84results about How to "Improve sputtering efficiency" patented technology

The invention relates to preparation methods of a gold and silver embedded target and a film thereof. The gold and silver embedded target contains 10-30 percent of gold and 70-90 percent of silver. When the target is prepared, a pure silver target is used for carrying out magnetron sputtering to obtain a sputtering runway, a gold slot is opened, and then gold is embedded into the gold slot by adopting a press method; and when an alloy film is prepared, gold and silver on the runway of the gold and silver embedded target are sputtered under the condition of magnetron sputtering to be mixed and deposited onto a substrate to form a gold and silver alloy film, wherein the magnetron sputtering is carried out under the conditions that the vacuum degree is 1*10<-3> to 5*10<-3>, the sputtering temperature is 20-40 DEG C, the sputtering rate is 20-200nm / minute, and the air pressure is 0.5-1Pa. In the gold and silver embedded target, gold is used for replacing partial silver on a silver target, and the gold and the silver are combined in an embedding mode, so that the utilization ratio of noble metals is high, the target cost is reduced; and the obtained target has the advantages of tight combination, high sputtering efficiency, stable property and good quality; and a prepared gold and silver alloy film has the advantages of stable property and components, higher visible light transmissivity and far infrared reflectivity than those of pure silver films, and better timeliness.

The invention belongs the technical field of metal material processing and microelectronic material manufacturing, and discloses a method for preparing a nickel-vanadium sputtering target material. The method for preparing the nickel-vanadium sputtering target material includes the steps that a nickel-vanadium ingot is sequentially subjected to (1) hot forging, (2) annealing, (3) cold deformation,and (4) secondary annealing. The content of V in the nickel-vanadium sputtering target material is 7 + / - 0.7%, and the purity of the nickel-vanadium ingot is 99.9% to 99.995%. The crystal grain sizeof the obtained nickel-vanadium sputtering target material is less than or equal to150 [mu]m, the crystal grains are fine, and distribution is uniform. The nickel-vanadium sputtering target material has high purity of above 99.9%; the organizational structure is dense without pores, the crystal grains are fine and uniform, the crystal grain size is less than or equal to 150 [mu]m, non-magnetic effect is achieved, the sputtering efficiency is high, and the method can be widely applied to electronic components, communications, solar photovoltaics and other industries.

The invention belongs to the technical field of film plating, in particular to a sputtering plating system for a plastic and rubber pipe. The sputtering plating system comprises a sputtering plating box, a workpiece frame, a motor, a target module, a heater and an automatic cleaning module, wherein the motor is fixedly arranged at the exterior of the sputtering plating box; the workpiece frame ispositioned at the center of the interior of the sputtering plating box, and is driven by the motor to rotate; the target module is arranged at the inner wall of the sputtering plating box, can be moved up and down, and be moved along the transverse direction to get close to the workpiece frame; the automatic cleaning module is used for cleaning the sputtering plating box before sputtering plating;the heater is positioned at the upper end of the inner wall of the sputtering plating box, and is used for drying the cleaned sputtering plating box. The sputtering plating system has the advantagesthat the automatic cleaning module is used for spraying water into the sputtering plating box to clean, so that the efficiency in the whole sputtering plating process of the plastic and rubber pipe isimproved; the motor is used for driving the workpiece frame to rotate, and the sputtering plating of the plastic and rubber pipe is uniform; the target module is moved up and down, or is moved alongthe transverse direction, so as to complete uniform sputtering plating of the plastic and rubber pipe, and improve the sputtering plating quality of the plastic and rubber pipe.

A sputtering target-backing plate assembly obtained by bonding a target material of Mg to a backing plate of Cu—Cr alloy, wherein the target material and the backing plate are bonded via a layer of Ni or an alloy comprising Ni as a main component at the interface therebetween. An object of the present invention is to provide a sputtering target-backing plate assembly that is used when magnesium (Mg) is the sputtering target material, and to resolve problems inherent in magnesium (Mg) and problems related to the selection of a backing plate to be compatible with magnesium by improving the bonding strength between the target and the backing plate in order to improve the sputtering efficiency.

A nickel vanadium alloy magnetron sputtering rotary target containing trace rare earth elements and its preparation method, the chemical composition of the target is 0.002wt~0.05wt%RE, 5~9wt%V, the balance is Ni and unavoidable Impurities. Through vacuum melting, casting, hot forging, hot perforation or hot extrusion into tube shape, cold drawing, annealing, machining and other processes. The raw materials used include electrolytic nickel with a purity of 99.95%, sponge vanadium with a purity of 99.9%, and mixed rare earth elements with a purity of 99.9%. Through vacuum smelting, adding sponge vanadium after electrolytic nickel smelting and refining can significantly improve the oxidation resistance and corrosion resistance of the rotating target, improve the stability and thermal hardness of the target and the sensitivity to material overheating, adding a small amount of Rare earth elements can improve the purity of the material, realize the refinement and uniformity of the microstructure of the target material, help to improve the density and material plasticity of the Ni-V-RE rotating target material, and prolong the service life of the material. The rotating target is widely used in electronic components, communications, solar energy and other industries.