446results about How to "Improve signal transmission quality" patented technology

A multi-chip package comprising a carrier, at least a package module, an insulation layer and a patterned metallic layer is provided. The package module is mounted onto one of the surfaces of the carrier. The package module has a plurality of stacked chips electrically connected to each other using a flip chip bonding technique. The insulation layer is formed over the surface of the carrier and encloses the package module. The insulation layer has a plurality of via holes linked to the surface of the carrier and the package module. Depth of the via holes in a direction perpendicular to the surface of the carrier is greater than height of the package module in the same direction. The patterned metallic layer is formed over the insulation layer and fills the via holes, serving as interconnecting lines inside the multi-chip package.

A stacked package includes a substrate, a first die, at least one signal transmission plate, at least one second die, a plurality of conductive wires, and a molding compound. The first die is electrically connected with the substrate using flip-chip bonding. The signal transmission plate is provided on the first die and includes an insulating layer, a layout wire layer, and a solder mask layer. The layout wire layer is formed on the insulating layer, and the solder mask layer is formed on the layout wire layer. The solder mask exposes partial area of the layout wire layer at the center and peripheries of the signal transmission plate to form a plurality of die bonding pads and a plurality of wire bonding pads. The second die is electrically connected with the die bonding pads using flip-chip bonding, and the wire bonding pads are electrically connected with the substrate via the conductive wires so that the signals from the second die are transmitted to the substrate. In addition, the molding compound is used to encapsulate the first die, the signal transmission plate, the second die, and the conductive wires.

A grounding electrical connector includes: an inner sleeve, a front end of the inner sleeve having an outer flange, an annular groove being formed on an inner circumference of the outer flange; an outer sleeve coaxially positioned around the inner sleeve; a nut formed with an inner threaded section for locking with a threaded interface connector of an electronic device, the nut further having a receptacle for receiving the outer flange of the inner sleeve therein; and a conductive grounding spring mounted in the annular groove of the inner sleeve and having multiple inner resilient concave sections. When the threaded section of the nut is screwed onto the threaded interface connector of the electronic device, the inner resilient concave sections of the conductive grounding spring are mechanically and electrically connected with a circumference of the threaded interface connector.

A DC power plane structure applied in multi-layer circuit board is provided. The DC power plane structure includes a first circuit area for receiving a DC power, a noise filter with one end electrically connected to a DC power output end of the first circuit area, and a second circuit area which is electrically isolated from the first circuit area. The second circuit area has a band gap structure, and the DC power input end of the band gap structure is electrically connected to the other end of the noise filter for inhibiting high-frequency noise generated between layers of the multi-layer circuit board.

A wireless communication system includes a Central Station (CS) capable of the functions of a Base Station Controller (BSC), and at least one access device controlled by the CS. The CS is connected to the at least one access devices through cables. The access device is adapted to demodulate the downlink wired signals of the CS to downlink Radio Frequency (RF) signals, and send the downlink RF signals to the destination wireless user. The CS is adapted to perform baseband processing, Intermediate Frequency (IF) processing, and RF processing for the data provided by the core network to obtain downlink RF signals, modulate the downlink RF signals to downlink wired signals, and send the downlink wired signals to the access device corresponding to the destination wireless user of the data provided by the core network. A CS, a BS, and two communication methods are disclosed herein.

The invention discloses a method and equipment for optical power debugging, which belong to the field of optical networks. The method comprises the steps of: acquiring a debugging value of an attenuator of a transmitting-end optical amplifier of a wavelength division link, and setting the attenuator of the transmitting-end optical amplifier according to the debugging value; and acquiring a debugging value of an attenuator of a downstream optical amplifier according to a current value of the input total optical power and a target value of the input total optical power of the downstream optical amplifier of the wavelength division link and a current attenuation value of the attenuator of the downstream optical amplifier, and setting the attenuator of the downstream optical amplifier according to the debugging value of the attenuator of the downstream optical amplifier. The equipment comprises a first acquisition module, a first setting module, a second acquisition module and a second setting module. By adopting integral debugging to the optical power in a wavelength division network, the method and the equipment do not need to disconnect optical fibers in the debugging process, realize the automation of the debugging, reduce error rate, and shorten debugging time.

The invention discloses electronic equipment, an MHL (mobile high-definition link) connector, an MHL system and a connector detection method, and belongs to the electronic technical field. The electronic equipment further comprises a first switch controlled by an MHL chip and a second switch controlled by a processor; one end of the first switch is electrically connected with the processor, and the other end of the first switch is electrically connected with a detecting terminal ID (identity) in a USB (universal serial bus) interface; and one end of the second switch is electrically connected with the processor, and the other end of the second switch is electrically connected with the detecting terminal ID in the USB interface. Recognition signals are acquired from the detecting terminal ID according to the first switch and/or the second switch of the electronic equipment, and the MHL method is selected according to the acquired recognition signals to be allowed or forbidden to output audio/video signals, so that the problem that the outputted audio/video signals in poor quality caused by casually using the MHL connector by the electronic equipment is solved, and the audio/video signals are outputted to guarantee signal output quality under the condition that the preset MHL connector is detected.

A liquid crystal display having a repair circuit structure and an array substrate of the liquid crystal display are provided. Each of the repair lines of the repair circuit comprises a front repair line portion arranged to cross with a front data line portion in a substantially perpendicular manner, an end repair line portion arranged to cross with an end data line portion in a substantially perpendicular manner, and an intermediate repair line portion connecting the front and end repair line portions. At least two repair lines in the end repair line portion are positioned in different layers so that a parasitic capacitance between respective repair lines in the repair circuit structure can be reduced and signal transmission quality can be ensured.