speed of light. The switch K105 is connected, and the switches K101, K102, K103 and K104 are disconnected. The switch K105 is a discharge circuit which aims at speeding up the recombination of residual carriers of the LED, and controls the forwarding unidirectional discharge of the LED. The modulator improves the recombination speed of carriers, and is high in switching speed.
Owner:NJU OPTOELECTRONICS ENG RES INST CO LTD
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