91results about How to "Good pressure characteristics" patented technology

A whole oil tank structure of an airplane comprises a plurality of oil tank inner containers made of composite materials, a front beam, a rear beam, an upper wall board and a lower wall board; the oil tank inner containers are arranged between the upper wall board and the lower wall board; the front beam and the rear beam are connected with the front edges and rear edges of the upper wall board and the lower wall board respectively; adjacent walls among the oil tank inner containers are bonded to structural ribs of a wing; the oil tank inner containers are sealed containers prefabricated through composite materials; and the outer walls of the oil tank inner containers are in bonding curing with the adjacent upper wall board, the lower wall board, the front beam and the rear beam.

An object of the present invention is to provide a thin biaxially oriented film excellent in dimensional stability against humidity change, as well as a magnetic recording medium and a film capacitor using the same. The present invention provides a single layered or laminated biaxially oriented film comprising an aromatic polyester (a) and a polyolefin (b) having a melting point of from 230 to 280° C., wherein the ratio of the polyolefin (b) is from 2 to 60% based on the entire weight of the film, and the film thickness is from 1 to 10 μm.

Provided is an improved cooler-integrated semiconductor module.

A semiconductor module (100) includes a plurality of cooling plates (12), and a plurality of flat-plate semiconductor packages (5) and flat-plate device packages (2). The semiconductor packages (5) each include a semiconductor element housed therein. The device packages (2) each include an electronic component housed therein, the electronic component being different in type from the semiconductor element housed in the semiconductor elements. The cooling plates (12) are laminated alternately with the semiconductor packages (5) or the device packages (2). Connecting tubes (13a, 13b) having refrigerant flowing therein are provided between the cooling plates (12) adjacent to each other.

The invention discloses a method for preventing the short-circuit failure of a high-voltage aluminum-electrolyzing capacitor for a switching power supply, which comprises an optimizing step for an aging working procedure and a step for improving the flash-fire voltage of an electrolyte, wherein the optimizing step for the aging working procedure comprises the following substeps of: in the aging process of a product, aging by adopting a segmented voltage-raising mode, prolonging the aging time step by step after entering a high-voltage stage, and raising the highest aging voltage to be 1.5 times of the working voltage of the capacitor to improve the strength of continuously restoring a dielectric film by the electrolyte; and the step for improving the flash-fire voltage of the electrolyte comprises the following substeps of: adopting a non-water-system electrolyte to decrease the concentration of hydroxyl ions and reduce the generation of oxygen-ion discharge. By optimizing an aging process, the insulating performance of the dielectric film is improved, and the pressure-resisting characteristic of the product is improved; by optimizing electrolyte components, the flash-fire voltage of the electrolyte is improved, and flash-fire breakdown is prevented from occurring when the voltage is excessive; and by optimizing electrolytic paper, the short circuit of the product due to the breakage of the electrolytic paper is prevented.

A metal composite substrate includes a core made of a metal having higher strength than aluminum at elevated temperatures of at least 300° C. and an aluminum or aluminum alloy layer covering an entire surface of the core, and an anodized film is formed at a surface of the aluminum or aluminum alloy layer. The metal composite substrate having the anodized surface film can produce with high efficiency an insulating flexible support by a roll-to-roll process and has good flatness during the high-temperature heat treatment.

An alumina compound sintered compact, having a principal component of alumina, a method of manufacturing the same, and a spark plug employing such an alumina compound sintered compact are disclosed. The alumina compound sintered compact contains alumina, mullite, zircon, zirconia and a specified metal oxide composed of an oxide of at least one element selected from Group III elements excepting Mg, Ca, Sr, Ba and actinoid, wherein the alumina compound sintered compact contains 0.5 to 10 total parts by weight of mullite, zircon and zirconia, 0.5 to 10 parts by weight of the specified metal oxide and a balance of substantially alumina based on 100 parts by weight in total. The spark plug for an internal combustion engine includes a porcelain insulator made of the alumina compound sintered compact.

A cable for high-voltage electronic devices including an inner semiconductive layer, a high-voltage insulator, an outer semiconductive layer, a shielding layer, and a sheath which are provided on an outer periphery of a cable core part in the order mentioned, wherein the high-voltage insulator is made of an insulating composition whose temperature dependence parameter D_R found by the following expression is 1.0 or less: D_R=log R_{23° C.}−log R_{90° C.} (where R_{23° C.} is volume resistivity (Ω·cm) at 23° C. and R_{90° C.} is volume resistivity (Ω·cm) at 90° C.). The cable for high-voltage electronic devices is small in diameter and has an excellent withstand voltage characteristic.

The invention discloses a polypropylene composition. The polypropylene composition includes an ethylene-propylene random elastic copolymer composition composed of an ethylene-propylene random copolymer with a melt index of 0.5 to 5 g/10 min and 0.5 to 10 wt% of ethylene and an ethylene-propylene elastic polymer with 25 to 75 wt% of ethylene and further includes a beta-crystal generating agent. The polypropylene composition has the characteristics of excellent impact resistance and overpressure resistance and is applicable to preparation of pipelines with the characteristics of improved flexibility, impact resistance at low temperature and overpressure resistance at high temperature.

The invention discloses a gallium oxide based hybrid PiN Schottky diode and a preparation method thereof, and relates to the technical field of semiconductor devices. The P-type gallium oxide in the prior art is very difficult to dope, and a sufficiently high doping concentration cannot be achieved in the prior art such that the diode in the prior art cannot adapt to a normal device. A diode of ahybrid PiN Schottky structure achieved by using a method of inserting a p-type oxide semiconductor layer into the surface of a gallium oxide voltage-resistant layer is provided. The method ingeniouslyavoids the p-type doping of a gallium oxide material. The reverse breakdown voltage and leakage current of the diode are both determined by a heterogeneous PN junction. Thus, a good voltage withstandcharacteristic is achieved while a good forward turn-on characteristic is achieved.

The invention discloses a heat-sensitive coating material, a heat-sensitive diaphragm and a preparation method and application of the heat-sensitive diaphragm. The heat-sensitive coating material comprises the following components in percentage by mass: 3%-10% of a polymer binder, 80%-90% of inorganic metal oxide, 0.5%-1% of a dispersing agent and 5%-15% of thermal expansion polymer microspheres.The heat-sensitive coating material provided by the invention comprises a polymer binder, an inorganic metal oxide, a dispersing agent and thermal expansion polymer microspheres. The thermal sensitivediaphragm prepared from the thermal sensitive coating material enables the battery to have high safety performance in the overcharging process, and has good structural stability.

A thin film device includes a thin film element disposed on a surface of a substrate for high voltage formed of a material having an electric resistivity in the range of 10⁸Ω·cm to 10¹⁰Ω·cm, with an adhesive layer in between. The substrate for high voltage is a sintered body containing Al₂O₃, TiC, and MgO in a predetermined weight ratio. Therefore, if electric charges are generated in the thin film element, the electric charges are, while they are not accumulated in large amounts, gradually shifted via the adhesive layer to the substrate for high voltage, so that the generation of ESD can be suppressed. On the other hand, even when mounted on a lead frame, a sufficient dielectric breakdown voltage can be ensured. This provides a thin film device that is less susceptible to damage due to ESD, and has superior withstand voltage characteristic to permit a stable operation.

A substrate for a solar cell, containing a metal substrate and an insulating anodic oxidation film provided on the metal substrate, wherein the thickness T_O of the anodic oxidation film and the thickness T_B of a barrier layer of the anodic oxidation film are inside a region I surrounded by the point A (T_O=0.01 μm, T_B=0.01 μm), the point B (T_O=2 μm, T_B=2 μm), the point C (T_O=100 μm, T_B=2 μm) and the point D (T_O=100 μM, T_B=0.01 μm) shown in FIG. 1 (provided that the region includes its boundary lines); and a solar cell using the same.

The invention provides a broadband transducer and a preparation method thereof. The broadband transducer comprises a potting material (1), a piezoelectric material (2), a filling material (3), a backing material (4), a transducer base (5) and a cable (6), the piezoelectric material (2) comprises an array columns arranged on the bottom surface and the bottom surface, the filling material (3) fillsthe space between the array columns of the piezoelectric materials(2), the bottom surface of the piezoelectric material (2) serves as a radiating surface, the radiating surface of the piezoelectric material (2) is arranged on the backing material (4) outwards, the backing material (4) is connected with the transducer base (5), the cable (6) is connected with a positive electrode and a negative electrode of the piezoelectric material (2), the potting material (1) is used for encapsulating the connected piezoelectric material (2), the filling material (3), the backing material (4) and the transducer base (5). According to the method, the mode that the piezoelectric material is used for cutting and reserving the bottom is adopted, the bottom surface serves as the radiating surface, the effective radiation resistance of the transducer is increased, and the bandwidth and the receiving sensitivity of the transducer are improved.